SYSTEMS AND METHODS FOR FRACTURE DETECTION IN AN INTEGRATED CIRCUIT

• US 20140159764A1
• Filed: 12/12/2012
• Published: 06/12/2014
• Est. Priority Date: 12/12/2012
• Status: Abandoned Application

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Al-Dahle, Ahmad, Wurzel, Joshua G., Bi, Yafei
• Application Number:
  US13/712,628
• Publication Number:
  US 20140159764A1
• Time in Patent Office: Days
• US Class Current: 324/762.01
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66

Abstract

Systems, methods, and devices are provided to identify the occurrence, location, and/or severity of a fracture within an integrated circuit, even when the integrated circuit is not accessible to external inspection. One such method includes obtaining a measurement of a property of the integrated circuit through at least one contact of the integrated circuit. The measurement may include a resistance of a resistive pattern in the integrated circuit or a measurement of current-voltage behavior of a power supply of the integrated circuit. The measurement of the property may be compared to an expected baseline property. Based at least in part on this comparison, whether a fracture of the integrated circuit has occurred and a location of the fracture in the integrated circuit may be determined.

Claims

1. A method comprising:

obtaining a measurement of a property of an integrated circuit through at least one contact of the integrated circuit, wherein the measurement comprises a measurement of a resistance of a resistive pattern in the integrated circuit or a measurement of current-voltage behavior of a power supply of the integrated circuit;

comparing the measurement of the property to an expected baseline property; and

determining whether a fracture of the integrated circuit has occurred and a location of the fracture in the integrated circuit based at least in part on the comparison.

2. The method of claim 1, wherein:

the measurement of the property comprises the measurement of the resistance of the resistive pattern in the integrated circuit;

the expected baseline property comprises a resistance that is expected when the resistive pattern is not interrupted by the fracture; and

the fracture is determined to have occurred when the resistance of the resistive pattern in the integrated circuit substantially does not match the resistance that is expected when the resistive pattern is not interrupted by the fracture.

3. The method of claim 1, comprising, when the fracture has been determined to have occurred, determining a region of the integrated circuit where the fracture has occurred based at least in part on a difference between the measurement of the resistance of the resistive pattern in the integrated circuit and the resistance that is expected when the resistive pattern is not interrupted by the fracture.

4. The method of claim 1, wherein:

the measurement of the property comprises the measurement of current-voltage behavior;

the expected baseline property comprises an expected baseline current-voltage behavior; and

the fracture is determined to have occurred when the measurement of current-voltage behavior substantially does not match the expected baseline current-voltage behavior.

5. The method of claim 1, comprising, when the fracture is determined to have occurred, determining a region of the integrated circuit where the fracture has occurred based at least in part on which power supply is measured to have the measurement of current-voltage behavior that substantially does not match the expected baseline current-voltage behavior.

6. The method of claim 1, comprising, when the fracture has occurred, determining a region of the integrated circuit where the fracture has occurred based at least in part on the comparison.

7. One or more articles of manufacture comprising a non-transitory machine-readable media storing instructions to:

(a) receive a measurement of a behavior of a component of a display driver of an electronic display of an electronic device; and

(b) determine a location of a fracture in the display driver when the fracture has occurred based at least in part on the measurement of the behavior.

8. The one or more articles of manufacture of claim 7, comprising instructions to perform instructions (a) and (b) when a potentially damaging event occurs in the electronic device.

9. The one or more articles of manufacture of claim 8, comprising instructions to identify an indication of rapid motion from a motion sensor as the occurrence of the potentially damaging event.

10. The one or more articles of manufacture of claim 8, comprising instructions to identify an indication of a temperature measurement from a temperature sensor that falls outside a threshold range as the occurrence of the potentially damaging event.

11. The one or more articles of manufacture of claim 8, comprising instructions to identify that another component of the electronic device has failed to represent the occurrence of the potentially damaging event.

12. The one or more articles of manufacture of claim 7, comprising instructions to store an indication of the location of the fracture on storage of the electronic device or send the indication of the location of the fracture to a network location, or both.

13. An electronic device comprising:

a processor configured to generate image data; and

an electronic display configured to display the image data, wherein the electronic display comprises;

a display panel;

display driver circuitry configured to program the image data on the display panel, wherein the display driver circuitry comprises a first component whose behavior is configured to vary based at least in part on whether a fracture has occurred in the display driver circuitry; and

measurement circuitry configured to perform a measurement of the behavior of the first component of the display driver circuitry;

wherein the processor or the electronic display comprises fracture analysis logic configured to configured to determine, based at least in part on the measurement of the behavior of the first component of the display driver circuitry;

whether the fracture has occurred; and

when the fracture has occurred, a region of the display driver circuitry where the fracture has occurred.

14. The electronic device of claim 13, wherein the first component of the display driver circuitry comprises a resistive pattern configured to be measured to have a different resistive behavior when the fracture occurs in different regions of the display driver circuitry.

15. The electronic device of claim 13, wherein the first component of the display driver circuitry comprises a resistive pattern configured to be measured from two test points disposed in a first region, wherein the resistive behavior measured between the two test points is configured to be a highest resistance when the fracture occurs in the first region and to be progressively lower resistances at regions farther from the first region.

16. The electronic device of claim 13, wherein the first component of the display driver circuitry comprises a plurality of power supply connections, wherein each of the power supply connections has a respective spatial relationship to a voltage controlled positive inductance (VCPL) backplane, and wherein measured current-voltage behaviors of the plurality of power supply connections are configured to vary from respective baseline current-voltage behaviors when a fracture has occurred that occurs between the power supply connection and the VCPL backplane.

17. The electronic device of claim 13, wherein the fracture analysis logic comprises instructions executed by the processor of the electronic device.

18. The electronic device of claim 13, wherein the fracture analysis logic comprises instructions executed by a microcontroller of the electronic display.

19. The electronic device of claim 13, wherein the fracture analysis logic comprises an application specific integrated circuit of the electronic display.

20. The electronic device of claim 13, wherein the electronic device comprises a desktop computer, a notebook computer, a tablet computer, a handheld device, a portable media device, a cellular phone, or any combination thereof.

21. A method comprising:

measuring current-voltage behavior of a plurality of power supply connections of an integrated circuit;

comparing the measured current-voltage behavior of the plurality of power supply connections to respective baseline current-voltage behavior of the plurality of power supply connections; and

identifying whether a fracture has occurred in the integrated circuit based at least in part on the comparison.

22. The method of claim 21, wherein the fracture is identified as having occurred in the integrated circuit when the measured current-voltage behavior of at least one of the plurality of power supply connections does not substantially match the respective baseline current-voltage behavior of the at least one of the plurality of power supply connections.

23. The method of claim 21, comprising, when the fracture is identified as having occurred in the integrated circuit, identifying a region within the integrated circuit where the fracture has occurred based at least in part on which of the measured current-voltage behavior of the plurality of power supply connections differs from the respective baseline current-voltage behavior of the plurality of power supply connections.

24. The method of claim 21, wherein the measured current-voltage behavior is a relationship between the plurality of power supply connections and a voltage controlled positive inductance (VCPL) backplane of the integrated circuit.

25. The method of claim 24, wherein each power supply connection relates to the VCPL backplane through a respective p-n junction, wherein the measured current-voltage behavior of the p-n junction is configured to differ from its respective baseline current-voltage behavior at least when a fracture crosses the p-n junction.

26. The method of claim 21, wherein the integrated circuit comprises a component of an electronic device, wherein the component is installed so as to be inaccessible to external inspection.

27. The method of claim 21, wherein the integrated circuit comprises a display driver.

28. The method of claim 21, wherein the integrated circuit is hidden from external observation by a shield can or a heat sink, or both.

29. A method comprising:

providing an electronic display, wherein the electronic display comprises display driver circuitry inaccessible to external inspection;

measuring a behavior of the display driver circuitry to obtain a first measurement of the behavior of the display driver circuitry;

detecting whether a fracture has occurred in the display driver circuitry based at least in part on the first measurement of the behavior of the display driver circuitry; and

when the fracture is detected to have occurred in the display driver circuitry, detecting a region of the display driver circuitry where the fracture has occurred based at least in part on the first measurement of the behavior of the display driver circuitry.

30. The method of claim 29, wherein measuring the behavior of the display driver circuitry comprises to obtain the first measurement comprises measuring a current-voltage behavior of each of a plurality of power supply connections of the display driver circuitry, and wherein detecting the region of the fracture occurring in the display driver circuitry comprises comparing the measured current-voltage behavior of each of the plurality of power supply connections to respective expected baseline current-voltage behavior.

31. The method of claim 29, wherein measuring the behavior of the display driver circuitry to obtain the first measurement comprises measuring a resistance of a resistive pattern of the display driver circuitry, and wherein detecting the region of the fracture occurring in the display driver circuitry comprises comparing the measured resistance to resistances expected when the fracture occurs in different regions in the display driver circuitry.

32. The method of claim 29, comprising, when the fracture is not detected to have occurred based at least in part on the first measurement, installing the electronic display into an electronic device.

33. The method of claim 32, comprising, after the electronic display has been installed into the electronic device:

measuring the behavior of the display driver circuitry to obtain a second measurement of the behavior of the display driver circuitry;

detecting whether the fracture has occurred in the display driver circuitry based at least in part on the second measurement of the behavior of the display driver circuitry; and

when the fracture is detected to have occurred in the display driver circuitry, detecting the region of the display driver circuitry where the fracture has occurred based at least in part on the second measurement of the behavior of the display driver circuitry.

34. The method of claim 29, wherein measuring the behavior of the display driver circuitry comprises measuring a resistance of a flexible printed circuit that provides connections to the display driver circuitry.