PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
First Claim
Patent Images
1. A printed circuit board, comprising:
- a composite sheet including an insulating material and a glass plate bonded to the insulating material; and
a circuit layer formed on the composite sheet.
1 Assignment
0 Petitions
Accused Products
Abstract
Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet.
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Citations
18 Claims
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1. A printed circuit board, comprising:
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a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for manufacturing a printed circuit board, comprising:
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preparing a composite sheet in which a glass plate is bonded to an insulating material; forming a seed layer on the composite sheet; forming a plating resist having an opening for circuit formation on the seed layer; forming a plating layer in the opening by a plating process; and removing the plating resist. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification