Integrated Microphone Package

• US 20140169607A1
• Filed: 06/20/2013
• Published: 06/19/2014
• Est. Priority Date: 12/17/2012
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Goida, Thomas M., Fiorillo, Jason P.
• Granted Patent: US 9,079,760 B2
• Time in Patent Office: Days
• US Class Current: 381/365
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/0027 Structures for transforming mechanical energy, e.g. potential energy of a spring into translation, sound into translation
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: H04R 1/021 incorporating only one transducer
• CPC Class Codes: H04R 1/083 Special constructions of mouthpieces
• CPC Class Codes: H04R 1/086 Protective screens, e.g. all weather or wind screens
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

An apparatus has a packaged microphone with a base and a lid that at least in part form an interior chamber containing a microphone die. The base has a bottom surface with an electrical interface and a base aperture. The apparatus also has a device housing having an internal surface, and a filter extending between the internal surface of the device housing, through an underlying substrate, and the bottom surface of the base.

Claims

1. An apparatus comprising:

a packaged microphone having a base and a lid that at least in part form an interior chamber containing a microphone die, the base having a bottom surface and a base aperture extending through the bottom surface;

a device housing having an internal surface;

a filter between the internal surface of the device housing and the bottom surface of the base; and

a substrate having a substrate opening, the filter extending through the substrate opening to contact both the internal surface of the device housing and the bottom surface of the base.

2. The apparatus as defined by claim 1 wherein the base aperture has a base aperture inner dimension, the substrate opening having a substrate opening inner dimension that is at least two times the size of package aperture inner dimension.

3. The apparatus as defined by claim 1 wherein the base has a top surface within the interior chamber, the base aperture extending from the top surface of the base to the bottom surface of the base, the microphone die being secured to the top surface of the base.

4. The apparatus as defined by claim 3 wherein the microphone die is secured to the base top surface to substantially cover the base aperture.

5. The apparatus as defined by claim 1 further comprising wherein the substrate comprises a flexible substrate, the filter at least in part structurally supporting the flexible substrate through the contact with the bottom surface of the base.

6. The apparatus as defined by claim 1 wherein the substrate has an electrical interconnect, the base having a base electrical interface that is a) in contact with the substrate and b) in electrical communication with the electrical interconnect.

7. The apparatus as defined by claim 6 wherein the electrical interface of the base is surface mounted to the substrate.

8. The apparatus as defined by claim 1 further comprising adhesive connecting the filter to the bottom surface of the base.

9. The apparatus as defined by claim 1 wherein the device housing forms a housing aperture, the filter forming an acoustic channel between the housing aperture and the base aperture.

10. The apparatus as defined by claim 1 wherein the filter forms a first portion and a second portion of the bottom surface of the base, the first portion being covered by the filter, the second portion being free of the filter, the apparatus further comprising a ground pad on the second portion of the bottom surface of the base.

11. An apparatus comprising:

a packaged microphone having a package with an interior chamber containing a MEMS microphone die, the package having a bottom surface and a package aperture extending through the bottom surface;

a device housing having an internal surface and a housing aperture; and

a substrate coupled with the packaged microphone,

the internal surface of the device housing contacting the bottom surface of the package.

12. The apparatus as defined by claim 11 further comprising a filter secured between the internal surface of the device housing and the bottom surface of the package.

13. The apparatus as defined by claim 12 wherein the filter is in a state of compression between the device housing and the package.

14. The apparatus as defined by claim 12 further comprising a substrate having electrical interconnects, the substrate having a substrate opening exposing at least a portion of the bottom surface of the package, the filter extending through the substrate opening to secure with both the internal surface of the device housing and the bottom surface of the package.

15. The apparatus as defined by claim 12 wherein the filter comprises a gasket.

16. The apparatus as defined by claim 12 wherein the filter forms a first portion and a second portion of the bottom surface of the package, the first portion being covered by the filter, the second portion being free of the filter, the apparatus further comprising a ground pad on the second portion of the bottom surface of the base.

17. The apparatus as defined by claim 11 wherein the package comprises a base coupled with a lid that at least in part forms the interior chamber.

18. A method of assembling a device, the method comprising:

providing a packaged microphone having a package with an interior chamber containing a microphone die, the package having a bottom surface and a package aperture extending through the bottom surface, the bottom surface having an electrical interface;

electrically connecting the electrical interface of the package with a substrate having a plurality of interconnects; and

mounting the substrate and packaged microphone relative to a device housing having an interior housing surface and a housing aperture, mounting comprising positioning a filter between the interior housing surface and the bottom surface of the package, the filter forming an acoustic channel between the package aperture and the housing aperture.

19. The method as defined by claim 18 wherein the substrate has a substrate opening, the filter extending through the substrate opening.

20. The method as defined by claim 18 wherein positioning a filter comprises directly contacting the filter to the bottom surface of the package.

21. The method as defined by claim 18 wherein the electrical interface of the package comprises a ground pad, the method electrically connecting the ground pad so that it is in direct contact with the substrate.