INTERLAYER DIELECTRIC FOR NON-PLANAR TRANSISTORS
First Claim
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1. A method of fabricating a microelectronic transistor, comprising:
- forming a transistor gate including a gate electrode adjacent a substrate and a pair of gates spacers on opposing sides of the gate electrode;
forming a source/drain region;
forming a first interlayer dielectric material layer adjacent the source/drain region and adjacent at least one gate spacer;
oxidizing the first interlayer dielectric material layer; and
annealing the first interlayer dielectric material layer.
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Abstract
The present description relates the formation of a first level interlayer dielectric material layer within a non-planar transistor, which may be formed by a spin-on coating technique followed by oxidation and annealing. The first level interlayer dielectric material layer may be substantially void free and may exert a tensile strain on the source/drain regions of the non-planar transistor.
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Citations
20 Claims
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1. A method of fabricating a microelectronic transistor, comprising:
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forming a transistor gate including a gate electrode adjacent a substrate and a pair of gates spacers on opposing sides of the gate electrode; forming a source/drain region; forming a first interlayer dielectric material layer adjacent the source/drain region and adjacent at least one gate spacer; oxidizing the first interlayer dielectric material layer; and annealing the first interlayer dielectric material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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forming a sacrificial non-planar transistor gate over a non-planar transistor fin; depositing a dielectric material layer over the sacrificial non-planar transistor gate and the non-planar transistor fin; forming non-planar transistor gate spacers from a portion of the dielectric material layer adjacent the sacrificial non-planar transistor gate; forming a source/drain region; removing the sacrificial non-planar transistor gate to form a gate trench between the non-planar transistor gate spacers and expose a portion of the non-planar transistor fin; forming a gate dielectric adjacent the non-planar transistor fin within the gate trench; depositing conductive gate material within the gate trench; removing a portion of the conductive gate material to form a recess between the non-planar transistor gate spacers; forming a capping dielectric structure within the recess; forming a first interlayer dielectric material layer over the source/drain region, the non-planar transistor gate spacers, and the capping dielectric structure; and oxidizing the first interlayer dielectric material layer; and annealing the first interlayer dielectric material layer. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A microelectronic transistor, comprising:
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a transistor gate including a gate electrode formed adjacent a substrate and a pair of gate spacers disposed on opposing sides of the gate electrode; a source/drain region adjacent the transistor gate; and a first interlayer dielectric material layer formed adjacent the substrate, adjacent the source/drain region, and adjacent at least one gate spacer, wherein the first interlayer dielectric material layer includes a densified portion formed proximate a first surface of the first interlayer dielectric material layer. - View Dependent Claims (18, 19, 20)
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Specification