METHOD FOR THE COHESIVE CONNECTION OF ELEMENTS
First Claim
1. A method for the cohesive connection of a first element (16, 18) such as the first connector to a second element (10) such as the second connector and/or semiconductor component such as a solar cell, whereby the elements lie on one another during the connecting and are connected by solder material that is loaded during the connecting by a tool (32, 34) such as a sonotrode with ultrasonic oscillations, whereby the tool has a temperature Tw during the connection with in particular Tw>
- Ts with Ts=the melting temperature of the solder material,characterized in that,an element is provided as the first element (16, 18) that comprises passage openings (28, 30),for the connection the first element and the second element (10) are placed on one another with the passage openings open to the second element,andthat molten solder material is present during the connecting in at least one of the passage openings, and the molten solder material in the passage opening is loaded with the ultrasonic oscillations.
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Accused Products
Abstract
The invention relates to a method for the cohesive connection of a first element (16, 18) to a second element (10), wherein the elements are located one on the other during the connection process and are connected by means of a solder material which is subjected to ultrasonic vibrations during connection by means of a tool (32, 34). In order to allow cohesive connection in an energy-efficient manner, it is proposed that the first element (16, 18) used is one which has through-passage openings (28, 30), that for the purpose of connection the first element and the second element (10) are placed one on the other with through-passage openings open towards the second element, and that molten solder material is located in the through-passage openings during connection and in the through-passage openings the molten solder material is subjected to the ultrasonic vibrations.
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Citations
14 Claims
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1. A method for the cohesive connection of a first element (16, 18) such as the first connector to a second element (10) such as the second connector and/or semiconductor component such as a solar cell, whereby the elements lie on one another during the connecting and are connected by solder material that is loaded during the connecting by a tool (32, 34) such as a sonotrode with ultrasonic oscillations, whereby the tool has a temperature Tw during the connection with in particular Tw>
- Ts with Ts=the melting temperature of the solder material,
characterized in that, an element is provided as the first element (16, 18) that comprises passage openings (28, 30), for the connection the first element and the second element (10) are placed on one another with the passage openings open to the second element, and that molten solder material is present during the connecting in at least one of the passage openings, and the molten solder material in the passage opening is loaded with the ultrasonic oscillations. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
- Ts with Ts=the melting temperature of the solder material,
Specification