PACKAGES AND METHODS FOR PACKAGING
First Claim
Patent Images
1. An integrated device package comprising:
- a first housing comprising;
a base and a wall extending from the base, the wall having a distal end portion and a proximal end portion integral with the base; and
a first conductor and a second conductor, the first conductor and the second conductor each extending from the base to the distal end portion of the wall,wherein at least the base, the wall, the first conductor, and the second conductor are monolithically integrated.
1 Assignment
0 Petitions
Accused Products
Abstract
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.
-
Citations
47 Claims
-
1. An integrated device package comprising:
a first housing comprising; a base and a wall extending from the base, the wall having a distal end portion and a proximal end portion integral with the base; and a first conductor and a second conductor, the first conductor and the second conductor each extending from the base to the distal end portion of the wall, wherein at least the base, the wall, the first conductor, and the second conductor are monolithically integrated. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
13. An integrated device package comprising:
-
a housing having a first side and a second side opposite the first side; a first electrical lead formed on an outer surface on the first side of the housing; and a second electrical lead formed on an outer surface on the second side of the housing, wherein the first electrical lead and the second electrical lead are electrically shorted to one another. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
-
- 29. A method for forming an integrated device package, the method comprising forming a first housing by employing a three-dimensional (3D) printing technique to form a non-conductive base having a plurality of integrated horizontal conductors and a non-conductive wall having a plurality of integrated vertical conductors, the wall extending from the base.
-
41. A method for packaging an integrated device comprising:
-
providing a housing having a first side and a second side opposite the first side, wherein a first electrical lead is formed on an outer surface on the first side of the housing and a second electrical lead is formed on an outer surface on the second side of the housing, and wherein the first and second electrical leads are electrically shorted to one another; mounting an integrated device die to the housing; and electrically coupling the integrated device die to the housing. - View Dependent Claims (42, 43, 44, 45, 46, 47)
-
Specification