METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION
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Abstract
A method for fabricating a semiconductor system starts with providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity. A second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces is provided. The second component is encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip. The polymeric housing of the second component is attached to the first chip using a layer of low thermal conductivity, whereby the un-encapsulated lead surfaces face away from the first chip. Bonding wires are connected to the un-encapsulated surfaces of the second component leads to the leads of the first component.
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Citations
14 Claims
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1-8. -8. (canceled)
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9. A method for fabricating a semiconductor system comprising:
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providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity; providing a second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces, the second component encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip; attaching the polymeric housing of the second component to the first chip using a layer of low thermal conductivity, whereby the unencapsulated lead surfaces face away from the first chip; and connecting with a plurality of bonding wires the un-encapsulated surfaces of the second component leads to the leads of the first component. - View Dependent Claims (10, 11, 12, 13, 14)
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Specification