PACKAGE-ON-PACKAGE BASED INTEGRATED CIRCUIT CHIP IMAGER

• US 20140166759A1
• Filed: 09/20/2013
• Published: 06/19/2014
• Est. Priority Date: 09/25/2012
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International, Inc. doing business as Honeywell Scanning & Mobility
• Inventors: Liu, Yong, Smith, Taylor, Wang, Ynjiun Paul, Tao, Xi
• Granted Patent: US 9,082,031 B2
• Time in Patent Office: Days
• US Class Current: 235/462.21
• CPC Class Codes: G06K 7/10732 Light sources
• CPC Class Codes: G06K 7/10881 constructional details of hand-held scanners
• CPC Class Codes: G06K 7/1098 the scanning arrangement having a modular construction

Abstract

An apparatus for use in decoding a bar code symbol includes a first integrated circuit chip with a wafer level camera, at least one light source, and a plurality of contact pads on a surface of the chip and a second integrated circuit chip with a processor, memory, plurality of contact pads on a surface of the chip, and plurality of contact pads on another surface of the chip. The apparatus includes a PCB having a plurality of contact pads disposed on at least one surface of the PCB and wherein the first and second integrated circuit chips are vertically stacked on the PCB and the plurality of contact pads on the first and second integrated circuit chips interface with the contact pads of the second integrated circuit chip and PCB. The apparatus is operative for processing image signals generated by the WLC for attempting to decode the bar code symbol.

Claims

1. An apparatus for use in decoding a bar code symbol, the apparatus comprising:

a first integrated circuit chip having a wafer level camera with a sensor and a lens, at least one light source, and a plurality of contact pads disposed on a first surface of the first integrated circuit chip;

a second integrated circuit chip having a processor, a memory, a plurality of contact pads disposed on a first surface of the second integrated circuit chip, and a plurality of contact pads disposed on a second surface of the second integrated circuit chip;

a printed circuit board having a plurality of contact pads disposed on at least one surface of the printed circuit board;

wherein the first integrated circuit chip and the second integrated circuit chip are stacked in an X-Y plane on the printed circuit board in a manner that the plurality of contact pads on the first integrated circuit chip define an interface with the plurality of contact pads on the second integrated circuit chip to allow a communication of signals between the first integrated circuit chip and the second integrated circuit chip, and the plurality of contact pads on the second integrated circuit chip define an interface with the plurality of contact pads on the printed circuit board to allow a communication of signals between the first integrated circuit chip, second integrated circuit chip, and printed circuit board; and

wherein the apparatus is operative for processing of image signals generated by the wafer level camera for attempting to decode the bar code symbol.

2. The apparatus of claim 1, wherein the printed circuit board has a first side and a second side.

3. The apparatus of claim 2, wherein the first integrated circuit chip is mounted on the second integrated circuit chip and the second integrated circuit chip is mounted on the first side of the printed circuit board.

4. The apparatus of claim 2, wherein the first integrated circuit chip is mounted on the second integrated circuit chip and the second integrated circuit chip is mounted on the second side of the printed circuit board.

5. The apparatus of claim 1, further comprising a hand held housing encapsulating the first integrated circuit chip, the second integrated circuit chip, and the printed circuit board.

6. The apparatus of claim 5, wherein the processing of image signals generated by the wafer level camera for attempting to decode the bar code symbol is performed within the hand held housing.

7. The apparatus of claim 5, wherein the processing of image signals generated by the wafer level camera for attempting to decode the bar code symbol is performed by circuitry external to the housing.

8. The apparatus of claim 5, wherein the processing of image signals generated by the wafer level camera for attempting to decode the bar code symbol is performed by a circuit disposed on said printed circuit board.

9. The apparatus of claim 5, wherein the processing of image signals generated by the wafer level camera for attempting to decode the bar code symbol is performed by a computer external to the housing.

10. The apparatus of claim 1, wherein the at least one light source is an LED.

11. The apparatus of claim 1, further comprising:

a light circuitry for controlling the operation of the light source, the light source electrically connected to the light circuitry, and the light circuitry disposed on said printed circuit board.

12. The apparatus of claim 1, further comprising:

an aimer light source positioned on the first integrated circuit chip, the apparatus being adapted to direct light from the aimer light source toward a field of view of the apparatus.

13. The apparatus of claim 12, wherein the aimer light source is an LED.

14. The apparatus of claim 1, further comprising:

an aimer subsystem and an aimer light circuitry for controlling the operation of an aimer light bank, the aimer light bank electrically connected to the aimer light circuitry, and the aimer light circuitry electrically connected to the first integrated circuit chip.

15. The apparatus of claim 1, further comprising:

a light source positioned on the first integrated circuit chip, the apparatus being adapted to direct light from the light source toward a field of view of the apparatus and an aimer light source positioned on the first integrated circuit chip, the apparatus being adapted to direct light from the aimer light source toward a field of view of the apparatus.