GLASS COMPOSITION, GLASS FRIT CONTAINING SAME, GLASS PASTE CONTAINING SAME, AND ELECTRICAL/ELECTRONIC COMPONENT OBTAINED USING SAME
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Abstract
The present invention aims at providing a lead-free glass composition that can be soften and flowed at a firing temperature that is equal to or lower than that of conventional low melting point lead glass. Furthermore, the present invention aims at providing a lead-free glass composition having fine thermal stability and fine chemical stability in addition to that property. The lead-free glass composition according to the present invention is characterized by comprising at least Ag2O, V2O5 and TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more. Preferably, the lead-free glass composition comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2.
37 Citations
35 Claims
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1-19. -19. (canceled)
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20. A lead-free glass composition, comprisingto 60 mass % of Ag2O, 5 to 65 mass % of V2O5, and 15 to 50 mass % of TeO2 when the components are represented by oxides,
wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more and less than 100 mass %, and further comprising one or more kind among P2O5, BaO, K2O, WO3, Fe2O3, MnO2, Sb2O3 and ZnO as a remnant by more than 0 mass % and 25 mass % or less.
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31. An electrical/electronic component having a sealing unit comprising a lead-free glass phase, wherein
the sealing unit comprises 50 to 100 vol % of the glass phase, and the glass phase comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5 and 15 to 50 mass % of TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more and less than 100 mass %, and the glass phase further comprises one or more kind among P2O5, BaO, K2O, WO3, Fe2O3, MnO2, Sb2O3 and ZnO as a remnant by more than 0 mass % and 25 mass % or less.
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32. An electrical/electronic component having an electrode/wiring comprising a lead-free glass phase and metal particles, wherein
the electrode/wiring comprises 5 to 30 vol % of the glass phase and 70 to 95 vol % of the metal particles, the metal particles are silver, a silver alloy, aluminum, an aluminum alloy, copper or a copper alloy, and the glass phase comprises 10 to 60 mass % of Ag2O, 5 to 65 mass % of V2O5 and 15 to 50 mass % of TeO2 when the components are represented by oxides, wherein the total content ratio of Ag2O, V2O5 and TeO2 is 75 mass % or more and less than 100 mass %, and the glass phase further comprises one or more kind among P2O5, BaO, K2O, WO3, Fe2O3, MnO2, Sb2O3 and ZnO as a remnant by more than 0 mass % and 25 mass % or less.
Specification