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FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

  • US 20140162406A1
  • Filed: 06/17/2013
  • Published: 06/12/2014
  • Est. Priority Date: 12/07/2012
  • Status: Active Grant
First Claim
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1. A method of transferring semiconductor elements, the method comprising:

  • forming a plurality of vertical semiconductor elements on a substrate;

    forming an inorganic insulating layer on a surface of each of the plurality of vertical semiconductor elements and attaching an OH group on a surface of the inorganic insulating layer;

    forming an amphipathic layer on the surface of the inorganic insulating layer;

    applying a polymerizable composition on top of the plurality of vertical semiconductor elements coated with the amphipathic layer;

    curing the applied polymerizable composition thereby converting the applied polymerizable composition into a resin layer such that the plurality of vertical semiconductor elements are embedded in the resin layer;

    separating the resin layer along with the plurality of vertical semiconductor elements from the substrate; and

    etching a portion of the resin layer such that an upper portion of each of the plurality of vertical semiconductor elements is exposed.

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