ALKALI METAL CELL, ATOMIC OSCILLATOR, AND ALKALI METAL CELL FABRICATING METHOD
First Claim
1. An alkali metal cell, comprising:
- a substrate in which is formed an opening which penetrates from one face to the other face thereof;
a first transparent substrate bonded to the other face of the substrate; and
a second transparent substrate bonded to the one face of the substrate, wherein an alkali metal is sealed into a space surrounded by the first transparent substrate and the second transparent substrate in the opening of the substrate, wherein, in the substrate and the second transparent substrate, the space is enclosed by a bonding between a first bonding metal layer formed by a first bonding metal and a second bonding metal layer formed by a second bonding metal, and wherein the second bonding metal layer has a bonding temperature higher than that of the first bonding metal layer.
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Abstract
An alkali metal cell is disclosed, including a substrate in which is formed an opening which penetrates from one face to the other face thereof; a first transparent substrate bonded to the other face of the substrate; and a second transparent substrate bonded to the one face of the substrate, wherein an alkali metal is sealed into a space surrounded by the first transparent substrate and the second transparent substrate in the opening of the substrate, wherein, in the substrate and the second transparent substrate, the space is enclosed by a bonding between a first bonding metal layer formed by a first bonding metal and a second bonding metal layer formed by a second bonding metal, and wherein the second bonding metal layer has a bonding temperature higher than that of the first bonding metal layer.
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Citations
19 Claims
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1. An alkali metal cell, comprising:
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a substrate in which is formed an opening which penetrates from one face to the other face thereof; a first transparent substrate bonded to the other face of the substrate; and a second transparent substrate bonded to the one face of the substrate, wherein an alkali metal is sealed into a space surrounded by the first transparent substrate and the second transparent substrate in the opening of the substrate, wherein, in the substrate and the second transparent substrate, the space is enclosed by a bonding between a first bonding metal layer formed by a first bonding metal and a second bonding metal layer formed by a second bonding metal, and wherein the second bonding metal layer has a bonding temperature higher than that of the first bonding metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An alkali metal cell fabricating method, comprising the steps of:
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forming, in a substrate, two or more openings penetrating the substrate and, on one face of the substrate, a groove which spatially connects the two openings; bonding a first transparent substrate to the other face of the substrate; providing a compound containing an alkali metal in one opening of the openings; forming a first bonding metal layer formed by a first bonding metal in a surrounding of the two or more openings on the one face of the substrate, or in a portion corresponding to the surrounding of the two or more openings on one face of a second transparent substrate; forming a second bonding metal layer formed by a second bonding metal in the groove of the substrate, or in a portion corresponding to the groove on the one face of the second transparent substrate; bonding the one face of the substrate and the one face of the second transparent substrate by the first bonding metal layer; causing the alkali metal to be produced from the compound containing the alkali metal to supply the alkali metal to the other opening via the groove from the one opening; and bonding the substrate and the second transparent substrate by the second bonding metal layer in the groove after supplying the alkali metal to the other opening. - View Dependent Claims (12, 13, 14)
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15. An alkali metal cell fabricating method, comprising the steps of:
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forming, in a substrate, two or more openings which penetrate the substrate; bonding a first transparent substrate to another face of the substrate; providing a compound containing an alkali metal in one opening of the openings; forming a first bonding metal member formed by a first bonding metal around the two or more openings on one face of the substrate, or in a portion corresponding to the two or more openings on one face of a second transparent substrate; providing a second bonding metal member formed by a second bonding metal in a portion corresponding to a gap between the opening and another opening on one face of the second transparent substrate or on one face of the substrate; bonding the one face of the substrate and the one face of the second transparent substrate by a first bonding metal layer formed by applying the first bonding metal member; forming, in between the one face of the substrate and the one face of the second transparent substrate, a gap which spatially connects the one opening and the other opening; causing the alkali metal to be produced from the compound containing the alkali metal to supply the alkali metal to the other opening via the gap between the substrate and the second transparent substrate from the one opening; and bonding the substrate and the second transparent substrate by the second bonding metal layer formed by heating the second bonding metal member in a portion corresponding to the gap between the one opening and the other opening after supplying the alkali metal to the other opening. - View Dependent Claims (16, 17, 18, 19)
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Specification