LED Lighting Apparatus and Housing

• US 20140133156A1
• Filed: 01/20/2014
• Published: 05/15/2014
• Est. Priority Date: 11/05/2010
• Status: Active Grant

• Current Assignee: Lex Products
• Original Assignee: Lex Products
• Inventors: Bowen, Donald
• Granted Patent: US 10,436,433 B2
• Time in Patent Office: Days
• US Class Current: 362/294
• CPC Class Codes: F21L 14/023 having two or more, or different light sources
• CPC Class Codes: F21S 4/20 with light sources held by or within elongate supports
• CPC Class Codes: F21V 15/04 Resilient mountings, e.g. shock absorbers shock absorbing devices of vehicle headlamp housings B60Q1/0491; in general F16F15/04
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 3/04 characterised by materials, surface treatments or coatings
• CPC Class Codes: F21V 3/063 comprising air or water bubbles, e.g. foamed materials
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A lighting apparatus and method for making the same are presented. In some aspects the apparatus includes a plurality of LED light sources mounted to a metal circuit board in a housing of the apparatus. In other aspects a light-permissive potting compound is disposed in the space between the LEDs and circuit board and the housing of said apparatus so as to permit exit of light from said LEDs while providing mechanical protection for the circuit board and LEDs and removing heat generated from said LEDs.

Claims

1. A lighting apparatus, comprising:

a housing;

a thermally-conducting circuit board located within the housing and having two opposing sides and an electrically-insulating layer on at least one of the two opposing sides;

at least one LED light source thermally coupled to the circuit board to conduct heat from the LED light source to the circuit board during operation, wherein the LED light source is connected to the circuit board to receive electrical power from the circuit board;

a compound configured to allow transmission of at least a portion of light output of the LED light source, the compound being located in a space between an interior surface of the housing and the circuit board and configured to provide mechanical contact with the circuit board, the LED light source and the housing such that heat is conducted from the circuit board to the compound during operation;

at least one spacer located within an interior portion of the housing, wherein the at least one spacer is configured to absorb mechanical shock introduced into the lighting apparatus; and

a power supply circuit for providing electrical power to energize the LED light source.

2. The lighting apparatus of claim 1, wherein the at least one LED light source is electrically connected to the circuit board.

3. The lighting apparatus of claim 2, wherein the circuit board is located within the housing and includes a metallic substrate configured to dissipate heat.

4. The lighting apparatus of claim 3, wherein the at least one spacer is configured to support the circuit board.

5. The lighting apparatus of claim 3, wherein the metallic substrate is constructed at least in part from at least one of aluminum, steel, copper, or any combination thereof.

6. The lighting apparatus of claim 1, wherein the compound comprises a potting compound having a viscous or semi-fluid composition at the time of manufacture of the apparatus and is transformative to a composition of substantially greater viscosity after manufacture.

7. The lighting apparatus of claim 1, wherein the compound is comprised of a silicone gel that is substantially optically clear and that hardens from a fluid composition at the time of manufacture of the lighting apparatus into a rubber like composition after manufacture of the lighting apparatus.

8. The lighting apparatus of claim 1, wherein the compound includes one or more light-dispersing materials suspended within the compound.

9. The lighting apparatus of claim 8, wherein the one or more light-dispersing materials include at least one of fluid droplets, gas bubbles, crystalline impurities, nano-particles, or metal particles or any combination thereof.

10. The lighting apparatus of claim 1, wherein the housing includes a first end and a second end.

11. The lighting apparatus of claim 10, further comprising a first end cap located proximate the first end and a second end cap located proximate the second end.

12. The lighting apparatus of claim 1, wherein the compound is configured to allow at least a portion of light generated by the at least one LED light source to be transmitted there through.

13. The lighting apparatus of claim 12, wherein the housing includes an optical window is configured to allow at least a portion of light generated by the at least one LED light source to be transmitted there through.

14. The lighting apparatus of claim 1, wherein the compound is in contact with the at least one LED light source and has a thermal conductivity greater than air to dissipate heat generated by the at least one LED light source.

15. The lighting apparatus of claim 1, wherein the circuit board includes a metallic substrate thermally coupled to a heat sink structure.

16. The lighting apparatus of claim 1, wherein the circuit board includes a metallic substrate and at least one heat sink structure, wherein the at least one heat sink structure is thermally connected to the metallic substrate to enhance heat dissipation from the metallic substrate.

17. The lighting apparatus of claim 1, wherein the circuit board includes a metallic substrate electrically coupled to a common electrical polarity.

18. The lighting apparatus of claim 3, wherein the at least one LED light source is surface mounted onto an insulating layer of the circuit board by way of a pad having a dimension greater than a dimension of the LED light source to increase thermal conduction rate from the LED light source to the metallic substrate.

19. The lighting apparatus of claim 1, wherein the circuit board is located within the housing to be at least partially encapsulated by the compound, wherein the circuit board mechanically supports the circuit board in place once the compound is cured.

20. A method for manufacturing a lighting apparatus, comprising:

obtaining a housing, an LED light source and a thermally-conducting circuit board;

connecting the LED light source to the thermally-conducting circuit board and the thermally-conducting circuit board to a power cord, wherein the LED light source is connected to the circuit board to receive electrical power from the circuit board;

associating at least one spacer with the circuit board;

locating the LED light source and the thermally-conducting circuit board within the housing; and

encapsulating the LED light source within a thermally conducting optically-permissive compound within the housing.