TRANSMISSION LINE FOR AN INTEGRATED CIRCUIT PACKAGE
First Claim
Patent Images
1. An integrated chip (IC) package, comprising:
- a transmission line;
a first chip including a first radio frequency (RF) transceiver coupled to the transmission line; and
a second chip including a second RF transceiver coupled to the transmission line;
wherein the first and second RF transceivers are configured to communicate with one another by transmitting and receiving RF signals on the transmission line.
7 Assignments
0 Petitions
Accused Products
Abstract
Communication between chips is provided using a transmission line. Any one of the chips may tap into the transmission line, and communicate with another chip tapped into the transmission line by transmitting a radio frequency (RF) signal to the other chip via the transmission line or receiving an RF signal from the other chip via the transmission line. The transmission line may include a microstrip transmission line, a waveguide, a stripline transmission line, or another type of transmission line. The chips may use the transmission line to communicate data, control and/or clock signals with one another.
17 Citations
20 Claims
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1. An integrated chip (IC) package, comprising:
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a transmission line; a first chip including a first radio frequency (RF) transceiver coupled to the transmission line; and a second chip including a second RF transceiver coupled to the transmission line; wherein the first and second RF transceivers are configured to communicate with one another by transmitting and receiving RF signals on the transmission line. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An integrated chip (IC) package, comprising:
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a transmission line; a first chip including a first radio frequency (RF) transceiver coupled to the transmission line; a second chip including a second RF transceiver coupled to the transmission line; and a third chip including a third RF transceiver coupled to the transmission line; wherein the first, second and third RF transceivers are configured to communicate with one another by transmitting and receiving RF signals on the transmission line. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. An integrated chip (IC) package, comprising:
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a transmission line; a first tap coupled to the transmission line at a first position on the transmission line; a second tap coupled to the transmission line at a second position on the transmission line, the second position being spaced apart from the first position; and a chip, wherein the chip comprises; a radio frequency (RF) transceiver; a coupling switch configured to selectively couple the RF transceiver to the first tap and the second tap; and a controller configured to control the coupling switch. - View Dependent Claims (17, 18, 19, 20)
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Specification