STRUCTURE FOR CONNECTING ELECTRICAL TRACE LINES OF PRINTED CIRCUIT BOARDS AND OPTICAL TRANSCEIVER MODULE WITH THE SAME

• US 20140147128A1
• Filed: 06/05/2013
• Published: 05/29/2014
• Est. Priority Date: 11/26/2012
• Status: Active Grant

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Han, Young-Tak, Shin, Jang Uk, Park, Sang Ho, Baek, Yongsoon
• Granted Patent: US 9,265,140 B2
• Time in Patent Office: Days
• US Class Current: 398/135
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0221 Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/142 Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/145 Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/09236 Parallel layout layout of balanced signal pairs H05K1/0245; superposed layout H05K2201/09672
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09727 Varying width along a single conductor; Conductors or pads having different widths
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component

Abstract

Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.

Claims

1. An electrical connection structure, comprising:

a first board body;

a first signal line extending along a first direction on the first board body;

first ground lines provided spaced apart from each other at both sides of the first signal line on the first board body to extend along the first direction;

via ground lines connected to the first ground lines through the first board body;

a ground plate provided below the first board body and connected to the via ground lines;

a second board body overlapped with the first board body;

second ground lines provided on the second board body and connected to the ground plate, the second ground lines extending along the first direction;

a second signal line provided between the second ground lines on the second board body to extend along the first direction, the first and second signal lines being not overlapped with each other; and

a first junction soldering connecting the second signal line with the first signal line.

2. The electrical connection structure of claim 1, wherein the first board body comprises a first margin region provided near a first edge thereof, and the ground plate is provided out of the first margin region.

3. The electrical connection structure of claim 2, wherein a width of the first margin region is 50 μ

m, when measured from the first edge.

4. The electrical connection structure of claim 1, wherein the second board body comprises a second margin region provided between the second ground lines, and the second signal line is provided out of the second margin region.

5. The electrical connection structure of claim 4, wherein a length of the margin region ranges from 700 μ

m to 1400 μ

m, when measured from a second edge of the second board body.

6. The electrical connection structure of claim 1, wherein the first junction soldering comprises at least one of a solder paste, a silver paste, or a bonding wire.

7. The electrical connection structure of claim 1, further comprising:

an upper cover layer provided on the first board body to cover the first ground lines and the first signal line; and

a lower cover layer provided below the first board body to cover the ground plate.

8. The electrical connection structure of claim 1, wherein the first ground lines and the second ground lines have first via holes and second via holes, respectively.

9. The electrical connection structure of claim 8, further comprising a second junction soldering filling the first and second via holes,

wherein the first via holes and the second via holes are aligned on the second board body, and

the second junction soldering connects the first ground lines with the second ground lines.

10. The electrical connection structure of claim 1, wherein the first board body comprises a dielectric layer.

11. The electrical connection structure of claim 10, wherein the dielectric comprises polyimide or teflon.

12. The electrical connection structure of claim 1, wherein the second board body comprises a polymeric dielectric material.

13. An optical transceiver module, comprising:

an optical transmitter/receiver part;

a signal processing unit configured to process electrical signals to be transmitted to or received from the optical transmitter/receiver part;

a first board body fixed to the optical transmitter/receiver part;

a first signal line provided on the first board body to extend from the optical transmitter/receiver part along a first direction;

first ground lines provided spaced apart from each other at both sides of the first signal line on the first board body to extend from the optical transmitter/receiver part along the first direction;

via ground lines connected to the first ground lines through the first board body;

a ground plate provided below the first board body and connected to the via ground lines;

a second board body overlapped with the first board body to fix the signal processing unit;

second ground lines provided on the second board body and connected to the ground plate, the second ground lines extending along the first direction;

a second signal line provided between the second ground lines on the second board body to extend along the first direction, the second signal line being not overlapped with the first signal line; and

a junction soldering connecting the second signal line with the first signal line.

14. The optical transceiver module of claim 13, wherein the optical transmitter/receiver part comprises at least one of laser diode or photodiode.

15. The optical transceiver module of claim 13, wherein the signal processing unit comprises at least one of a laser diode driver, an optical modulator driver, a pre-amplifier, a post-amplifier, or a clock-and-data recovery (CDR) circuit.