INTERPOSER TESTING DEVICE AND METHOD THEREOF

• US 20140160269A1
• Filed: 03/28/2013
• Published: 06/12/2014
• Est. Priority Date: 12/07/2012
• Status: Abandoned Application

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Yeh, Ka-Yi, Chien, Jui-Hung
• Application Number:
  US13/852,083
• Publication Number:
  US 20140160269A1
• Time in Patent Office: Days
• US Class Current: 348/87
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates

Abstract

The disclosure provides an interposer testing device for testing an interposer and a method thereof which includes a heat source, a thermal image capturing device and a comparing device. The heat source is adapted for heating an area to be tested on the interposer. The thermal image capturing device is adapted for capturing a thermal image of the interposer after the interposer is heated. The comparing device is adapted for comparing the thermal image with a standard thermal image to output a comparison result.

Claims

1. An interposer testing device for testing an interposer, the interposer testing device comprising:

a heat source for heating an area to be tested on the interposer;

a thermal image capturing device for capturing a thermal image of the interposer after the interposer is heated; and

a comparing device for comparing the thermal image with a standard thermal image to output a comparison result.

2. The interposer testing device according to claim 1, wherein the interposer includes a plurality of metal wires interconnected with each other.

3. The interposer testing device according to claim 2, wherein the area to be tested is an area of the plurality of metal wires.

4. The interposer testing device according to claim 2, wherein the standard thermal image is a thermal image of the metal wires when the plurality of metal wires are normally interconnected with each other.

5. The interposer testing device according to claim 1, wherein the interposer includes a plurality of vertical leads.

6. The interposer testing device according to claim 5, wherein the area to be tested is an area of the plurality of vertical leads.

7. The interposer testing device according to claim 5, wherein the standard thermal image is a thermal image of the plurality of vertical leads when the plurality of vertical leads are normally disposed.

8. The interposer testing device according to claim 1, wherein the interposer includes a plurality of through silicon vias.

9. The interposer testing device according to claim 8, wherein the area to be tested is an area of the plurality of through silicon vias.

10. The interposer testing device according to claim 8, wherein the standard thermal image is a thermal image of the interposer when an electrical conductive material in the through silicon vias comply with a predetermined quality.

11. The interposer testing device according to claim 1, wherein the heat source is a laser, a microwave or a focus light source.

12. The interposer testing device according to claim 1, wherein the heat source heats up the interposer for at least ten microseconds.

13. The interposer testing device according to claim 1, wherein the area to be tested is smaller than an area of the interposer.

14. An interposer testing method for testing an interposer, comprising steps of:

heating an area to be tested on the interposer by a heat source;

capturing a thermal image of the interposer after the interposer is heated; and

comparing the thermal image with a standard thermal image to output a comparison result.

15. The interposer testing method according to claim 14, wherein the interposer includes a plurality of metal wires interconnected with each other.

16. The interposer testing method according to claim 15, wherein the area to be tested is an area of the plurality of metal wires.

17. The interposer testing method according to claim 15, wherein the standard thermal image is a thermal image of the plurality of metal wires interconnected with each other.

18. The interposer testing method according to claim 14, wherein the interposer includes a plurality of vertical leads.

19. The interposer testing method according to claim 18, wherein the area to be tested is an area of the plurality of vertical leads.

20. The interposer testing method according to claim 18, wherein the standard thermal image is a thermal image of the vertical leads when the vertical leads are normally disposed.

21. The interposer testing method according to claim 14, wherein the interposer includes a plurality of through silicon vias.

22. The interposer testing method according to claim 21, wherein the area to be tested is an area of the plurality of through silicon vias.

23. The interposer testing method according to claim 21, wherein the standard thermal image is a thermal image of the interposer when an electrical conductive material in the through silicon vias comply with a predetermined quality.

24. The interposer testing method according to claim 14, wherein the heat source is a laser, a microwave or a focus light source.

25. The interposer testing method according to claim 14, wherein the heat source heats up the interposer for at least ten microseconds.

26. The interposer testing method according to claim 14, wherein the area to be tested is smaller than an area of the interposer.