MICROPHONE PACKAGE

• US 20140137658A1
• Filed: 10/03/2013
• Published: 05/22/2014
• Est. Priority Date: 11/20/2012
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: HIGASHI, Yoshihiro, Fuji, Yoshihiko, Hara, Michiko, Kaji, Shiori, Nagata, Tomohiko, Hori, Akio, Fukuzawa, Hideaki, Yuzawa, Akiko
• Granted Patent: US 9,549,261 B2
• Time in Patent Office: Days
• US Class Current: 73/779
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 7/10 comprising superposed layers in contact

Abstract

According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.

Claims

1. A microphone package comprising:

a pressure sensing element including;

a film configured to generate strain in response to pressure; and

a device provided on the film and including;

a first electrode;

a second electrode; and

a first magnetic layer provided between the first electrode and the second electrode and having a first magnetization; and

a cover including;

an upper portion provided with a hole configured to passing sound; and

a side portion being magnetic and provided depending on the first magnetization and of the second magnetization,

the cover housing therein the pressure sensing element.

2. The package according to claim 1, wherein

the device further includes:

a second magnetic layer provided between the first magnetic layer and the second electrode and having a second magnetization; and

a non-magnetic layer provided between the first magnetic layer and the second magnetic layer,

the first magnetic layer, the non-magnetic layer, and the second magnetic layer being stacked in a stacking direction from the first magnetic layer toward the second magnetic layer, and

angle between the first magnetization and the second magnetization being changed in response to the strain of the film.

3. The package according to claim 1, wherein the side portion includes a magnetic material.

4. The package according to claim 1, wherein the side portion includes a magnetic particle.

5. The package according to claim 4, wherein the side portion is formed of a non-magnetic material including the particle.

6. The package according to claim 5, wherein the non-magnetic material is formed of a resin material.

7. The package according to claim 4, wherein the particle includes at least one of nickel, iron, cobalt, nickel oxide, iron oxide, cobalt oxide, nickel nitride, iron nitride, and cobalt nitride.

8. The package according to claim 1, wherein the side portion includes a non-magnetic material and a magnetic material provided on the non-magnetic material.

9. The package according to claim 8, wherein the magnetic material includes at least one of NiFe alloy, Ni—

Fe—

X alloy (X being Cu, Cr, Ta, Rh, Pt, or Nb), CoZrNb alloy, and FeAlSi alloy.

10. The package according to claim 8, wherein the magnetic material includes a ferrite material.

11. The package according to claim 8, wherein the non-magnetic material includes a resin material.

12. The package according to claim 8, wherein the non-magnetic material has a larger surface area than the magnetic material.

13. The package according to claim 1, wherein the cover further includes a lid provided on the upper portion and formed of a metal.

14. The package according to claim 1, wherein

the film has a portion formed in a geometrically isotropic shape, and

the device is placed at a position not including a geometric center point of the geometrically isotropic shape.

15. The package according to claim 1, wherein the film includes silicon.

16. The package according to claim 1, wherein the film includes a polymer material.

17. The package according to claim 1, wherein

the first magnetization is perpendicular to the stacking direction,

the second magnetization is perpendicular to the stacking direction, and

the side portion has a surface substantially perpendicular to the first magnetization and the second magnetization.

18. The package according to claim 1, wherein

the first magnetization is substantially parallel to the stacking direction,

the second magnetization is substantially parallel to the stacking direction, and

the side portion has a surface substantially parallel to the first magnetization and the second magnetization.

19. The package according to claim 1, wherein the upper portion is formed of a resin material.

20. The package according to claim 1, wherein distance between the device and the side portion is smaller than absolute value of difference between height of the cover in the stacking direction and height of the film in the stacking direction.