MODULAR CELL ANTENNA APPARATUS AND METHODS

• US 20140118196A1
• Filed: 03/11/2013
• Published: 05/01/2014
• Est. Priority Date: 10/25/2012
• Status: Active Grant

• Current Assignee: Cantor Fitzgerald Securities (Cantor Fitzgerald, L.P.)
• Original Assignee: Pulse Finland Oy (Yageo Corporation)
• Inventors: Koskiniemi, Kimmo
• Granted Patent: US 9,979,078 B2
• Time in Patent Office: Days
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/246 specially adapted for base stations
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H01Q 19/106 using two or more intersecting plane surfaces, e.g. corner reflector antennas
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 21/205 providing an omnidirectional coverage turnstile aerials H01Q21/26

Abstract

Simple, low-cost and modular antenna apparatus and methods associated therewith. In one embodiment, a modular antenna element that can be used either alone or as a basic “building block” for larger arrays and sectorial antennas (i.e., by joining needed number of elements together) is provided. The same parts can be reused for various complete product designs, thereby advantageously reducing the need for customized parts (and the attendant disabilities associated therewith). Moreover, multiple antenna elements can be readily joined together via a common feed network (in one implementation, via the back portion of each element). The antenna gain and beam width are also adjustable through configuration of the array (and the construction of the antenna elements themselves).

Claims

1. An antenna element, comprising:

a cover element having a cavity formed therein;

a main radiating element disposed substantially within the cavity; and

a coupling element configured to at least electrically couple the antenna element to a host radio frequency device.

2. The antenna element of claim 1, further comprising a parasitic radiating element formed substantially on or within the cover element.

3. The antenna element of claim 2, wherein the parasitic radiating element comprises a laser direct structured (LDS) element formed on an exterior surface of the cover element.

4. The antenna element of claim 3, further comprising an out layer disposed over the exterior surface and at least a portion of the parasitic radiating element, the outer layer selected so as to not substantially degrade the electrical performance of at least the parasitic element.

5. The antenna element of claim 1, further comprising:

a back housing element configured to cooperate with the cover element so as to substantially enclose the cavity; and

a ground plane disposed on the back housing.

6. The antenna element of claim 1, wherein the coupling element is further configured to enable mechanical coupling of the antenna element to a substrate of the host radio frequency device.

7. The antenna element of claim 2, wherein the antenna element comprises a substantially modular construction that is configured to enable the antenna element to be mated with at least one other similar or identical antenna element so as to form an array.

9. The antenna array of claim 7, wherein the array comprises the plurality of antenna elements arranged in a substantially planar array.

10. The antenna array of claim 7, wherein the array comprises the plurality of antenna elements arranged in a substantially three-sector radial array.

11. The antenna array of claim 7, further comprising a circuit board disposed proximate each of the antenna elements, the circuit board further comprising at least one radio frequency transceiver configured to provide a radio frequency signal to the feed network so as to drive each of the individual antenna elements.

12. The antenna array of claim 7, wherein at least one of the plurality of antenna elements further comprises a parasitic radiating element formed substantially on or within the cover element.

13. The antenna array of claim 12, wherein at least one of the plurality of antenna elements further comprises an out layer disposed over the exterior surface and at least a portion of the parasitic radiating element, the outer layer selected so as to not substantially degrade the electrical performance of at least the parasitic element.

14. The antenna array of claim 13, wherein at least one of the antenna elements further comprises:

a back housing element configured to cooperate with the cover element so as to substantially enclose the cavity; and

a ground plane disposed on the back housing.

15. The antenna array of claim 13, wherein at least one of the antenna elements comprises a first conductive region that has been deposited on the antenna element by a laser-direct structuring (LDS) process, and a second conductive region that has been deposited using a printing process.

8. An antenna array, comprising:

a plurality of modular antenna elements each comprising;

a cover element having a cavity formed therein;

a main radiating element disposed substantially within the cavity; and

a coupling element configured to at least electrically couple the antenna element to a host radio frequency device; and

a feed structure configured to commonly feed each of the antenna elements.

16. A method of manufacturing a low-cost, simplified antenna element, the method comprising:

forming a front cover element and a rear cover element, at least one of the front and rear covers being formed using first and second types of material;

activating relevant portions of at least one of the front and rear covers containing the first type of material;

utilizing an electroless process so as to accrete a plurality of conductive elements on the activated portions;

disposing a ground plane onto the back cover element;

disposing a main radiator element on the back cover element;

affixing a feed conductor to at least one of the accreted conductive elements; and

joining the front and rear cover elements.

17. The method of claim 16, wherein the forming comprises using a two-shot injection molding process.

18. The method of claim 16, wherein the activating comprises exposure using a laser, and the electroless process comprises at least portions of a laser direct structuring process.

19. The method of claim 16, wherein the disposing a ground plane comprises screen printing the ground plane.

20. An antenna element, comprising:

a cover element having a cavity formed therein;

a back housing element configured to cooperate with the cover element so as to substantially enclose the cavity;

a main radiating element disposed substantially within the cavity;

a coupling element configured to at least electrically couple the antenna element to a host radio frequency device;

a laser direct structured (LDS) parasitic radiating element formed on an exterior surface of the cover element; and

a ground plane disposed on the back housing;

wherein the coupling element is further configured to enable mechanical coupling of the antenna element to a substrate of the host radio frequency device; and

wherein the antenna element comprises a substantially modular construction that is configured to enable the antenna element to be mated with at least one other similar or identical antenna element so as to form an array.