THINFILM STACKS FOR LIGHT MODULATING DISPLAYS

• US 20140118360A1
• Filed: 10/30/2012
• Published: 05/01/2014
• Est. Priority Date: 10/30/2012
• Status: Abandoned Application

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Pixtronix, Incorporated (Qualcomm, Inc.)
• Inventors: Ma, Jian J., Hong, John H., Chang, Tallis Y., Lee, Chong U.
• Application Number:
  US13/664,276
• Publication Number:
  US 20140118360A1
• Time in Patent Office: Days
• US Class Current: 345/501
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26
• CPC Class Codes: G02B 5/22 Absorbing filters G02B5/201 - G02B5/208 take precedence
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

This disclosure provides systems, methods and apparatus for absorption film stacks. In one aspect, the absorption film stack is an interferometric absorption film stack that, for a selected wavelength of light, reduces light reflected from a surface of the stack by setting up a standing wave within the stack of materials. In some implementations, an absorbing layer may be placed at the peak of the standing wave interference pattern. The absorbing layer can be implemented to absorb selected wavelengths of light and substantially reduce the amount of unwanted reflections. In some other implementations, a reflective surface may be formed on the surface of the stack opposite the absorbing layer.

Claims

1. A device, comprising

a substrate layer disposed proximate a light source and having

an aperture to allow light to pass through the substrate layer, and

an absorption film stack including:

a layer of light reflecting material,

a layer of light absorbing material disposed on the layer of light reflecting material and being spaced a fixed distance from the layer of light reflecting material, and

an interferometric absorption film stack, including;

a layer of a dielectric material of a first refractive index, and a layer of dielectric material of a second refractive index,

the thicknesses of the layers of dielectric material being selected to cause light reflected from the interferometric absorption film stack to interfere with light incident on the interferometric absorption film stack and have an interference standing wave with a peak amplitude occurring at the layer of light absorbing material.

2. The device of claim 1, wherein the layer of dielectric material of a first refractive index, and the layer of dielectric material of a second refractive index are selected to reduce reflection of light incident at an angle between 0°

and 50°

to an axis normal to the surface of the interferometric absorption film stack.

3. The device of claim 1, wherein the fixed distance arranges the layer of absorbing material at a location of a substantially peak amplitude of the interference standing wave in the absorption film stack.

4. The device of claim 1, further including a spacing layer of transmissive material disposed between the layer of light reflecting material and the layer of absorbing material.

5. The device of claim 4, wherein the spacing layer has a thickness for spacing the absorbing layer the fixed distance from the layer of light reflecting material.

6. The device of claim 1, wherein the layer of light reflecting material includes a layer of metal having a reflectance greater than 70% through a spectrum for visible light.

7. The device of claim 1, wherein the layer of light reflecting material includes a layer selected from the group of aluminum (Al), chromium (Cr), molybdenum (Mo), nickel (Ni), tantalum (Ta) and silver (Ag).

8. The device of claim 1, further comprising a transparent conductive layer disposed on the interferometric absorption film stack.

9. The device of claim 1, further comprising a reflective film disposed on a surface of the layer of light reflecting material opposite the light absorbing material.

10. The device of claim 9, wherein the reflective film includes a dielectric thin film stack having a first material with a first refractive index and a second material with a second refractive index, the first material and the second material having a respective thickness of about a quarter wavelength of light from the light source.

11. The device of claim 1, further comprising a layer of fluid disposed over the interferometric absorption film stack.

12. The device of claim 1, wherein the light source includes a light source or plurality of light sources transmitting light at different wavelength spectrums centered respectively at colors red, green and blue (RGB).

13. The device of claim 12, wherein the layer of dielectric material of a first refractive index has a thickness of about 34 nm and the layer of dielectric material of a second refractive index has a thickness of about 15 nm.

14. The device of claim 1, wherein the layer of dielectric material of a first refractive index includes silicon dioxide (SiO₂) and the layer of dielectric material of a second refractive index includes titanium dioxide (TiO₂).

15. The device of claim 1, wherein the substrate layer includes a movable shutter for blocking or passing light from the aperture.

16. The devices of claim 1, further comprising:

a processor that is configured to communicate with the display, the processor being configured to process image data; and

a memory device that is configured to communicate with the processor.

17. The device of claim 16, further comprising:

a driver circuit configured to send at least one signal to the display; and

a controller configured to send at least a portion of the image data to the driver circuit.

18. The device of claim 16, further comprising:

an image source module configured to send the image data to the processor, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

19. The device of claim 16, further comprising:

an input device configured to receive input data and to communicate the input data to the processor.

20. A method of manufacturing, comprising:

providing a layer of light reflecting material, and

forming over the layer of light reflecting material, a light absorbing film having;

a layer of light absorbing material, and

a first layer of material with a first index of refraction and a first thickness of about 25 to 40 nm and a second layer of material with a second index of refraction and a second thickness of about 10 nm to 20 nm, the respective thicknesses of the first and second layers being selected to provide interferometric attenuation of light within a selected range of wavelengths and at an angle of incidence more than about 30°

to an axis normal to the absorbing film.

21. The method of claim 20, further comprising arranging the layer of absorbing material at a location of a substantially peak amplitude of a standing wave formed by the interferometric attenuation.

22. The method of claim 20, further including:

providing a spacing layer of transmissive material between the light reflecting layer and the layer of absorbing material and having a thickness selected to space the layer of absorbing material from the light reflecting layer about a quarter wavelength of light reflected from the light reflecting layer.

23. The method of claim 20, further comprising:

forming between the substrate and the light absorbing film, a film stack having;

a first material with a first refractive index and a second material with a second refractive index, the first material and the second material having respective thicknesses of about a quarter wavelength of light to be reflected.

24. The method of claim 23, wherein the first material has a thickness of between about 80 nm to about 110 nm and the second material has a thickness of between about 50 nm and about 65 nm.

25. The method of claim 23, wherein the first material includes silicon dioxide (SiO₂) and the second material includes titanium dioxide (TiO₂).

26. The method of claim 20, wherein the layer of light reflecting material is a layer of metal.

27. The method of claim 20, wherein forming the first layer of material includes,

depositing the first layer using a process selected from the group consisting of chemical vapor deposition, physical vapor deposition, plasma-enhanced chemical vapor deposition, thermal chemical vapor deposition (thermal CVD), and spin-coating.

28. The method of claim 20, wherein providing a layer of light reflecting material includes

providing a shutter movable from a first position to a second position and having a surface with a layer of light reflecting material.

29. The method of claim 28, wherein forming the light absorbing film, includes

forming the light absorbing film over the layer of light reflecting material of the shutter.

30. A thin film stack, comprising

a substrate layer having an aperture to allow light to pass through the substrate layer and being disposed proximate a light source of a first wavelength, and including

a layer of light reflecting material having a first side and a second side,

an interferometric absorption stack disposed on the second side of the layer of light reflecting material and having two layers of dielectric material with thicknesses and refractive indices selected to reduce a reflectivity of light incident at angles 0°

to 50° and

propagating at the first wavelength, and

a high reflectance stack disposed on the first side of the layer of light reflecting material and having one or more than one paired layers of dielectric material with thicknesses and refractive indices selected to achieve photopically weighted reflectivity of greater than 90% for light incident at angles between 0°

to 50° and

propagating at the first wavelength.

31. The thin film stack of claim 30, wherein the substrate layer includes a layer of photopically transparent material.

32. The thin film stack of claim 30, further including

a shutter disposed proximate the aperture and movable across the aperture for passing and blocking light passing through the aperture to provide a pixel within an image.

33. The thin film stack of claim 30, wherein the light source includes a plurality of light sources generating light at different respective wavelengths.

34. The thin film stack of claim 33, wherein the interferometric absorption stack includes two layers of dielectric material with thicknesses and refractive indices selected to reduce a photopically weighted reflectivity of light propagating at the different respective wavelengths.

35. The display of claim 33, wherein the high reflectance stack includes one or more paired layers of dielectric material with thicknesses and refractive indices selected to achieve a photopically weighted reflectivity of greater than 95% for light propagating at the different respective wavelengths.