GAN VERTICAL BIPOLAR TRANSISTOR
First Claim
1. A method for fabricating a vertical bipolar transistor, the method comprising:
- providing a III-nitride base structure of a first conductivity type;
forming a III-nitride emitter structure of a second conductivity type having a first surface and a second surface, the second surface being substantially opposite the first surface, wherein;
the first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure;
a first dielectric layer is coupled to the second surface of the III-nitride emitter structure; and
the III-nitride emitter structure has a sidewall adjacent to an exposed portion of the surface of the III-nitride base structure;
forming a spacer coupled to the sidewall of the III-nitride emitter structure and the exposed portion of the surface of the III-nitride base structure; and
forming a base contact structure comprising a III-nitride material coupled to the spacer, the exposed portion of the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure.
10 Assignments
0 Petitions
Accused Products
Abstract
An embodiment of a semiconductor device includes a III-nitride base structure of a first conductivity type, and a III-nitride emitter structure of a second conductivity type having a first surface and a second surface. The second surface is substantially opposite the first surface. The first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure. The semiconductor also includes a first dielectric layer coupled to the second surface of the III-nitride emitter structure, and a spacer coupled to a sidewall of the III-nitride emitter structure and the surface of the III-nitride base structure. The semiconductor also includes a base contact structure with a III-nitride material coupled to the spacer, the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure.
4 Citations
21 Claims
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1. A method for fabricating a vertical bipolar transistor, the method comprising:
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providing a III-nitride base structure of a first conductivity type; forming a III-nitride emitter structure of a second conductivity type having a first surface and a second surface, the second surface being substantially opposite the first surface, wherein; the first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure; a first dielectric layer is coupled to the second surface of the III-nitride emitter structure; and the III-nitride emitter structure has a sidewall adjacent to an exposed portion of the surface of the III-nitride base structure; forming a spacer coupled to the sidewall of the III-nitride emitter structure and the exposed portion of the surface of the III-nitride base structure; and forming a base contact structure comprising a III-nitride material coupled to the spacer, the exposed portion of the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor device comprising:
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a III-nitride base structure of a first conductivity type; a III-nitride emitter structure of a second conductivity type having a first surface and a second surface, the second surface being substantially opposite the first surface, wherein the first surface of the III-nitride emitter structure is coupled to a surface of the III-nitride base structure; a first dielectric layer coupled to the second surface of the III-nitride emitter structure; a spacer coupled to a sidewall of the III-nitride emitter structure and the surface of the III-nitride base structure; and a base contact structure comprising a III-nitride material coupled to the spacer, the surface of the III-nitride base structure, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the base contact structure and the III-nitride emitter structure. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for fabricating a vertical bipolar transistor, the method comprising:
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providing a first III-nitride layer of a first conductivity type; forming at least one III-nitride layer of a second conductivity type coupled to the first III-nitride layer; forming a first dielectric layer coupled to the at least one III-nitride layer; removing at least a portion of the first dielectric layer and the at least one III-nitride layer to; expose a surface of the first III-nitride layer, and form a layered structure comprising at least a portion of the at least one III-nitride layer and the first dielectric layer; forming a spacer coupled to a sidewall of the layered structure; and forming a second III-nitride layer of the first conductivity type coupled to the spacer, the exposed surface of the first III-nitride layer, and the first dielectric layer, such that the first dielectric layer and the spacer are disposed between the second III-nitride layer and the at least one III-nitride layer. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification