IMPLANTABLE SENSOR ENCLOSURE WITH THIN SIDEWALLS

• US 20140155710A1
• Filed: 06/29/2012
• Published: 06/05/2014
• Est. Priority Date: 06/30/2011
• Status: Active Grant

• Current Assignee: Endotronix, Inc.
• Original Assignee: Endotronix, Inc.
• Inventors: Rowland, Harry D., Nagy, Michael
• Granted Patent: US 9,867,552 B2
• Time in Patent Office: Days
• US Class Current: 600/302
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting

Abstract

A wireless circuit includes a housing, such as a hermetic housing, and at least one antenna coil wound about a coil axis within the housing. The coil axis may be substantially parallel to at least one wall of the housing, wherein the wall parallel to the coil axis is substantially thinner than other walls of the housing.

Claims

1. A wireless circuit comprising:

a housing;

at least one antenna having an axis and positioned within said housing;

wherein said axis is substantially parallel to at least one wall of said housing; and

wherein said at least one wall is thinner than at least one wall of said housing that is not substantially parallel to said coil axis.

2. The wireless circuit of claim 1, wherein said housing has length, width and height dimensions, and wherein the length is greater than the housing'"'"'s width and height dimensions.

4. The wireless circuit of claim 1, wherein said wireless circuit is configured to measure pressure.

5. The wireless circuit of claim 4, wherein said substantially thinner wall is configured to deform in proportion to pressure exerted on it.

6. The wireless circuit of claim 1, wherein said wireless circuit contains a battery.

7. The wireless circuit of claim 1, wherein said at least one wall which is substantially parallel to said coil axis comprises a material selected from a group including:

sapphire, fused silica, quartz, glass, ceramic, titanium, alumina, silicon, diamond, and polymer.

8. The wireless circuit of claim 1, wherein said at least one wall which is substantially parallel to said coil axis is created by forming a cavity in at least one part of said housing prior to bonding said at least one part to other parts of said housing.

9. The wireless circuit of claim 1, wherein said at least one wall which is substantially parallel to said coil axis is created by bonding a material to said housing.

10. The wireless circuit of claim 1, wherein said at least one wall which is substantially parallel to said coil axis is created by thinning at least a portion of said wall after parts of said housing have been bonded together.

11. The wireless circuit of claim 1, wherein portions of said housing are bonded together by a process selected from a group including:

laser welding, glass frit bonding, laser frit welding, compression bonding, anodic bonding, eutectic bonding, brazing, or soldering.

13. The wireless circuit of claim 1, wherein a portion of said wireless circuit serves as one of the walls of said housing that is not substantially parallel to said coil axis.

14. The wireless circuit of claim 1, wherein a portion of said wireless circuit is disposed on one of the walls of said housing that is not substantially parallel to said coil axis.

15. The wireless circuit of claim 1, wherein a portion of said wireless circuit is disposed in a portion of said housing separate from the portion that contains said antenna coil.

16. The wireless circuit of claim 1, wherein said housing is filled with a substance selected from a group including:

liquid, gel, vacuum, inert gas, or air.

22. The wireless circuit of claim 1, wherein said antenna having an axis includes a coil.

3. (canceled)

12. (canceled)

17-21. -21. (canceled)