HEAT SINK AND BACKLIGHT MODULE USING SAME

• US 20140140097A1
• Filed: 11/28/2012
• Published: 05/22/2014
• Est. Priority Date: 11/21/2012
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Hsiao, Yuchun, Huang, Chong
• Granted Patent: US 9,208,705 B2
• Time in Patent Office: Days
• US Class Current: 362/612
• CPC Class Codes: G02B 6/0085 Means for removing heat created by the light source from the package heat extraction or cooling elements for semiconductor light sources in general H01L33/64
• CPC Class Codes: G02F 1/133628 with cooling means
• CPC Class Codes: G09F 13/18 Edge-illuminated signs

Abstract

The present invention provides a heat sink and a backlight module using the heat sink. The heat sink includes a first bottom plate, a first side plate formed on the first bottom plate, and a second bottom plate mounted on the first bottom plate. The first bottom plate and the first side plate are integrally formed together. The second bottom plate is fixed by screws to an end of the first bottom plate that is distant from the first side plate. The first bottom plate is made of aluminum extrusion material. The second bottom plate is made of aluminum sheet material. The bottom plate of the heat sink is formed through jointing so that a portion of the bottom plate is made of aluminum sheet material that has a small thickness to thereby reduce the amount of aluminum material used and thus facilitating cost control.

Claims

1. A heat sink, comprising a first bottom plate, a first side plate formed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, the first bottom plate and the first side plate being integrally formed together, the second bottom plate being fixed by screws to an end of the first bottom plate that is distant from the first side plate, the first bottom plate being made of aluminum extrusion material, the second bottom plate being made of aluminum sheet material.

2. The heat sink as claimed in claim 1, wherein the aluminum extrusion material that makes the first bottom plate is Al6063 and the aluminum sheet material that makes the second bottom plate is Al5052.

3. The heat sink as claimed in claim 1, wherein the first bottom plate has an outside surface that is coated with a radiation heat dissipation material, the radiation heat dissipation material comprising a thermally conductive spray coating.

4. The heat sink as claimed in claim 1 further comprising a heat conduction layer interposed between the first bottom plate and the second bottom plate.

5. The heat sink as claimed in claim 4, wherein the heat conduction layer is made of thermal paste or thermal grease.

6. A heat sink, comprising a first bottom plate, a first side plate formed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, the first bottom plate and the first side plate being integrally formed together, the second bottom plate being fixed by screws to an end of the first bottom plate that is distant from the first side plate, the first bottom plate being made of aluminum extrusion material, the second bottom plate being made of aluminum sheet material;

wherein the aluminum extrusion material that makes the first bottom plate is Al6063 and the aluminum sheet material that makes the second bottom plate is Al5052;

wherein the first bottom plate has an outside surface that is coated with a radiation heat dissipation material, the radiation heat dissipation material comprising a thermally conductive spray coating;

further comprising a heat conduction layer interposed between the first bottom plate and the second bottom plate; and

wherein the heat conduction layer is made of thermal paste or thermal grease.

7. A backlight module, comprising a backplane, a heat sink arranged inside the backplane, a light guide plate arranged inside the backplane, and an LED light bar mounted to the heat sink, the heat sink comprising a first bottom plate, a first side plate formed on the first bottom plate, and a second bottom plate mounted on the first bottom plate, the first bottom plate and the first side plate being integrally formed together, the second bottom plate being fixed by screws to an end of the first bottom plate that is distant from the first side plate, the first bottom plate being made of aluminum extrusion material, the second bottom plate being made of aluminum sheet material.

8. The backlight module as claimed in claim 7, wherein the aluminum extrusion material that makes the first bottom plate is Al6063 and the aluminum sheet material that makes the second bottom plate is Al5052, the first bottom plate having an outside surface that is coated with a radiation heat dissipation material, the radiation heat dissipation material comprising a thermally conductive spray coating.

9. The backlight module as claimed in claim 7, wherein the LED light bar is mounted to the first side plate of the heat sink by being fixed by screws or bonded by thermal grease.

10. The backlight module as claimed in claim 7, wherein the backplane comprises a third bottom plate and a second side plate perpendicularly connected to the third bottom plate, the first and second bottom plates being positioned on the third bottom plate, the first side plate being mounted on the second side plate.

11. The backlight module as claimed in claim 7, wherein the heat sink further comprises a heat conduction layer interposed between the first bottom plate and the second bottom plate, the heat conduction layer being made of thermal paste or thermal grease.