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PACKAGES AND METHODS FOR PACKAGING

  • US 20140117473A1
  • Filed: 10/26/2012
  • Published: 05/01/2014
  • Est. Priority Date: 10/26/2012
  • Status: Active Grant
First Claim
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1. An integrated device package comprising:

  • a first housing comprising;

    a base and a wall extending from the base, the wall having a distal end portion and a proximal end portion integral with the base; and

    a first conductor and a second conductor, the first conductor and the second conductor each extending from the base to the distal end portion of the wall,wherein at least the base, the wall, the first conductor, and the second conductor are monolithically integrated.

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