CIRCUIT COMPRISING A COMPONENT COVERED WITH A LID, METHOD FOR PRODUCING SUCH A CIRCUIT, AND DEVICE FOR IMPLEMENTING SAID METHOD

• US 20140130966A1
• Filed: 12/08/2011
• Published: 05/15/2014
• Est. Priority Date: 12/08/2010
• Status: Abandoned Application

• Current Assignee: KFM Technology
• Original Assignee: KFM Technology
• Inventors: Brault, Sebastien, Verjus, Fabrice, Dufour-Gergam, Elisabeth, Desgeorges, Martiel
• Application Number:
  US13/992,510
• Publication Number:
  US 20140130966A1
• Time in Patent Office: Days
• US Class Current: 156/228
• CPC Class Codes: B29C 65/48 using adhesives , i.e. using supplementary joining material; solvent bonding
• CPC Class Codes: B29C 66/001 Joining in special atmospheres
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81C 1/00301 Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate

Abstract

The invention relates to an electronic circuit (1) consisting of a substrate (10) having a surface on which at least one component (3) covered with a lid (22) is mounted. Said component comprises first connection means (15) to be connected to second connection means (70). In said circuit (1), at least one connection passage (50) is provided that extends through the lid in order to link the first connection means (15) to the outside of the lid, which then makes it possible to link the first means to the second connection means (70) (see FIG. 2). The invention can be used for the production of microsystems that require the encapsulation of some components.

Claims

1. Electronic circuit consisting of a substrate (10) with at least one face on which at least one component (3) is mounted with which first connection means (15) are linked, and at least one lid (22) having a thin structure resting on said substrate (10) in order to cover said component (3), characterized in that at least one connection passage (50) is provided in order to connect said first connection means (15) outside said lid (22).

2. Electronic circuit according to claim 1, comprising second connection means (70) located outside said lid, characterized in that electrical connections (50, 50′

, 51, 51′

, 80, 81) are provided for connecting said first connection means (15) with second connection means (70) by passing through said lid (22) using said connection passages.

3. Electronic circuit according to claim 1 or 2, characterized in that the connection passages (50, 50′

, 51, 51′

) are formed by the connection passages constituted by metalized rivets (50, 50′

, 51, 51′

).

4. Electronic circuit according to claim 1, characterized in that a lid of a first type is provided for certain components, formed by a hollow portion (23) in order to surround said component, and a corolla (24) surrounding said hollow portion and resting on said substrate.

5. Electronic circuit according to claim 1, characterized in that it comprises a lid of a second type for other components formed by a plate (22A) comprising a wall (22B) resting on said substrate (10).

6. Electronic circuit according to claim 4, for which the lid (22) is attached to said substrate by means of a weld bead (40) placed between the corolla (24) and the substrate (10), characterized in that, to produce an electrical connection in order to connect the first (15) and second connection means (70), arranged on the corolla (24), on each side of the weld bead (40), are a first passage connection formed by a metalized rivet (50, 51) at the first connection means (15), and a second passage connection formed by a metalized rivet (50′

, 51′

) at the second connection means (70), and in that said electrical connection comprises connection bridges (80, 81) connecting the first and second passage connections.

7. Electronic circuit according to claim 5, characterized in that said wall (22B) at least partially forms a weld bead and in that, to produce an electrical connection in order to connect the first and second connection means, arranged on the corolla (24), on each side of the weld bead (40), are a first passage connection formed by a metalized rivet (50, 51) at the first connection means (15), and a second passage connection formed by a metalized rivet (50′

, 51′

) at the second connection means (70), and in that said electrical connection comprises connection bridges (80, 81) connecting the first and second passage connections.

8. Electronic circuit according to claim 1, characterized in that lids can be arranged on both faces of said substrate.

9. Method for producing a circuit according to claim 6, characterized in that it comprises the following steps:

arranging, on a substrate, elements (3) of said circuit, of which at least one requires a lid (22),

creating a mold (20) on which said lid (22) is inserted with said connection passages (50, 51) and with said weld bead (40),

placing said mold opposite said substrate,

melting said bead,

separating said mold from said substrate.

10. Device for applying said method according to claim 9, characterized in that it comprises a chamber (150) in which said method is applied, and an atmosphere device (155) for creating the required atmosphere inside said chamber.

11. Method for producing a circuit according claim 7, characterized in that it comprises the following steps:

arranging, on a substrate, elements (3) of said circuit, of which at least one requires a lid (22),

creating a mold (20) on which said lid (22) is inserted with said connection passages (50, 51) and with said weld bead (40),

placing said mold opposite said substrate,

melting said bead,

separating said mold from said substrate.

12. Device for applying said method according to claim 11, characterized in that it comprises a chamber (150) in which said method is applied, and an atmosphere device (155) for creating the required atmosphere inside said chamber.