SYSTEMS AND METHODS FOR INTEGRATING BOOTSTRAP CIRCUIT ELEMENTS IN POWER TRANSISTORS AND OTHER DEVICES
First Claim
1. A semiconductor device comprising:
- a package; and
an integrated circuit arranged in the package and comprising at least one transistor device and a bootstrap circuit being coupled with one another, the bootstrap circuit comprising a semiconductor-based bootstrap capacitor device.
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Accused Products
Abstract
Embodiments relate to bootstrap circuits integrated with at least one other device, such as a power transistor or other semiconductor device. In embodiments, the bootstrap circuit can comprise a bootstrap capacitor and a bootstrap diode, or the bootstrap circuit can comprise a bootstrap capacitor and a bootstrap transistor. The bootstrap capacitor comprises a semiconductor-based capacitor, as opposed to an electrolytic, ceramic or other capacitor, in embodiments. The integration of the bootstrap circuit with another circuit or device, such as a power transistor device in one embodiment, is at a silicon-level in embodiments, rather than as a module-like system-in-package of conventional approaches. In other words, the combination of the bootstrap circuit elements and power transistor or other device forms a system-on-silicon, or an integrated circuit, in embodiments, and additionally can be arranged in a single package.
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Citations
19 Claims
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1. A semiconductor device comprising:
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a package; and an integrated circuit arranged in the package and comprising at least one transistor device and a bootstrap circuit being coupled with one another, the bootstrap circuit comprising a semiconductor-based bootstrap capacitor device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An integrated circuit comprising:
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a semiconductor power transistor; and a circuit comprising a semiconductor capacitor monolithically formed with the semiconductor power transistor. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. -26. (canceled)
Specification