IMPLANTABLE MEDICAL DEVICE HEADER

• US 20140133123A1
• Filed: 11/14/2012
• Published: 05/15/2014
• Est. Priority Date: 11/14/2012
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Prasannakumar, Jeevan M., Haenisch, Christopher M., Patras, George, Zhao, Yanzhu, Bates, David, Olson, John C., Weiand, Jason P.
• Granted Patent: US 9,345,185 B2
• Time in Patent Office: Days
• US Class Current: 361/814
• CPC Class Codes: A61N 1/37205 Microstimulators, e.g. implantable through a cannula
• CPC Class Codes: A61N 1/37229 Shape or location of the implanted or external antenna
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29L 2031/753 Medical equipment; Accessories therefor bloodbags, medical bags B29L2031/7148; artificial eyes B29L2011/0008
• CPC Class Codes: H01Q 1/273 Adaptation for carrying or wearing by persons or animals
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
• CPC Class Codes: H05K 13/0015 Orientation; Alignment; Positioning
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure

Abstract

Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device.

Claims

1. A method of forming a header for an implantable medical device, the method comprising:

positioning a pre-molding assembly within a first-shot mold, wherein the pre-molding assembly comprises an antenna, an electrode, and an attachment plate, and wherein the first-shot mold defines at least one divot; and

creating a first-shot assembly by introducing a first shot molding material into the first-shot mold, wherein the first-shot assembly comprises the pre-molding assembly at least partially covered by the first-shot molding material, wherein the first-shot assembly comprises at least one protrusion of the first shot molding material extending from a surface of the first-shot assembly and formed by introduction of the first shot molding material into the at least one divot of the first-shot mold.

2. The method of claim 1, wherein the at least one protrusion extends from a surface of the first-shot assembly opposite the electrode, wherein the at least one protrusion is configured to engage with a wall of a second-shot mold to substantially prevent coverage of the electrode during injection of a second shot molding material into the second-shot mold.

3. The method of claim 2, wherein the at least one divot of the first-shot mold is adjacent to an antenna loading structure of the antenna, and wherein the at least one protrusion extends from a surface created by the antenna loading structure.

4. The method of claim 2, further comprising placing the first-shot assembly into the second-shot mold, wherein placing the first-shot assembly into the second-shot mold comprises placing the at least one protrusion against a wall of the second-shot mold opposite the electrode.

5. The method of claim 1, wherein the at least one protrusion extends outward from a surface of the first-shot assembly at a first portion of the first-shot assembly, wherein the at least one protrusion is configured to guide flow of a second-shot molding material introduced proximate to the first portion toward a second, different portion of the first-shot assembly within a second-shot mold.

6. The method of claim 5, wherein the at least one protrusion extends between the electrode and an antenna loading structure of the antenna.

7. The method of claim 5, further comprising placing the first-shot assembly into the second-shot mold, wherein placing the first-shot assembly into the second-shot mold comprises placing the at least one protrusion proximate to a portion of the second-shot mold into which the second-shot molding material is introduced.

8. The method of claim 1, further comprising:

placing the first-shot assembly into the second-shot mold; and

injecting a second-shot molding material into the second-shot mold to substantially overmold the first-shot assembly.

9. A header for an implantable medical device, the header comprising:

a first-shot assembly comprising a pre-molding assembly at least partially covered by a molding material, wherein the pre-molding assembly comprises an antenna, an electrode, and an attachment plate, wherein the first-shot assembly comprises at least one protrusion of the first shot molding material extending from a surface of the first-shot assembly and formed by introduction of the first shot molding material into the at least one divot of the first-shot mold.

10. The header of claim 9, wherein the at least one protrusion extends from a surface of the first-shot assembly opposite the electrode, wherein the at least one protrusion is configured to engage with a wall of a second-shot mold to substantially prevent coverage of the electrode during injection of a second shot molding material into the second-shot mold.

11. The header of claim 10, wherein the at least one divot of the first-shot mold is adjacent to an antenna loading structure of the antenna, and wherein the at least one protrusion extends from a surface created by the antenna loading structure.

12. The header of claim 9, wherein the at least one protrusion extends outward from a surface of the first-shot assembly at a first portion of the first-shot assembly, wherein the at least one protrusion is configured to guide flow of a second-shot molding material introduced proximate to the first portion toward a second, different portion of the first-shot assembly within a second-shot mold.

13. The header of claim 12, wherein the at least one protrusion extends between the electrode and an antenna loading structure of the antenna.

14. The header of claim 9, further comprising an overmold at least partially covering the first-shot assembly.

15. The header of claim 9, wherein the attachment plate comprises at least one extension, wherein the at least one extension defines at least one void filled with the molding material.

16. The header of claim 9, wherein the attachment plate comprises a base configured to be mechanically coupled to a body of the implantable medical device, wherein the base defines a space configured to receive at least one feedthrough wire from the body of the implantable medical device.