Warpage Control for Flexible Substrates

• US 20140131897A1
• Filed: 03/01/2013
• Published: 05/15/2014
• Est. Priority Date: 11/15/2012
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Yu, Chen-Hua, Lin, Shih Ting, Lin, Jing-Cheng, Hou, Shang-Yun, Lu, Szu Wei
• Application Number:
  US13/782,109
• Publication Number:
  US 20140131897A1
• Time in Patent Office: Days
• US Class Current: 257/783
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05609 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/05611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05794 with a principal constituent of the material being a liquid not provided for in groups H01L2224/057 - H01L2224/05791
• CPC Class Codes: H01L 2224/058 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13294 with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
• CPC Class Codes: H01L 2224/133 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the bump connector during or after the bonding process
• CPC Class Codes: H01L 2224/81192 : wherein the bump connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81409 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/81411 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81424 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/81444 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/83007 : involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting the layer connector during or after the bonding process
• CPC Class Codes: H01L 2224/831 : the layer connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/3511 : Warping

Abstract

A flexible substrate may be provided having a first side and a second side. A device may be electrically coupled to the first side of the flexible substrate through one or more electrical connections. A warpage control device may be attached to the second side flexible substrate. The warpage control device may include an adhesive layer and a rigid layer. The warpage control device may be formed in an area of the second side of the flexible substrate that may be opposite the one or more electrical connections on the first side of the flexible substrate.

Claims

1. A method for providing a flexible structure, comprising:

providing a flex substrate having a plurality of electrical connections formed on a first side of the flex substrate; and

attaching an adhesive layer and a rigid layer to a second side of the flex substrate, wherein the adhesive layer and the rigid layer are attached to an area of the second side of the flex substrate opposing the one or more electrical connections on the first side of the flex substrate.

2. The method of claim 1, wherein the rigid layer is a metal, a plastic, a polymer or combinations thereof.

3. The method of claim 1, further comprising:

prior to the attaching the adhesive layer and the rigid layer to the second side of the flex substrate, attaching a device to the electrical connections on the first side of the flex substrate.

4. The method of claim 1, further comprising:

after the attaching the adhesive layer and the rigid layer to the second side of the flex substrate, attaching a device to the electrical connections on the first side of the flex substrate.

5. The method of claim 1, wherein the attaching the adhesive layer and the rigid layer to the second side of the flex substrate comprises:

attaching the adhesive layer to the second side of the flex substrate; and

after the attaching the adhesive layer, attaching the rigid layer to the adhesive layer.

6. The method of claim 1, wherein the attaching the adhesive layer and the rigid layer to the second side of the flex substrate comprises:

forming the adhesive layer on the rigid layer; and

after the forming the adhesive layer on the rigid layer, attaching the adhesive layer and the rigid layer to the flex substrate to the second side of the flex substrate.

7. The method of claim 1, wherein the attaching the adhesive layer includes pressing, spraying, brushing or laminating the adhesive layer to the flex substrate.

8. The method of claim 1, wherein the flex substrate is a polymer, a polyimide, a plastic, a transparent conductive film or combinations thereof.

9. The method of claim 1, wherein the rigid layer comprises a plurality of layers.

10. A method for providing a flexible structure, comprising:

attaching a device to one or more electrical connections on a first side of a flex substrate; and

attaching an adhesive layer and a rigid layer on a second side of the flex substrate, wherein the adhesive layer is attached to an area of the second side of the flex substrate opposing the one or more electrical connections.

11. The method of claim 10, further comprising:

forming a molding underfill between the device and the flex substrate.

12. The method of claim 10, wherein the attaching the adhesive layer and the rigid layer to the second side of the flex substrate comprises:

attaching the adhesive layer to the second side of the flex substrate; and

following the attaching the adhesive layer, attaching the rigid layer to the adhesive layer.

13. The method of claim 10, wherein the attaching the adhesive layer and the rigid layer to the second side of the flex substrate comprises:

forming the adhesive layer on the rigid layer; and

attaching the adhesive layer and the rigid layer to the second side of the flex substrate.

14. The method of claim 10, wherein the rigid layer is a metal, a plastic, a polymer or combinations thereof.

15. The method of claim 10, wherein the device is a packaged semiconductor device, a die or an interposer.

16-20. -20. (canceled)

21. A method comprising:

forming on a first surface of a flex substrate a first plurality of electrical connectors;

attaching to a second surface of the flex substrate, opposite the first surface, a rigid layer;

aligning a second plurality of electrical connectors on a device to respective ones of the first plurality of electrical connectors;

reflowing the first and second plurality of electrical connectors; and

forming an underfill between the device and the first surface of the flex substrate.

22. The method of claim 21, further comprising:

prior to attaching to the second surface of the flex substrate the rigid layer, forming on the rigid layer an adhesive layer using a process selected from the group consisting of;

laminating, spraying, dipping, brushing, and combinations thereof.

23. The method of claim 22, wherein one of the first plurality of connectors and the second plurality of connectors comprise solder bumps.

24. The method of claim 22, wherein the step of attaching to a second surface of the flex substrate, opposite the first surface, a rigid layer occurs prior to the step of aligning a second plurality of electrical connectors on a device to respective ones of the first plurality of electrical connector.

25. The method of claim 22, further comprising testing the device.