Please download the dossier by clicking on the dossier button x
×

METHOD FOR THE COHESIVE CONNECTION OF ELEMENTS

  • US 20140138425A1
  • Filed: 05/15/2012
  • Published: 05/22/2014
  • Est. Priority Date: 05/17/2011
  • Status: Abandoned Application
First Claim
Patent Images

1. A method for the cohesive connection of a first element (16, 18) such as the first connector to a second element (10) such as the second connector and/or semiconductor component such as a solar cell, whereby the elements lie on one another during the connecting and are connected by solder material that is loaded during the connecting by a tool (32, 34) such as a sonotrode with ultrasonic oscillations, whereby the tool has a temperature Tw during the connection with in particular Tw>

  • Ts with Ts=the melting temperature of the solder material,characterized in that,an element is provided as the first element (16, 18) that comprises passage openings (28, 30),for the connection the first element and the second element (10) are placed on one another with the passage openings open to the second element,andthat molten solder material is present during the connecting in at least one of the passage openings, and the molten solder material in the passage opening is loaded with the ultrasonic oscillations.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×