HEAT DISSIPATING DEVICE USING HEAT PIPE

• US 20140166239A1
• Filed: 02/26/2014
• Published: 06/19/2014
• Est. Priority Date: 10/08/2007
• Status: Abandoned Application

• Current Assignee: Zaonzi Co., Ltd.
• Original Assignee: Zaonzi Co., Ltd.
• Inventors: Lee, Sangcheol
• Application Number:
  US14/190,763
• Publication Number:
  US 20140166239A1
• Time in Patent Office: Days
• US Class Current: 165/104.13
• CPC Class Codes: F21V 29/51 using condensation or evaporation of a fluid, e.g. heat pipes
• CPC Class Codes: F21V 29/67 characterised by the arrangement of fans
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: F28D 15/02 in which the medium condenses and evaporates, e.g. heat pipes heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28F 2250/08 Fluid driving means, e.g. pumps, fans
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

There is provided a heat dissipating device using a heat pipe. The heat dissipating device includes a plurality of unit pipe loops. Each unit pipe loop includes: a heat absorbing part arranged adjacent to a heat source; and a heat dissipating part which is connected with the heat absorbing part and dissipates heat transferred from the heat absorbing part. A working fluid is to be provided inside the heat absorbing part and the heat dissipating part. The plurality of unit pipe loops being arranged radially with respect to the heat source.

Claims

1. A heat dissipating device comprising:

a plurality of unit pipe segments, and

a working fluid in each unit pipe segment;

each unit pipe segment being a capillary tube heat pipe without a wick and consisting of a heat absorbing pipe part adjacent to a heat source and a heat dissipating pipe part in communication with the heat absorbing pipe part;

the plurality of unit pipe segments being arranged to radially surround the heat source and being connected to each other to form a single loop; and

the working fluid present in the heat absorbing pipe part being capable of generating bubbles when exposed to heat from the heat source.

2. The heat dissipating device according to claim 1, further comprising an auxiliary pipe segment which is disposed between the neighboring unit pipe segments and supports heat dissipation and

a heat dissipating member which is coupled to each unit pipe segment,

wherein the length of each unit pipe segment is longer than a shortest straight line in a radial direction between the heat source and the heat dissipating pipe part of the unit pipe segment,

wherein the heat dissipating pipe part comprises:

a first heat dissipating part which is connected with the heat absorbing pipe part and is arranged radially to have a length longer than shortest straight line in a radial direction between the heat source and the heat dissipating pipe part of the unit pipe segment;

a second heat dissipating part which is connected with the first heat dissipating part and forms an outer circumferential perimeter of each unit pipe segment; and

at least one projection part between the first heat dissipating part and the second heat dissipating part,

wherein at least one end part of each unit pipe segment is connected with a neighboring unit pipe segment,

wherein the heat dissipating member comprises a guide part which guides flow of the dissipated heat.

3. The heat dissipating device according to claim 1, further comprising a holder,

the plurality of unit pipe segments being between the holder and the mount and

a fan which is installed adjacent to the heat dissipating pipe part.

4. The heat dissipating device according to claim 1, wherein the heat absorbing pipe part or the heat dissipating pipe part of each unit pipe segment comprises a first pipe member and a second pipe member which have a first end part and a second end part, respectively, and wherein the first end part of the first pipe member is coupled to the first end part of the second pipe member, and the second end part of the first pipe member is coupled to the second end part of the second pipe member of the neighboring unit pipe segment,

wherein one of the end parts of the first pipe member and the end parts of the second pipe member, which are coupled each other, are expanded in diameter,

wherein the end parts of the first pipe member and the second pipe member are coupled each other by soldering.

5. The heat dissipating device according to claim 1, wherein the plurality of unit pipe segments is connected with each other to form a single closed loop.