METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

• US 20140179064A1
• Filed: 02/25/2014
• Published: 06/26/2014
• Est. Priority Date: 06/04/2012
• Status: Abandoned Application

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Romig, Matthew D., Milleron, Marie-Solange
• Application Number:
  US14/189,404
• Publication Number:
  US 20140179064A1
• Time in Patent Office: Days
• US Class Current: 438/118
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/291 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48655 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48664 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/48844 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48855 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/48864 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83424 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/83447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/85444 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85455 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/85464 Palladium (Pd) as principal constituent
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3135 : Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49548 : Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49568 : specifically adapted to facilitate heat dissipation
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/1431 : Logic devices
• CPC Class Codes: H01L 2924/1434 : Memory
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15747 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A method for fabricating a semiconductor system starts with providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity. A second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces is provided. The second component is encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip. The polymeric housing of the second component is attached to the first chip using a layer of low thermal conductivity, whereby the un-encapsulated lead surfaces face away from the first chip. Bonding wires are connected to the un-encapsulated surfaces of the second component leads to the leads of the first component.

Claims

1-8. -8. (canceled)

9. A method for fabricating a semiconductor system comprising:

providing a first component including a first semiconductor chip attached to a pad of a first metal leadframe made of a first metal sheet of high thermal conductivity;

providing a second component including a second semiconductor chip attached to a pad of a second metal leadframe made of a second metal sheet wire-bondable on both surfaces, the second component encapsulated in a polymeric housing leaving un-encapsulated the lead surfaces facing away from the second chip;

attaching the polymeric housing of the second component to the first chip using a layer of low thermal conductivity, whereby the unencapsulated lead surfaces face away from the first chip; and

connecting with a plurality of bonding wires the un-encapsulated surfaces of the second component leads to the leads of the first component.

10. The method of claim 9 further including, after connecting, connecting the first chip to leads of the first leadframe using bonding wires.

11. The method of claim 9 wherein the second component further includes bonding wires connecting the second chip to leadframe leads at the surface facing the second chip.

12. The method of claim 11 further including encapsulating the first component together with the attached second component in a polymeric molding compound, whereby both components are integrated into a packaged system.

13. The method of claim 9 wherein the first metal sheet of high thermal conductivity includes copper.

14. The method of claim 9 wherein the layer of low thermal conductivity is an adhesive polymeric compound free of metallic fillers.