Chip Level Sensor with Multiple Degrees of Freedom
First Claim
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1. A sensing assembly device comprising:
- a substrate;
a chamber above the substrate;
a first piezoelectric gyroscope sensor positioned within the chamber; and
a first accelerometer positioned within the chamber.
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Abstract
A sensing assembly device includes a substrate, a chamber above the substrate, a first piezoelectric gyroscope sensor positioned within the chamber, and a first accelerometer positioned within the chamber.
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20 Claims
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1. A sensing assembly device comprising:
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a substrate; a chamber above the substrate; a first piezoelectric gyroscope sensor positioned within the chamber; and a first accelerometer positioned within the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming a sensing assembly device comprising:
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providing a substrate; forming a first piezoelectric gyroscope sensor above the substrate; forming a first accelerometer positioned above the substrate; and forming a chamber above the substrate such that the first piezoelectric gyroscope sensor and the first accelerometer are within the chamber. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification