LIGHT EMITTING DEVICE
First Claim
Patent Images
1. A light emitting device comprising:
- a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer;
a phosphor plate disposed on the second semiconductor layer;
a first electrode portion disposed on the phosphor plate; and
a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure,wherein each bonding portion comprises at least one first bonding portion electrically connected to the first electrode portion.
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Abstract
Disclosed is a light emitting device including a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer, a phosphor plate disposed on the second semiconductor layer, a first electrode portion disposed on the phosphor plate, and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion includes at least one first bonding portion electrically connected to the first electrode portion.
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Citations
20 Claims
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1. A light emitting device comprising:
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a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer; a phosphor plate disposed on the second semiconductor layer; a first electrode portion disposed on the phosphor plate; and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion comprises at least one first bonding portion electrically connected to the first electrode portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A light emitting device package comprising:
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a package body; a first lead frame and a second lead frame disposed on the package body; a light emitting device disposed on the second lead frame; and a resin layer surrounding the light emitting device, wherein the light emitting device comprises; a light emitting structure comprising a first semiconductor layer, an active layer and a second semiconductor layer; a phosphor plate disposed on the second semiconductor layer; a first electrode portion disposed on the phosphor plate; and a plurality of bonding portions disposed between the light emitting structure and the phosphor plate, the bonding portions bonding the phosphor plate to the light emitting structure, wherein each bonding portion comprises at least one first bonding portion electrically connected to the first electrode portion.
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Specification