COOLING DEVICE AND SEMICONDUCTOR LASER DEVICE
First Claim
Patent Images
1. A semiconductor laser device comprising:
- a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated;
a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed; and
a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.
1 Assignment
0 Petitions
Accused Products
Abstract
There is provided a semiconductor laser device including a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated, a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed, and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes.
-
Citations
7 Claims
-
1. A semiconductor laser device comprising:
-
a plurality of members constituting a first group and a second group in each of which a semiconductor laser element is incorporated; a cooling jacket having, on a surface of the cooling jacket, a first region in which the member of the first group is disposed and a second region in which the member of the second group is disposed; and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A cooling device comprising:
-
a cooling jacket having, on a surface of the cooling jacket, a first region and a second region in each of which a member in which a semiconductor laser element is incorporated is disposed; and a cooling medium channel which is disposed in a portion close to the first region and separate from the second region inside the cooling jacket and through which a cooling medium passes. - View Dependent Claims (7)
-
Specification