LOW PROFILE HEAT SPREADER AND METHODS

• US 20140160673A1
• Filed: 12/06/2012
• Published: 06/12/2014
• Est. Priority Date: 12/06/2012
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Sauciuc, Ioan
• Granted Patent: US 9,293,428 B2
• Time in Patent Office: Days
• US Class Current: 361/679.54
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29393 with a principal constituent of the material being a solid not provided for in groups H01L2224/293 - H01L2224/29391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15159 Side view
• CPC Class Codes: H01L 2924/15162 Top view
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15724 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent

Abstract

Embodiments of semiconductor chip assemblies, and methods are shown that include adhesive thermal interface materials between a heat spreader and a semiconductor die. Assemblies and methods are shown where the heat spreader is not adhered to a substrate beneath the semiconductor die.

Claims

1. A semiconductor chip assembly, comprising:

a semiconductor die attached to a substrate;

a heat spreader located over the semiconductor chip, the heat spreader including;

a planar portion substantially covering the semiconductor die;

two or more structures extending from the planar portion and contacting the substrate;

an adhesive thermal interface layer forming heat conducting interfaces with both the semiconductor die and the heat spreader.

2. The semiconductor chip assembly of claim 1, wherein the two or more structures extending from the planar portion abut the substrate, but are not attached to the substrate.

3. The semiconductor chip assembly of claim 1, wherein the adhesive thermal interface layer includes a cured matrix material.

4. The semiconductor chip assembly of claim 1, wherein the adhesive thermal interface layer includes a pressure sensitive adhesive.

5. The semiconductor chip assembly of claim 1, wherein the heat spreader is substantially formed from copper.

6. The semiconductor chip assembly of claim 1, wherein the heat spreader is a composite layered heat spreader.

7. The semiconductor chip assembly of claim 1, further including a second thermal interface material on a side of the heat spreader opposite the semiconductor die.

8. The semiconductor chip assembly of claim 1, wherein the semiconductor die includes a system on a chip (SOC).

9. The semiconductor chip assembly of claim 1, wherein the substrate includes one or more die side capacitors.

10. The semiconductor chip assembly of claim 1, wherein the two or more structures include two long legs on opposite sides of the planar portion.

11. The semiconductor chip assembly of claim 1, wherein the two or more structures include four corner legs.

12. A tablet computer, comprising:

a metallic chassis;

a display screen coupled to the metallic chassis, with a space between the metallic chassis and the display screen containing a semiconductor chip assembly, including;

a semiconductor die attached to a substrate;

a heat spreader located over the semiconductor chip, the heat spreader including;

a planar portion substantially covering the semiconductor die;

two or more structures extending from the planar portion and contacting the substrate;

an adhesive thermal interface layer forming heat conducting interfaces with both the semiconductor die and the heat spreader; and

a second thermal interface material forming heat conducting interfaces with both the heat spreader and the metallic chassis.

13. The tablet computer of claim 12, wherein the two or more structures extending from the planar portion abut the substrate, but are not attached to the substrate.

14. The tablet computer of claim 12, wherein the heat spreader is substantially formed from copper.

15. The tablet computer of claim 12, wherein the heat spreader is a composite layered heat spreader.

16. A method of assembling a semiconductor chip assembly, comprising:

placing a planar portion of a heat spreader over a semiconductor die on a substrate;

controlling a space between the planar portion of the heat spreader and the substrate using two or more structures extending from the planar portion; and

adhering the planar portion of the heat spreader to the semiconductor die using an adhesive thermal interface material.

17. The method of claim 16, wherein adhering the planar portion of the heat spreader to the semiconductor die using an adhesive thermal interface material includes adhering using a curable thermal interface material.

18. The method of claim 16, wherein adhering the planar portion of the heat spreader to the semiconductor die using an adhesive thermal interface material includes peeling off a protective film covering the adhesive thermal interface material and placing the planar portion of the heat spreader in contact with the semiconductor die.

19. The method of claim 18, further including peeling off a second protective film covering a second adhesive thermal interface material located on a side of the planar portion of the heat spreader opposite the semiconductor die;

and

adhering the second adhesive thermal interface material to a second heat spreader.

20. The method of claim 19, wherein adhering the second adhesive thermal interface material to the second heat spreader includes adhering the second adhesive thermal interface material to a tablet computer chassis.