MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF

• US 20140126110A1
• Filed: 12/14/2012
• Published: 05/08/2014
• Est. Priority Date: 11/06/2012
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Jae Yeol, Kim, Doo Young, Lee, Jong Ho, Kim, Yu Na, Kim, Sung Woo, Kim, Eung Soo
• Granted Patent: US 8,964,355 B2
• Time in Patent Office: Days
• US Class Current: 361/321.2
• CPC Class Codes: H01G 4/005 Electrodes
• CPC Class Codes: H01G 4/12 Ceramic dielectrics H01G4/085 takes precedence
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: Y10T 29/43 Electric condenser making

Abstract

There are provided a multilayer ceramic capacitor and a manufacturing method thereof, the multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes; first and second external electrodes; and a first insulating layer

Claims

1. A multilayer ceramic capacitor comprising:

a ceramic body;

first and second internal electrodes including first and second lead portions having regions overlapped with each other and exposed to one surface of the ceramic body, respectively;

first and second external electrodes including first and second lead connection portions formed on the one surface of the ceramic body and connected to the first and second lead portions, respectively, and first and second external terminal portions formed to extended from one ends of the first and second lead connection portions to a surface perpendicular to the one surface of the ceramic body to which the first and second lead portions are exposed to thereby be exposed to the outside, respectively; and

a first insulating layer formed on the one surface of the ceramic body so as to cover the first and second lead portions and the first and second lead connection portions that are exposed to the one surface of the ceramic body.

2. The multilayer ceramic capacitor of claim 1, wherein the first and second internal electrodes are horizontally disposed with respect to the surface of the ceramic body on which the first and second external terminal portions are formed.

3. The multilayer ceramic capacitor of claim 1, wherein the first lead connection portion is connected to a region of the first lead portion that is not overlapped with the second lead portion, and the second lead connection portion is connected to a region of the second lead portion that is not overlapped with the first lead portion.

4. The multilayer ceramic capacitor of claim 1, wherein the first insulating layer is formed to cover all of the first and second lead portions and the first and second lead connection portions.

5. The multilayer ceramic capacitor of claim 1, wherein the first and second external electrodes further include third and fourth external terminal portions extended from the other ends of the first and second lead connection portions to a surface opposing the surface of the ceramic body on which the first and second external terminal portions are formed to thereby be exposed to the outside, respectively.

6. The multilayer ceramic capacitor of claim 1, wherein in the first internal electrode, the first lead portion includes a plurality of first lead portions exposed to the one surface of the ceramic body and respectively have regions overlapped with the second lead portion, and the first external electrode includes a plurality of first external electrodes connected to the plurality of first lead portions.

7. The multilayer ceramic capacitor of claim 1, wherein the first and second internal electrodes include third and fourth lead portions exposed to the other surface opposing the one surface of the ceramic body, respectively, and the third and fourth lead portions have regions overlapped with each other.

8. The multilayer ceramic capacitor of claim 7, wherein the first and second external electrodes further include third and fourth lead connection portions formed on the other surface opposing the one surface of the ceramic body, connected to the third and fourth lead portions, and connected to one ends of the first and second external terminal portions, respectively.

9. The multilayer ceramic capacitor of claim 8, wherein the third lead connection portion is connected to a region of the third lead portion that is not overlapped with the fourth lead portion and the fourth lead connection portion is connected to a region of the fourth lead portion that is not overlapped with the third lead portion.

10. The multilayer ceramic capacitor of claim 8, further comprising a second insulating layer formed on the other surface opposing the one surface of the ceramic body and covering the third and fourth lead portions and the third and fourth lead connection portions that are exposed to the other surface of the ceramic body.

11. The multilayer ceramic capacitor of claim 10, wherein the second insulating layer is formed to cover all of the third and fourth lead portions and the third and fourth lead connection portions.

12. A manufacturing method of a multilayer ceramic capacitor, the manufacturing method comprising:

forming a first internal electrode on a first ceramic sheet such that a first lead portion is exposed through one end surface of the first ceramic sheet;

forming a second internal electrode on a second ceramic sheet such that a second lead portion is exposed through one end surface of the second ceramic sheet while having regions overlapped with the first lead portion;

forming a ceramic body by alternately stacking and firing a plurality of the first and second ceramic sheets on which the first and second internal electrodes are formed;

forming first and second lead connection portions on one surface of the ceramic body so as to be connected to the first and second lead portions, respectively;

forming first and second external terminal portions extended from one ends of the first and second lead connection portions and exposed to the outside on a surface perpendicular to the one surface of the ceramic body to which the first and second lead portions are exposed; and

forming a first insulating layer on the one surface of the ceramic body so as to cover the first and second lead portions and the first and second lead connection portions.

13. The method of claim 12, wherein in the forming of the first and second lead connection portions, the first lead connection portion is formed in a direction in which the first and second ceramic sheets are stacked in a region of the first lead portion that is not overlapped with the second lead portion on the one surface of the ceramic body, while the second lead connection portion is formed in the direction in which the first and second ceramic sheets are stacked in a region of the second lead portion that is not overlapped with the first lead portion on the one surface of the ceramic body.

14. The method of claim 12, wherein the forming of the first insulating layer is performed by applying a ceramic slurry to the one surface of the ceramic body so as to cover all of the first and second lead portions and the first and second lead connection portions.

15. The method of claim 12, further comprising forming third and fourth external terminal portions extended from the other end of the first and second lead connection portions to be exposed to the outside on a surface opposing the surface on which the first and second external terminal portions are formed, after the forming of the first and second external terminal portions.

16. The method of claim 12, wherein in the forming of the first internal electrode, the first lead portion may be provided in plural and the plurality of first lead portions are formed to be exposed through the one end surface of the first ceramic sheet and respectively have regions overlapped with the second lead portion, and

in the forming of the first lead connection portion and the first external terminal portion, the first lead connection portion and the first external terminal portion are respectively provided in plural and the plurality of first lead connection portions and first external terminal portions are connected to the plurality of first lead portions.

17. The method of claim 12, wherein in the forming of the first and second internal electrodes, third and fourth lead portions exposed through the other end surface opposing the one end surface of the first and second ceramic sheets are further formed, respectively, and the third and fourth lead portions have regions overlapped with each other.

18. The method of claim 17, further comprising forming third and fourth lead connection portions connected to the third and fourth lead portions and one ends of the first and second external terminal portions, respectively, on the other surface opposing the one surface of the ceramic body, after the forming of the first and second lead portions.

19. The method of claim 18, wherein in the forming of the third and fourth lead connection portions, the third lead connection portion is formed in a direction in which the first and second ceramic sheets are stacked in a region of the third lead portion that is not overlapped with the fourth lead portion on the other surface of the ceramic body, while the fourth lead connection portion is formed in the direction in which the first and second ceramic sheets are stacked in a region of the fourth lead portion that is not overlapped with the third lead portion on the other surface of the ceramic body.

20. The method of claim 18, further comprising forming a second insulating layer on the other surface opposing the one surface of the ceramic body by applying a ceramic slurry so as to cover all of the third and fourth lead portions and the third and fourth lead connection portions, after the forming of the first insulating layer.

21. The method of claim 20, wherein the first and second insulating layers are formed by a BMP method.