HOT MELT ADHESIVE SYSTEMS, ADHESIVE DEGRADATION DETECTION DEVICES, AND RELATED METHODS

• US 20140144933A1
• Filed: 03/12/2013
• Published: 05/29/2014
• Est. Priority Date: 11/29/2012
• Status: Abandoned Application

• Current Assignee: Nordson Corporation
• Original Assignee: Nordson Corporation
• Inventors: Estelle, Peter W., Gould, Mark A., Saidman, Laurence B.
• Application Number:
  US13/795,365
• Publication Number:
  US 20140144933A1
• Time in Patent Office: Days
• US Class Current: 222/23
• CPC Class Codes: B05C 11/1007 responsive to condition of liquid or other fluent material B05C11/1005 takes precedence
• CPC Class Codes: B05C 11/1042 provided with means for heating or cooling the liquid or other fluent material in the supplying means upstream of the applying apparatus
• CPC Class Codes: Y10T 137/0424 Liquid cleaning or flushing

Abstract

A hot melt adhesive system includes an adhesive supply and an adhesive supply heater associated with the adhesive supply for melting hot melt adhesive material into a liquid hot melt adhesive. An adhesive dispenser is fluidly coupled with the adhesive supply and includes an outlet for dispensing the liquid hot melt adhesive. A fluid passage extends from the adhesive supply to the outlet of the adhesive dispenser; and an adhesive degradation detection device is operatively coupled to the fluid passage. The adhesive degradation detection device includes an energy source for emitting energy into the liquid hot melt adhesive in the fluid passage. The adhesive degradation detection device further includes a detector configured for detecting attenuated energy that emerges from the liquid hot melt adhesive. A controller operatively coupled to the adhesive degradation detection device can determine a degradation condition of the liquid hot melt adhesive.

Claims

1. A hot melt adhesive system comprising:

an adhesive supply for receiving unmelted hot melt adhesive material,

an adhesive supply heater associated with the adhesive supply for melting the unmelted hot melt adhesive material into a liquid hot melt adhesive material,

at least one adhesive dispenser fluidly coupled with the adhesive supply and including an outlet for dispensing the liquid hot melt adhesive,

a fluid passage extending from the adhesive supply to the outlet of the adhesive dispenser; and

an adhesive degradation detection device operatively coupled to the fluid passage, the adhesive degradation detection device comprising;

an energy source configured for emitting energy into the liquid hot melt adhesive in the fluid passage, the energy becoming attenuated energy after emerging from the liquid hot melt adhesive,

a detector configured for detecting the attenuated energy, and

a controller operatively coupled to the adhesive degradation detection device and configured to determine an amount of attenuation of the energy to thereby determine a degradation condition of the liquid hot melt adhesive.

2. The hot melt adhesive system of claim 1, the adhesive degradation detection device being removably coupled with a component of the hot melt adhesive system.

3. The hot melt adhesive system of claim 1, the adhesive degradation detection device being permanently coupled with a component of the hot melt adhesive system.

4. The hot melt adhesive system of claim 1, the energy source including an LED light source.

5. The hot melt adhesive system of claim 4, the LED light source configured to produce energy having wavelengths shorter than about 550 nm.

6. The hot melt adhesive system of claim 1, further comprising:

an indicator operatively coupled with the controller and configured to present the degradation condition of the liquid hot melt adhesive to a user.

7. The hot melt adhesive system of claim 1, the adhesive degradation detection device further comprising a body having a fluid channel and an energy channel extending generally perpendicular to the fluid channel, the energy source and the detector positioned in the energy channel.

8. The hot melt adhesive system of claim 7, the adhesive degradation detection device further including an emitter window between the energy source and the fluid channel and a detector window between the detector and the fluid channel.

9. The hot melt adhesive system of claim 1, the detector including a photodiode.

10. An adhesive degradation detection device for use with a hot melt adhesive system configured for dispensing liquid hot melt adhesive, comprising:

a body having a fluid channel configured for communicating the liquid hot melt adhesive therethrough,

an energy source coupled with the body and configured for emitting energy into the liquid hot melt adhesive in the fluid channel, the energy becoming attenuated energy after emerging from the liquid hot melt adhesive, and

a detector coupled with the body and configured for detecting the attenuated energy and for detecting a degradation condition of the liquid hot melt adhesive.

11. The adhesive degradation detection device of claim 10, the energy source including an LED light source.

12. The adhesive degradation detection device of claim 11, the LED light source configured to produce energy having wavelengths shorter than about 550 nm.

13. The adhesive degradation detection device of claim 10, the body further comprising an energy channel extending generally perpendicular to the fluid channel, the energy source and the detector positioned in the energy channel.

14. The adhesive degradation detection device of claim 10, further including an emitter window between the energy source and the fluid channel and a detector window between the detector and the fluid channel.

15. The adhesive degradation detection device of claim 10, the detector including a photodiode.

16. A method of assessing the degradation of liquid hot melt adhesive in a hot melt adhesive system, comprising:

directing energy into the liquid hot melt adhesive,

detecting energy that emerges from the liquid hot melt adhesive.

17. The method of claim 16, wherein directing energy into the liquid hot melt adhesive includes directing energy using an LED light source.

18. The method of claim 17, wherein directing energy using an LED light source includes generating energy having wavelengths shorter than about 550 nm.

19. The method of claim 16, wherein energy that emerges from the liquid hot melt adhesive is attenuated energy, and wherein detecting energy includes detecting attenuated energy.

20. The method of claim 19, wherein directing energy into the liquid hot melt adhesive includes directing energy through an emitter window before directing energy into the liquid hot melt adhesive, and

wherein detecting attenuated energy includes directing the attenuated energy through a detector window before detecting the attenuated energy.

21. The method of claim 16, further comprising:

directing liquid hot melt adhesive through a passageway of an adhesive degradation detection device, and

directing energy through the liquid hot melt adhesive in the passageway.

22. The method of claim 16, further comprising:

determining a degradation condition of the liquid hot melt adhesive.

23. The method of claim 22, wherein determining a degradation condition includes determining the amount of attenuation of the energy caused by the liquid hot melt adhesive.

24. The method of claim 22, further comprising:

presenting information relating to the degradation condition using an indicator.

25. The method of claim 22, further comprising:

reducing the temperature of the liquid hot melt adhesive in response to the degradation condition of the liquid hot melt adhesive.

26. The method of claim 25, wherein reducing the temperature of the liquid hot melt adhesive includes reducing the temperature of a heater of the hot melt adhesive system.

27. The method of claim 25, further comprising:

increasing the temperature of the liquid hot melt adhesive after reducing the temperature of the liquid hot melt adhesive.

28. The method of claim 22, further comprising:

purging a portion of the liquid hot melt adhesive in response to the degradation condition of the liquid hot melt adhesive.

29. The method of claim 28, wherein purging a portion of the liquid hot melt adhesive includes purging substantially all of the liquid hot melt adhesive.

30. The method of claim 28, further comprising:

creating a new supply of liquid hot melt adhesive by melting unmelted solid or semi-solid hot melt adhesive material.

31. The method of claim 30, further comprising:

mixing the new supply with the liquid hot melt adhesive.

32. The method of claim 16, further comprising:

reducing the temperature of the liquid hot melt adhesive in response to detecting energy.

33. The method of claim 16, further comprising:

purging a portion of the liquid hot melt adhesive in response to detecting energy.