INTEGRATED CIRCUITS AND SYSTEMS AND METHODS FOR PRODUCING THE SAME
First Claim
1. A method for producing integrated circuits, comprising:
- processing with a host processor of a computing device a digital model of said integrated circuit into a plurality of layers; and
iteratively forming said plurality of layers on a support with an additive manufacturing apparatus so as to produce an operable physical copy of said model;
wherein;
said integrated circuit includes at least one electronic component comprising at least one semiconductive region; and
said at least one semiconductive region is reproduced in said physical copy with at least one semiconductive organic material.
1 Assignment
0 Petitions
Accused Products
Abstract
Three dimensional integrated circuits including semiconductive organic materials are described. In some embodiments, the three dimensional integrated circuits include one or more electronic components that include a semiconductive region formed of one or more semiconductive organic materials. The electronic components of the three dimensional integrated circuits may also include insulating regions formed from organic insulating materials, and conductive regions form from conductive materials. The three dimensional integrated circuits may be formed by an additive manufacturing process such as three dimensional printing. Apparatus and methods for producing and testing three dimensional integrated circuits are also described.
84 Citations
45 Claims
-
1. A method for producing integrated circuits, comprising:
-
processing with a host processor of a computing device a digital model of said integrated circuit into a plurality of layers; and iteratively forming said plurality of layers on a support with an additive manufacturing apparatus so as to produce an operable physical copy of said model;
wherein;said integrated circuit includes at least one electronic component comprising at least one semiconductive region; and said at least one semiconductive region is reproduced in said physical copy with at least one semiconductive organic material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. A three dimensional printing apparatus, comprising:
-
a controller; a print head; and a materials store; wherein; said controller is configured to process a digital model of an integrated circuit into a plurality of layers with a host processor; said integrated circuit includes at least one electronic component comprising at least one semiconductive region; and said print head is configured to produce an operable physical copy of said integrated circuit by iteratively depositing on a support each of said plurality of layers using one or more materials contained in said materials store. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
-
- 21. A three dimensional integrated circuit comprising a plurality of electronic components, wherein at least one of said plurality electronic components comprises a semiconductive region formed from at least one semiconductive organic material.
-
30. A method for testing an integrated circuit, comprising:
- converting with a host processor of a computing device a first digital model of said integrated circuit to a second digital model of said integrated circuit, wherein;
said integrated circuit includes a plurality of electronic components that comprise one or more semiconductive regions; said first model designates the use of one or more inorganic semiconductive materials for said semiconductive regions; and said second digital model designates the use of one or more semiconductive organic materials for said semiconductive regions. - View Dependent Claims (31, 32, 33, 34, 35, 36, 37, 38, 39)
- converting with a host processor of a computing device a first digital model of said integrated circuit to a second digital model of said integrated circuit, wherein;
-
40. A computer readable medium having three dimensional model conversion (3DMC) instructions stored thereon, wherein said 3DMC instructions when executed by a processor cause said processor to perform the following operations comprising:
-
converting a first digital model of an integrated circuit to a second digital model of said integrated circuit, wherein; said integrated circuit includes a plurality of electronic components that comprise one or more semiconductive regions; said first model designates the use of one or more semiconductive inorganic materials for said semiconductive regions; and said second digital model designates the use of one or more semiconductive organic materials for said semiconductive regions. - View Dependent Claims (41, 42, 43, 44, 45)
-
Specification