OPTICAL COUPLING DEVICE

• US 20140159062A1
• Filed: 12/11/2013
• Published: 06/12/2014
• Est. Priority Date: 12/11/2012
• Status: Abandoned Application

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Electronics Corporation
• Inventors: NOMURA, Yukio
• Application Number:
  US14/102,784
• Publication Number:
  US 20140159062A1
• Time in Patent Office: Days
• US Class Current: 257/84
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48639 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48647 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48824 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48839 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/48844 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48847 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 : Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 23/4952 : the additional leads being a bump or a wire
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/167 : the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

A optical coupling device includes a first lead frame; a light emitting device installed on the first lead frame; a light receiving device configured to receive an optical signal outputted from the light emitting device; a translucent silicon-based resin layer which covers the light emitting device; and a conductive wire connecting the first lead frame and the light emitting device. The conductive wire is formed of a material which contains silver.

Claims

1. An optical coupling device comprising:

a first lead frame;

a light emitting device installed on the first lead frame;

a light receiving device configured to receive an optical signal outputted from the light emitting device;

a translucent silicon-based resin layer disposed to cover the light emitting device; and

a conductive wire disposed to connect the first lead frame and the light emitting device,

wherein the conductive wire is formed of a material which contains silver.

2. The optical coupling device according to claim 1, wherein the silicon-based resin layer is disposed to cover the conductive wire fully.

3. The optical coupling device according to claim 1, wherein the conductive wire contains silver of 50 weight % or more.

4. The optical coupling device according to claim 1, wherein the silicon-based resin layer is disposed to cover the light emitting device and the light receiving device.

5. The optical coupling device according to claim 1, further comprising:

a second lead frame on which the light receiving device is installed,

wherein the first lead frame has a first opposing region, and the second lead frame has a second opposing region,

wherein the first lead frame and the second lead frame are arranged such that the first opposing region opposes to the second opposing region, and

wherein the light emitting device is installed in the first opposing region, and the light receiving device is installed in the second opposing region.

6. The optical coupling device according to claim 1, further comprising:

a second lead frame on which the light receiving device is installed,

wherein the first lead frame has a first installation region on which the light emitting device is installed,

wherein the second lead frame has a second installation region on which the light receiving device is installed, and

wherein the first lead frame and the second lead frame are arranged such that the first installation region and the second installation region are located on a same plane.

7. The optical coupling device according to claim 1, further comprising:

a light-blocking layer disposed to cover the silicon-based resin layer and to reflect light emitted from the light emitting device.

8. The optical coupling device according to claim 1, further comprising:

a light-blocking layer disposed to cover the silicon-based resin layer and to absorb light.

9. The optical coupling device according to claim 1, wherein the silicon-based resin layer has a compound which contains a siloxane bond and a hydroxyl group.

10. The optical coupling device according to claim 1, wherein the first lead frame comprises a first part and a second part,

wherein the first part and the second part are arranged on a same plane to be separated from each other,

wherein the light emitting device is disposed on a surface of the first part,

wherein the conductive wire is connected with a surface of the second part at one end and is connected with the light emitting device at the other end,

wherein the silicon-based resin layer is disposed on the first part surface and the second part surface to cover a region between the first part and the second part, and

wherein an interval between the first part and the second part has a size by which the silicon-based resin layer does not go around to back sides of the first part and the second part at a time of supply of the silicon-based resin layer or during a period from the supply to a hardening.

11. The optical coupling device according to claim 1, further comprising:

a polyimide-based insulating film disposed between the light emitting device and the light receiving device.