PCB PAD FOR IMAGER OF VEHICLE VISION SYSTEM

• US 20140138140A1
• Filed: 11/18/2013
• Published: 05/22/2014
• Est. Priority Date: 11/19/2012
• Status: Active Grant

• Current Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Original Assignee: Magna Electronics Incorporated (Magna International Incorporated)
• Inventors: Sigle, Marc
• Granted Patent: US 9,307,640 B2
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: B60R 2300/8066 for monitoring rearward traffic
• CPC Class Codes: G06V 20/58 Recognition of moving objects or obstacles, e.g. vehicles or pedestrians; Recognition of traffic objects, e.g. traffic signs, traffic lights or roads
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09381 Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
• CPC Class Codes: H05K 2201/09418 Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A circuit board for an image processing chip of a vision system of a vehicle is configured for a surface mount device to be attached thereto and includes at least one mounting location having a plurality of solder pads established thereat. The pads are arranged in a manner that enhances soldering of the device or component to the pad and circuit board. The pads may be arranged similarly in respective portions of the mounting location, such that the pads of one portion of the mounting location may be generally parallel to one another and may be generally orthogonal to the pads of another portion of the mounting location. Optionally, the pads may be generally tear-drop shaped, and the tear-drop shaped pads may be arranged so as to point generally towards or generally away from a center area of the mounting location of the circuit board.

Claims

1. A circuit board for a surface mount device to be attached thereto, said circuit board comprising a circuit board for an image processing chip of a vision system of a vehicle, said circuit board comprising:

at least one mounting location having a plurality of solder pads established thereat;

wherein said solder pads are arranged in a manner that enhances soldering of the component to said solder pads and circuit board; and

wherein said solder pads each comprise an elongated solder pad having a longitudinal axis, and wherein said solder pads are arranged such that the longitudinal axes of some of said solder pads are generally orthogonal to the longitudinal axes of others of said solder pads.

2. The circuit board of claim 1, wherein said solder pads are arranged similarly in respective portions of said mounting location.

3. The circuit board of claim 2, wherein said solder pads of one portion of said mounting location are generally parallel to one another at the one portion and are generally orthogonal to said solder pads of another portion of said mounting location.

4. The circuit board of claim 1, wherein said solder pads are generally tear-drop shaped.

5. The circuit board of claim 4, wherein said tear-drop shaped solder pads are arranged so as to point generally towards or generally away from a center area of said mounting location of said circuit board.

6. The circuit board of claim 1, wherein said solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally towards a center area of said mounting location of said circuit board.

7. The circuit board of claim 1, wherein said solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally away from a center area of said mounting location of said circuit board.

8. The circuit board of claim 1, wherein said solder pads of a first quadrant of said mounting location are orthogonal to said solder pads of a second quadrant of said mounting location.

9. The circuit board of claim 8, wherein said solder pads of said first quadrant are generally parallel to said solder pads of a third quadrant of said mounting location and said solder pads of said second quadrant are generally parallel to said solder pads of a fourth quadrant of said mounting location.

10. The circuit board of claim 9, wherein said first and third quadrants are at opposite regions of said mounting location and wherein said second and fourth quadrants are at opposite regions of said mounting location.

11. A circuit board for a surface mount device to be attached thereto, said circuit board comprising a circuit board for an image processing chip of a vision system of a vehicle, said circuit board comprising:

at least one mounting location having a plurality of solder pads established thereat;

wherein said solder pads are arranged similarly in respective portions of said mounting location;

wherein said solder pads each comprise an elongated solder pad having a longitudinal axis, and wherein said solder pads are arranged such that the longitudinal axes of some of said solder pads are generally orthogonal to the longitudinal axes of others of said solder pads; and

wherein said solder pads of one portion of said mounting location are generally parallel to one another at the one portion and are generally orthogonal to said solder pads of another portion of said mounting location.

12. The circuit board of claim 11, wherein said solder pads are generally tear-drop shaped.

13. The circuit board of claim 12, wherein said tear-drop shaped solder pads are arranged so as to point generally towards or generally away from a center area of said mounting location of said circuit board.

14. The circuit board of claim 11, wherein said solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally towards a center area of said mounting location of said circuit board.

15. The circuit board of claim 11, wherein said solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally away from a center area of said mounting location of said circuit board.

16. The circuit board of claim 11, wherein said solder pads of a first quadrant of said mounting location are orthogonal to said solder pads of a second quadrant of said mounting location, and wherein said solder pads of said first quadrant are generally parallel to said solder pads of a third quadrant of said mounting location and said solder pads of said second quadrant are generally parallel to said solder pads of a fourth quadrant of said mounting location, and wherein said first and third quadrants are at opposite regions of said mounting location and wherein said second and fourth quadrants are at opposite regions of said mounting location.

17. A circuit board for a surface mount device to be attached thereto, said circuit board comprising a circuit board for an image processing chip of a vision system of a vehicle, said circuit board comprising:

at least one mounting location having a plurality of solder pads established thereat;

wherein said solder pads are generally tear-drop shaped and wherein said teardrop-shaped solder pads each have a longitudinal axis, and wherein said teardrop-shaped solder pads are arranged such that the longitudinal axes of some of said teardrop-shaped solder pads are generally orthogonal to the longitudinal axes of others of said solder pads;

wherein said teardrop-shaped solder pads of a first quadrant of said mounting location are orthogonal to said teardrop-shaped solder pads of a second quadrant of said mounting location, and wherein said teardrop-shaped solder pads of said first quadrant are generally parallel to said teardrop-shaped solder pads of a third quadrant of said mounting location and said teardrop-shaped solder pads of said second quadrant are generally parallel to said teardrop-shaped solder pads of a fourth quadrant of said mounting location.

18. The circuit board of claim 17, wherein said teardrop-shaped solder pads are arranged similarly in respective portions of said mounting location.

19. The circuit board of claim 17, wherein said teardrop-shaped solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally towards a center area of said mounting location of said circuit board.

20. The circuit board of claim 17, wherein said teardrop-shaped solder pads each comprise a narrower end and a wider end, and wherein said solder pads are arranged so as to point generally away from a center area of said mounting location of said circuit board.