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SEMICONDUCTOR COMPONENT ARRANGEMENT AND METHOD FOR PRODUCING THEREOF

  • US 20140167155A1
  • Filed: 12/19/2013
  • Published: 06/19/2014
  • Est. Priority Date: 07/03/2006
  • Status: Abandoned Application
First Claim
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1. A semiconductor component arrangement comprising at least one power semiconductor component and at least one logic component integrated in a semiconductor body having a first side, the logic component comprising:

  • a trench extending into the semiconductor body proceeding from the first side;

    at least one gate electrode arranged in the trench and insulated from the semiconductor body by a gate dielectric;

    a first source zone and a first drain zone of a first conduction type, which are formed in the semiconductor body in a manner adjacent to the gate dielectric and in a manner spaced apart from one another in a peripheral direction of the trench and between which a first body zone of a second conduction type is arranged; and

    at least a second source zone and at least a second drain zone that are separated from each other by a second body zone and formed along the trench..

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