HIGH-ASPECT RATIO SCREEN PRINTABLE THICK FILM PASTE COMPOSITIONS CONTAINING WAX THIXOTROPES
First Claim
Patent Images
1. A metallic paste, comprising:
- greater than 50% by weight electrically conductive metal particles;
an amide-based wax having a melting point greater than 110°
C.;
glass frit;
a solvent; and
a resin;
wherein;
the metallic paste has a viscosity of 50 to 250 Pa s at 10 sec″
1 at 25°
C. and a shear-thinning index of at least 10 or a recovery time less than 10 seconds or both.
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Abstract
Provided are high-aspect ratio printable thick film metal paste compositions that can be deposited onto a substrate using, for example, screening printing techniques; and methods of preparing and using thick film printable metal pastes; and methods of screen printing of the thick film metal paste compositions onto a substrate to produce printed circuits, conductive lines or features on the substrate and/or a conductive surface on a solar cell device. Also provided are printed substrates containing an electronic feature produced by the high-aspect ratio printable thick film metal paste compositions.
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Citations
34 Claims
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1. A metallic paste, comprising:
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greater than 50% by weight electrically conductive metal particles; an amide-based wax having a melting point greater than 110°
C.;glass frit; a solvent; and a resin; wherein; the metallic paste has a viscosity of 50 to 250 Pa s at 10 sec″
1 at 25°
C. and a shear-thinning index of at least 10 or a recovery time less than 10 seconds or both. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34-47. -47. (canceled)
Specification