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HYBRID INTEGRATED COMPONENT

  • US 20140117475A1
  • Filed: 10/21/2013
  • Published: 05/01/2014
  • Est. Priority Date: 10/25/2012
  • Status: Active Grant
First Claim
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1. A component, comprising:

  • at least one MEMS element; and

    at least one cap made of a semiconductor material;

    wherein the micromechanical structure of the at least one MEMS element is situated in a cavity between a carrier and the at least one cap, and wherein the micromechanical structure includes at least one deflectable structural element which is deflectable out of a component plane within the cavity, and wherein the at least one cap includes at least one section which (i) extends over the entire thickness of the cap, and (ii) is electrically insulated from the adjoining semiconductor material in such a way that the at least one section is electrically contacted independently of remaining sections of the at least one cap.

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