HYBRID INTEGRATED COMPONENT

• US 20140117475A1
• Filed: 10/21/2013
• Published: 05/01/2014
• Est. Priority Date: 10/25/2012
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: CLASSEN, Johannes, FREY, Jens, WEBER, Heribert, FISCHER, Frank, WELLNER, Patrick, HATTASS, Mirko, MEISEL, Daniel Christoph, FRANKE, Axel
• Granted Patent: US 9,266,720 B2
• Time in Patent Office: Days
• US Class Current: 257/418
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 1/00246 Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
• CPC Class Codes: B81C 2203/075 the electronic processing unit being integrated into an element of the micromechanical structure
• CPC Class Codes: B81C 2203/0771 Stacking the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Abstract

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

Claims

1. A component, comprising:

at least one MEMS element; and

at least one cap made of a semiconductor material;

wherein the micromechanical structure of the at least one MEMS element is situated in a cavity between a carrier and the at least one cap, and wherein the micromechanical structure includes at least one deflectable structural element which is deflectable out of a component plane within the cavity, and wherein the at least one cap includes at least one section which (i) extends over the entire thickness of the cap, and (ii) is electrically insulated from the adjoining semiconductor material in such a way that the at least one section is electrically contacted independently of remaining sections of the at least one cap.

2. The component as recited in claim 1, wherein the electrical insulation between individual sections of the cap and the adjoining semiconductor material is implemented in the form of trench structures in the semiconductor material, and wherein the trench structures extend over the entire thickness of the cap and are at least partially filled with an electrically insulating material.

3. The component as recited in claim 1, wherein the surface of the cap facing toward the cavity is structured such that the micromechanical structure of the MEMS element is located in the non-deflected state at a defined distance to the at least one electrically insulated section of the cap.

4. The component as recited in claim 1, wherein the at least one electrically insulated section of the cap functions as a mechanical stop for the at least one deflectable structural element.

5. The component as recited in claim 1, wherein the at least one electrically insulated section of the cap functions as an electrode for at least one of (i) a capacitive detection of a deflection of the at least one deflectable structural element and (ii) a capacitive excitation of the at least one deflectable structural element.

6. The component as recited in claim 1, wherein an electrical connection exists between the at least one electrically insulated section of the cap and at least one of the MEMS element and the carrier.

7. The component as recited in claim 1, wherein:

the functionality of the MEMS element is implemented in a layered structure on the carrier;

the layered structure of the MEMS element includes at least one printed conductor layer and at least one functional layer in which the micromechanical structure of the MEMS element having the at least one deflectable structural element is implemented;

the printed conductor layer is insulated from the semiconductor substrate by at least one insulation layer, and the printed conductor layer is insulated from the functional layer by at least one other insulation layer; and

the at least one electrically insulated section of the cap is electrically contacted via the printed conductor layer of the MEMS element.

8. The component as recited in claim 1, wherein:

the micromechanical structure having the at least one deflectable structure element extends over the entire thickness of the MEMS element;

an ASIC element is provided as the carrier on which the MEMS element is installed, such that a gap exists between the deflectable structural element and the surface of the ASIC element; and

the at least one electrically insulated section of the cap is electrically contacted via the ASIC element.

9. The component as recited in claim 1, further comprising:

a capacitor system for at least one of signal detection and excitation of the at least one deflectable structural element;

wherein the deflectable structural element is provided with at least one electrode of the capacitor system;

wherein at least one stationary counter electrode of the capacitor system is implemented on the carrier; and

wherein at least one further stationary counter electrode of the capacitor system is implemented on the cap in at least one electrically insulated section.