NANOPOSITIONING SUBSTRATE PREPARATION APPARATUS AND PREPARATION METHOD USING DIP PEN NANOLITHOGRAPHY WITH A SINGLE TIP OR MULTIPLE TIPS USING ATOMIC FORCE MICROSCOPE (AFM)

• US 20140134336A1
• Filed: 05/21/2012
• Published: 05/15/2014
• Est. Priority Date: 06/13/2011
• Status: Active Grant

• Current Assignee: Korea Research Institute of Bioscience & Biotechnology
• Original Assignee: Korea Research Institute of Bioscience & Biotechnology
• Inventors: Ha, Tai-Hwan, Park, Jee-Eun
• Granted Patent: US 9,403,180 B2
• Time in Patent Office: Days
• US Class Current: 427/256
• CPC Class Codes: B05C 11/00 Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00 means for manipulating or holding work B05C13/00; enclosures for apparatus, booths B05C15/00; spray booths B05B16/00
• CPC Class Codes: B05D 5/00 Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
• CPC Class Codes: B81C 99/0025 Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: G01Q 80/00 Applications, other than SPM, of scanning-probe techniques manufacture or treatment of nanostructures B82B3/00; recording or reproducing information using near-field interaction G11B9/12, G11B11/24, G11B13/08
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Abstract

Provided are method and apparatus to nanoposition ink, the apparatus including: a substrate; a pattern index; an atomic force microscope (AMF) tip configured to form a pattern on the pattern index; a first ink reservoir including a first ink; a second ink reservoir including a second ink; a first cleaning portion configured to remove the first ink from the AMF tip; a second washing portion configured to remove the second ink from the AMF tip; a position determining portion configured to interact with the AMF tip; an electrode connection portion configured to apply a voltage to the position determining portion, in order to determine a position of the AMF tip when the AMF tip interacts with the position determining portion. The AMF tip is configured to configured to interact with the position determining portion, prior to forming the pattern using the first and second inks.

Claims

1. A nanopositioning substrate preparation apparatus comprising:

a substrate;

a pattern index disposed on the substrate;

an AFM tip configured to form a pattern on the pattern index;

a first ink reservoir disposed on the substrate and configured to coat the AFM tip with a first ink;

a position determining portion disposed on the substrate and configured to interact with the AMF tip;

a first cleaning portion disposed on the substrate and configured to remove the first ink from the AFM tip;

a second ink reservoir disposed on the substrate and configured to coat rc load ink on the AFM tip with a second ink;

a second cleaning portion disposed on the substrate and configured to remove the second ink from; and

an electrode connecting portion configured to apply a voltage to the position determining portion, in order to determine a position of the AMF tip when the AMF tip interacts with the position determining portion,

wherein the AMF tip is configured to interact with the position determining portion, prior to forming the pattern using the first and second inks.

2. The nanopositioning substrate preparation apparatus of claim 1, wherein:

the first and second inks are identical or different; and

the first and second inks comprise a low molecular weight compound or a biopolymer material comprising DNA or protein.

3. The nanopositioning substrate preparation apparatus of claim 1, wherein the first and second ink reservoirs each comprise two or more ink reservoirs configured to contain the first and second inks.

4. The nanopositioning substrate preparation apparatus of claim 1, wherein:

the AMF tip is configured to use the position determining portion as a reference position, in order to correct for positional deviations of the AMF tip,

by checking positions based on voltage-current by detecting a change in the applied voltage, a bending degree of the AFM tip according to the applied voltage, or an AFM image.

5. The nanopositioning substrate preparation apparatus of claim 4, wherein:

the position determining portion comprises a three dimensional nanostructure shaped as a cone, a quadrangular pyramid, a triangular pyramid, or a cylinder;

a gold (Au), silver (Ag), or copper (Cu) electrode is formed on the nanostructure; and

the first ink reservoir and the second ink reservoir comprise Au, Ag, or Cu electrodes coated with a hydrogel.

6. The nanopositioning substrate preparation apparatus of claim 1, further comprising a gold electrode to connect the pattern index and the position determining portion to an external power source.

7. The nanopositioning substrate preparation apparatus of claim 1, wherein:

the first and second cleaning portions comprise two or more cleaning portions to repeatedly cleaning the AFM tip; and

the first and second cleaning portions comprise an aqueous solution or organic solvent, and are configured to apply a voltage to the AMF tip when cleaning the AMF tip.

8. The nanopositioning substrate preparation apparatus of claim 1, further comprising an electric line comprising a conductive adhesive or a conductive solder, the electric line configured to apply a voltage to the first and second cleaning portions and the first and second ink reservoirs.

9. The nanopositioning substrate preparation apparatus of claim 1 wherein:

the substrate comprises silicon, a silicon rubber, a silicon resin, polydimethylsiloxane, or a glass; and

the substrate comprises a protrusion or a recess formed thereon.

17. The nanopositioning substrate preparation apparatus of claim 1, wherein the apparatus further comprises N of each of the AFM tips, first ink reservoirs, second ink reservoirs, position determining portions, first cleaning portions, and second cleaning portions, (N being a natural number greater than 1).

10. A nanopositioning substrate preparation method using a nanopositioning substrate preparation apparatus comprising an atomic force microscope (AFM) tip and a substrate comprising:

a position determining portion;

a pattern index;

a first ink reservoir comprising a first ink;

a first cleaning portion;

a second ink reservoir comprising a second ink;

a second cleaning portion; and

an electrode connecting portion configured to apply a voltage to the AFM tip and the position determining portion, the method comprising;

positioning the AFM tip at the first ink reservoir and coating the first ink on the AFM tip;

positioning the AFM tip at the position determining portion and using an interaction between the position determining portion and the AMF tip, to determine a first origin of the AMF tip;

positioning the AFM tip at the pattern index, with reference to the first origin, and applying the first ink to the pattern index;

positioning the AFM tip to the first cleaning portion to remove a residual amount of the first ink;

positioning the AFM tip at the second ink reservoir and coating the second ink on the AFM tip;

positioning the AFM tip at the position determining portion and using an interaction between the position determining portion and the AMF tip, to determine a second origin of the AMF tip;

positioning the AFM tip at the pattern index, with reference to the second origin, and applying the second ink to the pattern index;

positioning the AFM tip at the second cleaning portion to remove a residual amount of the second ink; and

repeating the above-mentioned processes until a pattern is formed on the pattern index.

11. The nanopositioning substrate preparation method of claim 10, wherein:

the first and second ink reservoirs comprise two or more ink reservoirs to repeatedly load the first and second inks on the AFM tip;

the first and second inks are the same or different from each other; and

the first and second inks comprise a low molecular weight compound or a biopolymer material comprising DNA or protein.

12. The nanopositioning substrate preparation method of claim 10, wherein:

the position determining portion comprises a three dimensional nanostructure shaped as a cone, a quadrangular pyramid, a triangular pyramid, or a cylinder;

a gold (Au), silver (Ag) or copper (Cu) electrode is formed on the nanostructure, and

the determining of the first and second origins comprises positioning the AMF tip in accordance with an electric current characteristic of the voltage applied to the AFM tip from the position determining portion, a bending degree of the AFM tip, or by using an AFM image.

13. The nanopositioning substrate preparation method of claim 10, wherein the position determining portion comprises a gold electrode connected to an external power source.

14. The nanopositioning substrate preparation method of claim 10, wherein:

the removal of the first and second inks comprises repeatedly cleaning the AFM tip with an organic solvent or aqueous solution disposed in the first and second cleaning portions, while a voltage is applied to the first and second cleaning portions.

15. The nanopositioning substrate preparation method of claim 14, wherein an electrode connection portion is used to apply voltage to the first and second cleaning portions.

16. The nanopositioning substrate preparation method of claim 10, wherein:

the substrate comprises silicon, a silicon rubber, a silicon resin, a polydimethylsiloxane, or a glass substrate; and

the substrate comprises a protrusion or a recess.

26. The nanopositioning substrate preparation method of claim 10, wherein:

the nanopositioning substrate preparation apparatus comprises N of each of the AMF tips, first ink reservoirs, second ink reservoirs, position determining portions, first cleaning portions, and second cleaning portions (N being a natural number greater than

     1), and

the method comprises positioning the AMF tips with respect to corresponding ones of the first ink reservoirs, second ink reservoirs, position determining portions, first cleaning portions, and second cleaning portions.

18-25. -25. (canceled)

27-32. -32. (canceled)