PROBE CARD AND METHOD OF MANUFACTURING THE SAME

• US 20140125372A1
• Filed: 10/28/2013
• Published: 05/08/2014
• Est. Priority Date: 11/05/2012
• Status: Active Grant

• Current Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Original Assignee: Shinko Electric Industries Company Limited (Fujitsu Limited)
• Inventors: FUKASAWA, Ryo, HORIUCHI, Michio, TOKUTAKE, Yasue, MATSUDA, Yuichi, AIZAWA, Mitsuhiro
• Granted Patent: US 9,488,677 B2
• Time in Patent Office: Days
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.

Claims

1. A probe card, comprising:

a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on a periphery of the opening portion;

a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity;

a contact terminal arranged to protrude from a lower face of the resin portion; and

a wire buried in the resin portion and connecting the contact terminal and the connection pad,

wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire.

2. The probe card according to claim 1, wherein the resin portion protrudes from a lower face of the wiring substrate.

3. The probe card according to claim 1, wherein the wire is a coaxial-type wire in which a resin layer and a metal layer are covered on an outer face of a metal wire.

4. The probe card according to claim 1, wherein a contact face of a tip of the contact terminal is formed as a flat face.

5. The probe card according to claim 4, wherein the contact terminal includes a columnar contact portion protruding from the lower face of the resin portion, and a convex portion wider than the columnar contact portion, the convex portion which is arranged on the columnar contact portion and is buried in the resin portion.

6. The probe card according to claim 4, wherein the contact terminal includes a columnar contact portion protruding from the lower face of the resin portion, and a convex portion wider than the columnar contact portion, the convex portion which is arranged on the columnar contact portion and is buried in the resin portion, and a constricted portion that is recessed inward in an annular part between the contact portion and the convex portion.

7. The probe card according to claim 1, wherein an electric measurement is performed by touching two adjacent said contact terminals to one electrode pad of a test object.

8. The probe card according to claim 1, wherein an electric measurement is performed by touching one said contact terminal in which two said wires are connected to one electrode pad of a test object.