Camera Module With Enhanced Heat Dissipation
First Claim
Patent Images
1. An imaging device with improved heat dissipation comprising:
- a lens module;
an image sensor mounted in line with said lens module, with said image sensor being mounted on a circuit substrate; and
a lens holder for supporting said lens module, wherein a rear end of said lens holder has an annular contact area;
wherein a heat transfer layer on said circuit substrate describes or segments of a heat transfer layer describe an annular area around said image sensor matching the shape of said annular contact area at said rear end of said lens holder, and heat generated at said image sensor is conducted to said lens holder through said heat transfer layer/segments of said heat transfer layer and said rear end of said lens holder.
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Abstract
The present invention describes embodiments of a camera module (100, 100a, 100b) with enhanced heat dissipation. Heat generated from an image sensor (40) is conducted through a circuit substrate (150), a lens holder (130) disposed on a front face of the circuit substrate (150), an overmolded cover (174, 176, 178) and a cable connection (190). Further heat is conducted away through support members (136) of the camera module. In addition, heat is convected from ribs (134) formed on an external surface of the lens holder (130).
64 Citations
21 Claims
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1. An imaging device with improved heat dissipation comprising:
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a lens module; an image sensor mounted in line with said lens module, with said image sensor being mounted on a circuit substrate; and a lens holder for supporting said lens module, wherein a rear end of said lens holder has an annular contact area; wherein a heat transfer layer on said circuit substrate describes or segments of a heat transfer layer describe an annular area around said image sensor matching the shape of said annular contact area at said rear end of said lens holder, and heat generated at said image sensor is conducted to said lens holder through said heat transfer layer/segments of said heat transfer layer and said rear end of said lens holder. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of enhancing heat dissipation in a camera module, said method comprises:
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mounting a lens holder to support a lens module, wherein said lens holder is made of a thermal conductive polymer or metal, and a rear end of the lens holder is in annular contact with a front face of a circuit substrate, with said front/rear orientation being defined in respect to said lens module; and conducting heat generated at an image sensor mounted on said circuit substrate to said rear end of said lens holder through a heat transfer layer formed on said circuit substrate. - View Dependent Claims (17, 18, 19, 20, 21)
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Specification