MICROPHONE PACKAGE
First Claim
Patent Images
1. A microphone package comprising:
- a pressure sensing element including;
a film configured to generate strain in response to pressure; and
a device provided on the film and including;
a first electrode;
a second electrode; and
a first magnetic layer provided between the first electrode and the second electrode and having a first magnetization; and
a cover including;
an upper portion provided with a hole configured to passing sound; and
a side portion being magnetic and provided depending on the first magnetization and of the second magnetization,the cover housing therein the pressure sensing element.
1 Assignment
0 Petitions
Accused Products
Abstract
According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
-
Citations
20 Claims
-
1. A microphone package comprising:
-
a pressure sensing element including; a film configured to generate strain in response to pressure; and a device provided on the film and including; a first electrode; a second electrode; and a first magnetic layer provided between the first electrode and the second electrode and having a first magnetization; and a cover including; an upper portion provided with a hole configured to passing sound; and a side portion being magnetic and provided depending on the first magnetization and of the second magnetization, the cover housing therein the pressure sensing element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification