FLEXIBLE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A method of transferring semiconductor elements, the method comprising:
- forming a plurality of vertical semiconductor elements on a substrate;
forming an inorganic insulating layer on a surface of each of the plurality of vertical semiconductor elements and attaching an OH group on a surface of the inorganic insulating layer;
forming an amphipathic layer on the surface of the inorganic insulating layer;
applying a polymerizable composition on top of the plurality of vertical semiconductor elements coated with the amphipathic layer;
curing the applied polymerizable composition thereby converting the applied polymerizable composition into a resin layer such that the plurality of vertical semiconductor elements are embedded in the resin layer;
separating the resin layer along with the plurality of vertical semiconductor elements from the substrate; and
etching a portion of the resin layer such that an upper portion of each of the plurality of vertical semiconductor elements is exposed.
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Abstract
Provided is a method of transferring semiconductor elements formed on a non-flexible substrate to a flexible substrate. Also, provided is a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. A semiconductor element grown or formed on the substrate may be efficiently transferred to the resin layer while maintaining an arrangement of the semiconductor elements. Furthermore, the resin layer acts as a flexible substrate supporting the vertical semiconductor elements.
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Citations
37 Claims
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1. A method of transferring semiconductor elements, the method comprising:
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forming a plurality of vertical semiconductor elements on a substrate; forming an inorganic insulating layer on a surface of each of the plurality of vertical semiconductor elements and attaching an OH group on a surface of the inorganic insulating layer; forming an amphipathic layer on the surface of the inorganic insulating layer; applying a polymerizable composition on top of the plurality of vertical semiconductor elements coated with the amphipathic layer; curing the applied polymerizable composition thereby converting the applied polymerizable composition into a resin layer such that the plurality of vertical semiconductor elements are embedded in the resin layer; separating the resin layer along with the plurality of vertical semiconductor elements from the substrate; and etching a portion of the resin layer such that an upper portion of each of the plurality of vertical semiconductor elements is exposed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of transferring semiconductor elements, the method comprising:
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forming a plurality of vertical semiconductor elements on a substrate; forming an inorganic insulating layer on a surface of each of the plurality of vertical semiconductor elements and attaching an OH group on a surface of the inorganic insulating layer; forming an amphipathic layer on a surface of the inorganic insulating layer; applying a polymerizable composition on top of the vertical semiconductor elements coated with the amphipathic layer; compressing a support layer on the applied polymerizable composition; curing the applied polymerizable composition thereby converting the applied polymerizable composition into a resin layer such that the plurality of vertical semiconductor elements are embedded in the resin layer; separating the support layer, along with the resin layer and the plurality of vertical semiconductor elements, from the substrate; removing the support layer; and etching a portion of the resin layer such that an upper portion of each of the plurality of vertical semiconductor elements is exposed. - View Dependent Claims (30, 31, 32, 33, 34, 35)
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36. A method of manufacturing a flexible semiconductor element, the method comprising:
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preparing a flexible laminate comprising;
a resin layer;
a plurality of vertical semiconductor elements embedded in the resin layer, wherein an upper portion of each of the plurality of vertical semiconductor elements is exposed above the resin layer, and a bottom portion of each of the plurality of vertical semiconductor elements is exposed below the resin layer;forming an upper electrode on an upper surface of the flexible laminate, wherein the upper electrode is electrically connected to the plurality of vertical semiconductor elements; and forming a bottom electrode electrically on a bottom surface of the flexible laminate, wherein the bottom electrode is electrically connected to the plurality of vertical semiconductor elements. - View Dependent Claims (37)
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Specification