SEMICONDUCTOR LIGHT-EMITTING DEVICE AND PRODUCING METHOD THEREOF
First Claim
1. A semiconductor light-emitting device comprising:
- a semiconductor light-emitting element which includes a transparent insulating substrate and a semiconductor layer formed on a lower surface of said transparent insulating substrate;
a phosphor resin which covers a side face of said transparent insulating substrate, and which wavelength-converts a portion of light emitted from said semiconductor light-emitting element; and
a phosphor sheet which covers an upper surface of said phosphor resin and is bonded to said transparent insulating substrate, whereinsaid phosphor sheet has a top plan shape that is identical with an outer peripheral shape of said phosphor resin, andthe top plan shape of said phosphor sheet defines an overall outer plan shape of said device.
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Accused Products
Abstract
An object of the present invention is to provide an LED device that can achieve a large total luminance flux while also achieving a structure, using a phosphor sheet, that is compact in size and easy to produce and whose color emission is easy to manage, and a method for producing such an LED device. A semiconductor light-emitting device including a semiconductor light-emitting element which includes a transparent insulating substrate and a semiconductor layer formed on a lower surface of the transparent insulating substrate, a phosphor resin which covers a side face of the transparent insulating substrate, and which wavelength-converts a portion of light emitted from the semiconductor light-emitting element, and a phosphor sheet which covers an upper surface of the phosphor resin and is bonded to the transparent insulating substrate, wherein the phosphor sheet has a top plan shape that is identical with an outer peripheral shape of the phosphor resin, and the top plan shape of the phosphor sheet defines an overall outer plan shape of the device.
44 Citations
9 Claims
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1. A semiconductor light-emitting device comprising:
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a semiconductor light-emitting element which includes a transparent insulating substrate and a semiconductor layer formed on a lower surface of said transparent insulating substrate; a phosphor resin which covers a side face of said transparent insulating substrate, and which wavelength-converts a portion of light emitted from said semiconductor light-emitting element; and a phosphor sheet which covers an upper surface of said phosphor resin and is bonded to said transparent insulating substrate, wherein said phosphor sheet has a top plan shape that is identical with an outer peripheral shape of said phosphor resin, and the top plan shape of said phosphor sheet defines an overall outer plan shape of said device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for producing a semiconductor light-emitting device that produces output light by wavelength-converting a portion of light emitted from a semiconductor light-emitting element having a transparent insulating substrate and a semiconductor layer formed on a lower surface thereof, the method comprising:
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a preparatory step for preparing a large-sized phosphor sheet made of a phosphor-containing resin formed in the shape of a sheet and a plurality of said semiconductor light-emitting elements; an element placement step for placing said semiconductor light-emitting elements on said large-sized phosphor sheet by disposing said transparent insulating substrate in contacting relationship with said large-sized phosphor sheet, and for bonding said semiconductor light-emitting elements to said large-sized phosphor sheet; a phosphor resin filling step for filling a phosphor resin containing fine phosphor particles so as to cover a side face of each of said semiconductor light-emitting elements; and a dicing step for dicing to separate said semiconductor light-emitting device by cutting said large-sized phosphor sheet and said phosphor resin together.
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9. A method for producing a semiconductor light-emitting device that produces output light by wavelength-converting a portion of light emitted from a semiconductor light-emitting element having a transparent insulating substrate and a semiconductor layer formed on a lower surface thereof, the method comprising:
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a preparatory step for preparing a large-sized submount substrate which becomes a submount substrate or a lead when it is to be diced or a leadframe, and a plurality of said semiconductor light-emitting elements; an element placement step for placing said semiconductor light-emitting elements on said large-sized submount substrate or said leadframe by disposing said semiconductor layer in each of said semiconductor light-emitting elements in contacting relationship with said large-sized submount substrate or said leadframe, and for bonding said semiconductor light-emitting elements to said large-sized submount substrate or said leadframe; a phosphor resin filling step for filling a phosphor resin containing fine phosphor particles so as to cover a side face of each of said semiconductor light-emitting elements; a large-sized phosphor sheet bonding step for bonding a large-sized phosphor sheet made of a resin, which contains fine phosphor particles and is formed in the shape of a sheet, to said transparent insulating substrate; and a dicing step for dicing to separate said semiconductor light-emitting device by cutting said large-sized phosphor sheet or said leadframe, said large-sized phosphor sheet, and said phosphor resin together.
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Specification