COOLING APPARATUS FOR AN ELECTRICAL SUBSTRATE

• US 20140118932A1
• Filed: 10/31/2012
• Published: 05/01/2014
• Est. Priority Date: 10/31/2012
• Status: Active Grant

• Current Assignee: Deere & Company
• Original Assignee: Deere & Company
• Inventors: HARMELINK, GREGORY K., SCHMIT, CHRISTOPHER J.
• Granted Patent: US 8,867,210 B2
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate.

Claims

1. A cooling apparatus comprising:

a first outer portion comprising a fluid inlet, a first exterior cooling surface, and a first fluid-diverting structure in fluid communication with the fluid inlet;

a second outer portion comprising a fluid outlet, a second exterior cooling surface, and a second fluid-diverting structure in fluid communication with the fluid outlet;

an electrical substrate coupled to at least one of the first exterior cooling surface and the second exterior cooling surface; and

an intermediate portion in a facing relationship with the first outer portion and the second outer portion, the intermediate portion defining an aperture for transferring a fluid between a first cavity and a second cavity, the first cavity defined between the first outer portion and the intermediate portion, the second cavity defined between the second outer portion and the intermediate portion;

wherein the fluid is capable of being conveyed through the fluid inlet, the first fluid-diverting structure, the first cavity, the aperture, the second cavity, the second fluid-diverting structure, and the fluid outlet, to dissipate heat from the electrical substrate.

2. The cooling apparatus of claim 1, wherein the intermediate portion comprises a generally planar gasket, wherein the aperture is centrally disposed.

3. The cooling apparatus of claim 1, wherein the first fluid-diverting structure defines a first spiral fluid path configured to divert the fluid in a generally spiral pattern to the aperture and the second fluid-diverting structure defines a second spiral fluid path configured to divert the fluid in a generally spiral pattern to the fluid outlet.

4. The cooling apparatus of claim 3, wherein the first spiral fluid path is defined, partially or completely, by a curved wall and the second spiral fluid path is defined, partially or completely, by a curved wall.

5. The cooling apparatus of claim 1, wherein the electrical substrate comprises a first inner electrical substrate coupled to the first exterior cooling surface.

6. The cooling apparatus of claim 5, further comprising a first spacer coupled to the first inner electrical substrate and a first outer electrical substrate coupled to the first spacer.

7. The cooling apparatus of claim 1, wherein the electrical substrate comprises a second inner electrical substrate coupled to the second exterior cooling surface.

8. The cooling apparatus of claim 7, further comprising a second spacer coupled to the second inner electrical substrate and a second outer electrical substrate coupled to the second spacer.

9. The cooling apparatus of claim 1, further comprising a support structure configured to support the first outer portion and the second outer portion.

10. The cooling apparatus of claim 9, wherein the support structure comprises a terminal and defines a conductor strain relief structure, the terminal configured to receive a conductor that is in electrical communication with the electrical substrate, the conductor strain relief structure configured to reduce strain on the conductor.

11. The cooling apparatus of claim 1, wherein the first fluid-diverting structure and the second fluid-diverting structure comprise a flow diverter configured to facilitate heat transfer with the fluid.

12. An electronic apparatus comprising:

a first outer portion comprising a fluid inlet, a first exterior cooling surface, and a first fluid-diverting structure in fluid communication with the fluid inlet;

a first inner electrical substrate coupled to the first exterior cooling surface;

a second outer portion comprising a fluid outlet, a second exterior cooling surface, and a second fluid-diverting structure in fluid communication with the fluid outlet;

a second inner electrical substrate coupled to the second exterior cooling surface; and

an intermediate portion in a facing relationship with the first outer portion and the second outer portion, the intermediate portion defining an aperture for transferring a fluid between a first cavity and a second cavity, the first cavity defined between the first outer portion and the intermediate portion, the second cavity defined between the second outer portion and the intermediate portion;

wherein the fluid is capable of being conveyed through the fluid inlet, the first fluid-diverting structure, the first cavity, the aperture, the second cavity, the second fluid-diverting structure, and the fluid outlet, to dissipate heat from the first exterior cooling surface and the second exterior cooling surface.

13. The electronic apparatus of claim 12, wherein the first inner electrical substrate and the second inner electrical substrate each comprise a metal layer that contacts the first exterior cooling surface and second exterior cooling surface, respectively, to facilitate heat transfer.

14. The electronic apparatus of claim 12, further comprising a thermally-conductive adhesive applied between the first inner electrical substrate and the first exterior cooling surface and between the second inner electrical substrate and the second exterior cooling surface to facilitate heat transfer and to adhesively bond the first and second inner electrical substrates to the respective first and second exterior cooling surfaces.

15. The electronic apparatus of claim 12, further comprising a spacer applied between the first inner electrical substrate and the first exterior cooling surface and between the second inner electrical substrate and the second exterior cooling surface to facilitate heat transfer.

16. The electronic apparatus of claim 15, wherein the spacer comprises a metal.

17. The electronic apparatus of claim 12, wherein the intermediate portion comprises a generally planar gasket.

18. The electronic apparatus of claim 12, wherein the first fluid-diverting structure defines a first spiral fluid path configured to divert the fluid in a generally spiral pattern to the aperture and the second fluid-diverting structure defines a second spiral fluid path configured to divert the fluid in a generally spiral pattern to the fluid outlet.

19. The electronic apparatus of claim 12, further comprising a support structure configured to support the first outer portion and the second outer portion.

20. A method for cooling an electrical substrate, the method comprising:

directing a flow of fluid through a fluid inlet of a first outer portion;

diverting the flow of fluid through a first fluid-diverting structure of the first outer portion to dissipate heat from a first inner electrical substrate coupled to a first exterior cooling surface of the first outer portion;

directing the flow of fluid through a first cavity defined between the first outer portion and an intermediate portion;

transferring the flow of fluid from the first cavity through an aperture defined by the intermediate portion to a second cavity defined between a second outer portion and the intermediate portion;

diverting the flow of fluid through a second fluid-diverting structure of the second outer portion to dissipate heat from a second inner electrical substrate coupled to a second exterior cooling surface of the second outer portion; and

directing the flow of fluid through a fluid outlet of the second outer portion.