Heat-Sealing Cover Film For Packaging Electronic Components

• US 20140170414A1
• Filed: 09/01/2011
• Published: 06/19/2014
• Est. Priority Date: 09/01/2011
• Status: Abandoned Application

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Zhang, Wei Xiang, Shen, Shijun, Huang, Bing
• Application Number:
  US14/235,831
• Publication Number:
  US 20140170414A1
• Time in Patent Office: Days
• US Class Current: 428/336
• CPC Class Codes: B32B 2255/10 on synthetic resin layer or on natural or synthetic rubber layer
• CPC Class Codes: B32B 2255/26 Polymeric coating
• CPC Class Codes: B32B 2270/00 Resin or rubber layer containing a blend of at least two different polymers
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/21 Anti-static
• CPC Class Codes: B32B 2457/00 Electrical equipment
• CPC Class Codes: B32B 25/16 comprising polydienes homopolymers or poly-halodienes homopolymers B32B25/12 takes precedence
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/302 comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
• CPC Class Codes: B32B 27/306 comprising vinyl acetate or vinyl alcohol (co)polymers
• CPC Class Codes: B32B 27/32 comprising polyolefins comprising vinyl (co)polymers or acrylic (co)polymers B32B27/30
• CPC Class Codes: B32B 27/36 comprising polyesters
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: C09J 7/22 Plastics; Metallised plastics
• CPC Class Codes: C09J 7/29 Laminated material metallised plastics C09J7/22
• CPC Class Codes: C09J 7/35 Heat-activated
• CPC Class Codes: H05K 13/0084 Containers and magazines for components, e.g. tube-like magazines
• CPC Class Codes: Y10T 428/264 Up to 3 mils
• CPC Class Codes: Y10T 428/265 1 mil or less
• CPC Class Codes: Y10T 428/2826 Synthetic resin or polymer

Abstract

A cover film for heat-sealing to a carrier tape for carrying electronic components is described herein. The cover film comprises a polyester base layer, a first antistatic layer disposed on a first surface of the base layer, an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, the first intermediate layer disposed on a second surface of the base layer opposite the first antistatic layer, the second intermediate layer disposed on the first intermediate layer opposite the base layer, a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer, and a heat-sealing layer disposed on the second antistatic layer. In an exemplary aspect, the first intermediate layer comprises polyethylene and the second intermediate layer comprises a poly(vinyl acetate) copolymer and a polystyrene-butadiene) copolymer. In another exemplary aspect, the second antistatic layer comprises carbon nanotubes in a polyacrylate binder.

Claims

1. A cover film for heat-sealing to a carrier tape which has pockets for carrying electronic components, the cover film comprising:

a polyester base layer;

a first antistatic layer disposed on a first surface of the base layer;

an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, wherein the first intermediate layer is disposed on a second surface of the base layer opposite the first antistatic layer and comprises polyethylene and wherein the second intermediate layer is disposed on the first intermediate layer opposite the base layer and comprises a poly(vinyl acetate) copolymer and a poly(styrene-butadiene) copolymer;

a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer and comprising carbon nanotubes in a polyacrylate binder; and

a heat-sealing layer disposed on the second antistatic layer opposite the second intermediate layer.

2. The cover film of claim 1, wherein the first antistatic layer comprises an antistatic polymer or a conductive polymer.

3. The cover film as claimed in claim 2, wherein the conductive polymer is selected from the group consisting of polyacetylene, polypyrrole, polythiophene, polyaniline, polyether amide-based or polyester amide-based intrinsic antistatic polymers, or combinations thereof.

4. The cover film as claimed in claim 2, where the antistatic polymer is an acrylic polymer containing a tetravalent ammonium salt.

5. The cover film as claimed in claim 1, wherein the base layer has a thickness of about 10 μ

m to about 30 μ

m.

6. The cover film as claimed in claim 1, wherein the base layer has an optical transmittance not less than 85%, and a tensile strength not less than 50 MPa.

7. The cover film as claimed in claim 1, wherein in the vinyl acetate copolymer, the units derived from vinyl acetate at least comprise 10% by mole of the copolymer.

8. The cover film as claimed in claim 1, wherein the styrene-butadiene copolymer is a block copolymer.

9. The cover film as claimed in claim 1, wherein the vinyl acetate copolymer comprises 25-55% by weight of the total weight of the second intermediate layer.

10. The cover film as claimed in claim 1, wherein the styrene-butadiene copolymer comprises 45-75% by weight of the total weight of the second intermediate layer.

11. The cover film as claimed in claim 1, wherein the vinyl acetate copolymer is a copolymer of vinyl acetate and ethylene.

12. The cover film as claimed in claim 1, wherein the intermediate bi-layer structure has a thickness from about 30 μ

m to about 50 μ

m.

13. The cover film as claimed in claim 1, wherein the polyethylene of the first intermediate layer has a weight average molecular weight of 100,000-1,000,000.

14. The cover film as claimed in claim 1, wherein the polyethylene of the first intermediate layer has a melt index of 1-10 g/10 minutes.

15. The cover film as claimed in claim 1, wherein the first intermediate layer has a thickness of 20-30 μ

m.

16. The cover film as claimed in claim 1, wherein the heat-sealing layer has a thickness of 0.1 μ

m to

17. The cover film as claimed in claim 1, wherein the heat-sealing layer disposed over the second antistatic layer has a surface resistivity of 1×

10⁷ ohm/□

−

1×

10¹² ohm/□

.

18. The cover film as claimed in claim 1, wherein the heat seal layer has a glass transition temperature of 30°

C.-100°

C.

19. The cover film as claimed in claim 1, wherein the heat-sealing layer comprises a poly(methyl methacrylate/butyl methacrylate) copolymer.

20. The cover film as claimed in claim 19, wherein the poly(methyl methacrylate/butyl methacrylate) copolymer has a glass transition temperature of about 80°

C.

21. The cover film as claimed in claim 19, wherein the poly(methyl methacrylate/butyl methacrylate) copolymer comprises 60% methyl methacrylate units and 40% butyl methacrylate units.

22. The cover film as claimed in claim 1 further comprising a curable adhesive layer disposed between the first intermediate layer and the base layer.

23. The cover film as claimed in claim 1, wherein the first antistatic layer has a thickness of 0.01 μ

m to 0.1 μ

m.

24. The cover film as claimed in claim 1, wherein the first antistatic layer has a surface resistivity of 1×

10⁹ to 1×

10¹² ohm/□

.

25. The cover film as claimed in claim 1, wherein the cover film undergoes interfacial failure between the second antistatic layer and the second intermediate layer when it is separated from the carrier tape to which it has been heat sealed.

26. The cover film as claimed in claim 25, wherein the heat seal layer and the second antistatic layer transfer uniformly to the carrier tape when the cover film is separated from the carrier tape.