WIRING BOARD

• US 20140139310A1
• Filed: 06/21/2012
• Published: 05/22/2014
• Est. Priority Date: 07/04/2011
• Status: Active Grant

• Current Assignee: Kabushiki Kaisha Toyota Jidoshokki
• Original Assignee: Kabushiki Kaisha Toyota Jidoshokki
• Inventors: Asano, Hiroaki, Koike, Yasuhiro, Ozaki, Kiminori, Shimadu, Hitoshi, Asai, Tomoaki, Yamauchi, Ryou, Furuta, Tetsuya, Miyake, Masao, Hayakawa, Takahiro
• Granted Patent: US 8,963,672 B2
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H05K 1/0265 characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/0391 Using different types of conductors
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/0969 Apertured conductors
• CPC Class Codes: H05K 2201/09736 Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence

Abstract

This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Claims

1-7. -7. (canceled)

8. A wiring board comprising:

an insulative core substrate;

a patterned first conductive pattern adhered to the insulative core substrate;

a patterned second conductive pattern adhered to the insulative core substrate, wherein the second conductive pattern and the first conductive pattern are adhered to the same surface of the insulative core substrate, the second conductive pattern includes a first surface that faces toward the insulative core substrate and a second surface that is opposite to the first surface, the second conductive pattern includes a recess that opens in the first surface and a through hole that extends from the first surface to the second surface, and an opening of the recess that opens in the first surface and an opening of the through hole that opens in the first surface are in communication with each other; and

a conductive material that electrically connects the first conductive pattern and the second conductive pattern to each other, wherein

the first conductive pattern is thinner than the second conductive pattern and has a current line with a smaller cross-sectional area than that of the second conductive pattern, and

the first conductive pattern extends on the insulative core substrate so as to be arranged in the opening of the recess, and the conductive material, which is filled into the through hole from an opening that opens in the second surface, electrically connects the first conductive pattern and the second conductive pattern.

10. The wiring board according to claim 8, wherein a patterned rear metal plate is adhered to a surface of the insulative core substrate opposite to the surface to which the first conductive pattern and the second conductive pattern are adhered.

11. The wiring board according to claim 10, wherein a conductive pattern of the rear metal plate forms a primary coil of a transformer, and the second conductive pattern forms a secondary coil of the transformer.

12. The wiring board according to claim 11, wherein the first conductive pattern forms a current or voltage detection line in the secondary coil of the transformer.

9. A wiring board comprising:

an insulative core substrate;

a wiring substrate adhered to the insulative core substrate, wherein the wiring substrate includes a patterned first conductive pattern;

a patterned second conductive pattern adhered to the insulative core substrate, wherein the second conductive pattern and the wiring substrate are adhered to the same surface of the insulative core substrate, the second conductive pattern includes a first surface that faces toward the insulative core substrate and a second surface that is opposite to the first surface, the second conductive pattern includes a recess that opens in the first surface and a through hole that extends from the first surface to the second surface, and an opening of the recess that opens in the first surface and an opening of the through hole that opens in the first surface are in communication with each other; and

a conductive material that electrically connects the first conductive pattern and the second conductive pattern to each other, wherein

the wiring substrate is thinner than the second conductive pattern and has a current line with a smaller cross-sectional area than that of the second conductive pattern, and

the first conductive pattern extends on the insulative core substrate so as to be arranged in the opening of the recess, and the conductive material, which is filled into the through hole from an opening that opens in the second surface, electrically connects the first conductive pattern and the second conductive pattern.

13. The wiring board according to claim 9, wherein a patterned rear metal plate is adhered to a surface of the insulative core substrate opposite to the surface to which the first conductive pattern and the second conductive pattern are adhered.

14. The wiring board according to claim 13, wherein a conductive pattern of the rear metal plate forms a primary coil of a transformer, and the second conductive pattern forms a secondary coil of the transformer.

15. The wiring board according to claim 14, wherein the first conductive pattern forms a current or voltage detection line in the secondary coil of the transformer.