COOLING DEVICE AND SEMICONDUCTOR LASER DEVICE

• US 20140177662A1
• Filed: 12/19/2013
• Published: 06/26/2014
• Est. Priority Date: 12/26/2012
• Status: Active Grant

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Asano, Yoshiro
• Granted Patent: US 9,054,481 B2
• Time in Patent Office: Days
• US Class Current: 372/35
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01S 5/023 Mount members, e.g. sub-mount members
• CPC Class Codes: H01S 5/0233 Mounting configuration of laser chips
• CPC Class Codes: H01S 5/0235 Method for mounting laser chips
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/0612 controlled by temperature
• CPC Class Codes: H01S 5/4018 Lasers electrically in series
• CPC Class Codes: H01S 5/4087 emitting more than one wavelength

Abstract

There is provided a semiconductor laser device including a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated, a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed, and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.

Claims

1. A semiconductor laser device comprising:

a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated;

a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed; and

a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.

2. The semiconductor laser device according to claim 1,

wherein the member is a laser element array in which a plurality of semiconductor laser elements are arranged on a heat sink or a laser element array in which a plurality of semiconductor laser elements on sub-mounts are arranged on a heat sink.

3. The semiconductor laser device according to claim 1,

wherein the first region is a region which is divided into a plurality of regions,

wherein the second region is disposed between one region and another region of the first region, and

wherein the cooling medium channel is disposed to pass close to the one region and the another region.

4. The semiconductor laser device according to claim 1,

wherein a heat insulative space through which the cooling medium does not pass is disposed in the cooling jacket close to the second region.

5. The semiconductor laser device according to claim 1,

wherein the member of the first group and the member of the second group are distributed based on an individual difference of output laser light of the incorporated semiconductor laser elements, and

wherein the semiconductor laser element incorporated in the member disposed in the first region has a difference in wavelength or output level of the output laser light from the semiconductor laser element incorporated in the member disposed in the second region.

6. A cooling device comprising:

a cooling jacket having, on a surface of the cooling jacket, a first region and a second region in each of which a member in which a semiconductor laser element is incorporated is disposed; and

a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.

7. The cooling device according to claim 6,

wherein a heat insulative space through which the cooling medium does not pass is disposed in the cooling jacket close to the second region.