ANTENNA MODULE

• US 20140132466A1
• Filed: 11/04/2013
• Published: 05/15/2014
• Est. Priority Date: 11/12/2012
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation, Osaka University
• Original Assignee: Nitto Denko Corporation, Osaka University
• Inventors: INOUE, Masami, HODONO, Masayuki, HONJO, Mitsuru, NAGATSUMA, Tadao, FUJITA, Masayuki
• Application Number:
  US14/070,868
• Publication Number:
  US 20140132466A1
• Time in Patent Office: Days
• US Class Current: 343/767
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H01Q 1/22 by structural association with other equipment or articles
• CPC Class Codes: H01Q 13/085 Slot-line radiating ends
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 21/24 Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001
• CPC Class Codes: H01Q 3/01 varying the shape of the antenna or antenna system
• CPC Class Codes: H01Q 9/40 Element having extended radiating surface

Abstract

A dielectric film has a main surface and a back surface and is formed of resin. Electrodes that can receive or transmit an electromagnetic wave having a frequency of not less than 0.05 THz and not more than 10 THz in the terahertz band are formed on the main surface of the dielectric film. The electrodes constitute a tapered slot antenna. The dielectric film and the electrodes are formed of a flexible printed circuit board. A semiconductor device that is operable at a frequency in the terahertz band is mounted on the main surface of the dielectric film so as to be electrically connected to the electrodes.

Claims

1. An antenna module comprising:

a dielectric film that has first and second surfaces and is made of resin;

an electrode formed on at least one of the first and second surfaces of the dielectric film to be capable of receiving and transmitting an electromagnetic wave in a terahertz band; and

a semiconductor device mounted on at least one of the first and second surfaces of the dielectric film to be electrically connected to the electrode and operable in the terahertz band.

2. The antenna module according to claim 1, wherein

the resin includes a porous resin.

3. The antenna module according to claim 1, wherein

the dielectric film has a thickness of not less than 1 μ

m and not more than 1000 μ

m.

4. The antenna module according to claim 1, wherein

the dielectric film has a relative dielectric constant of not more than 7.0 in the terahertz band.

5. The antenna module according to claim 1, wherein

the electrode includes first and second conductive layers that constitute a tapered slot antenna having an opening, and

the opening has a width that continuously or gradually decreases from one end to another end of a set of the first and second conductive layers.

6. The antenna module according to claim 5, wherein

the width of the opening at the one end of each of the first and second conductive layers is set such that one portion of the tapered slot has a width that enables transmission or receipt of the electromagnetic wave in the terahertz band.

7. The antenna module according to claim 1, wherein

the electrode includes a conductive layer formed on the first surface of the dielectric film and a grounding conductive layer formed on the second surface of the dielectric film, and the conductive layer and the grounding conductive layer constitute a patch antenna.

8. The antenna module according to claim 1, wherein

the electrode is formed on the first surface of the dielectric film, and

the antenna module further comprising a support body formed on the second surface of the dielectric film.

9. The antenna module according to claim 8, wherein

the support body is formed in a region that does not overlap with the electrode on the second surface.