Pressure-Sensing Intravascular Devices, Systems, and Methods

• US 20140180143A1
• Filed: 12/18/2013
• Published: 06/26/2014
• Est. Priority Date: 12/21/2012
• Status: Active Grant

• Current Assignee: Volcano Corporation (Koninklijke Philips N.V.)
• Original Assignee: Vulcano Corporation
• Inventors: Millett, Bret C., Burkett, David H., Corl, Paul Douglas
• Granted Patent: US 10,238,302 B2
• Time in Patent Office: Days
• US Class Current: 600/488
• CPC Class Codes: A61B 5/0066 Optical coherence imaging
• CPC Class Codes: A61B 5/0084 for introduction into the body, e.g. by catheters A61B5/1459 takes precedence
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/6851 Guide wires
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: A61B 8/445 Details of catheter construction
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

Intravascular devices, systems, and methods are disclosed. In some embodiments, the intravascular devices include at least one pressure sensing component within a distal portion of the device. In that regard, one or more electrical, electronic, optical, and/or electro-optical pressure-sensing components is secured to an elongated substrate such that the pressure-sensing component is mounted perpendicular to a central longitudinal axis of the device. In some implementations, the elongated substrate has a cylindrical profile. Methods of making, assembling, and/or using such intravascular devices and associated systems are also provided.

Claims

1. An intravascular sensor assembly comprising:

a flexible elongate member having a longitudinal axis (LA);

a core member disposed inside the flexible elongate member; and

an elongated substrate disposed distal to the core member and inside the flexible elongate member, the elongated substrate comprising;

at least one electrode disposed within at least one recess in an outer surface of the elongated substrate, the at least one recess extending in a longitudinal direction; and

a sensor circuit disposed on a distal surface of the elongated substrate, the sensor circuit coupled to the at least one electrode.

2. The intravascular sensor assembly of claim 1 wherein the sensor circuit is a pressure sensor circuit.

3. The intravascular sensor assembly of claim 1 wherein the at least one electrode comprises three electrodes configured to be coupled to three different terminals of the sensor circuit.

4. The intravascular sensor assembly of claim 1 wherein the flexible elongate member comprises at least one through hole at a distal end so as to expose the sensor circuit to an intravascular ambient.

5. The intravascular sensor assembly of claim 1 wherein the elongated substrate has a substantially cylindrical shape with the cylindrical axis along the LA.

6. The intravascular sensor assembly of claim 1 wherein the elongated substrate is made of a material selected from the group consisting of silicon, germanium, a silicon-germanium alloy, silica, quartz, sapphire, a ceramic material, a plastic material, and a combination thereof.

7. The intravascular sensor assembly of claim 1 further comprising a cable along the core element between a proximal portion and a distal portion of the flexible elongate member, the cable including at least one conductor electrically coupled to the at least one electrode on a proximal surface of the elongated substrate.

8. The intravascular sensor assembly of claim 1 wherein the sensor circuit comprises a micro-electromechanical system (MEMS).

9. The intravascular sensor assembly of claim 1 wherein the elongated substrate is bonded to the core member using an adhesive selected from the group consisting of urethane acrylate, cyanoacrylate, silicone, epoxy, and any combination thereof.

10. A sensor structure for use in an intravascular device assembly, the sensor structure comprising:

a substrate having an elongated shape with a length defined along a longitudinal axis (LA) and a width extending perpendicular to the longitudinal axis, the shape further comprising;

a proximal surface and an opposing distal surface, each extending substantially perpendicular to the LA; and

an outer surface extending substantially parallel to the LA between the proximal and distal surfaces;

at least one electrode disposed longitudinally within at least one recess in the outer surface of the substrate, and

a sensor circuit disposed on the distal surface, the sensor circuit having at least one lead coupled to the at least one electrode.

11. The sensor structure of claim 10 wherein the substrate is made of a material selected from the group consisting of silicon, germanium, a silicon-germanium alloy, quartz, glass, sapphire, a ceramic material, a plastic material, or a combination thereof.

12. The sensor structure of claim 10 wherein the at least one electrode extends from the distal surface to the proximal surface.

13. The sensor structure of claim 10 wherein the at least one electrode extends only partially from the distal surface towards the proximal surface, such that a proximal end of the at least one electrode is spaced distally from the proximal surface.

14. The sensor structure of claim 10 wherein the sensor circuit is bonded to the distal surface in a flip chip configuration.

15. A system for performing measurements using a sensor exposed to an intravascular environment, the system comprising:

an intravascular device having;

a flexible elongate member having a longitudinal axis (LA);

a core member disposed inside the flexible elongate member; and

an elongated substrate disposed distal to the core member and inside the flexible elongate member, the elongated substrate comprising;

at least one electrode disposed within at least one recess in an outer surface of the elongated substrate, the at least one recess extending in a longitudinal direction; and

a sensor circuit disposed on a distal surface of the elongated substrate, the sensor circuit coupled to the at least one electrode; and

a control console coupled to the intravascular device.

16. The system of claim 15 further comprising an interface device positioned between the control console and the intravascular device, wherein the interface device provides power to the sensor circuit and processes a signal from the sensor circuit.

17. The system of claim 16 wherein the interface device comprises an analog to digital converting circuit to provide a digital signal to the console.

18. The system of claim 15 wherein the sensor circuit is a pressure sensor and the control console outputs a graph of a blood pressure along a longitudinal axis in the intravascular environment.

19. The system of claim 15 wherein the elongated substrate has a substantially cylindrical shape with the cylindrical axis along the LA.

20. The system of claim 19 wherein the elongated substrate is bonded to the core member using an adhesive.

21. A method of forming a pressure-sensing guide wire, the method comprising:

forming an elongated substrate;

forming a plurality of recesses in an outer surface of the elongated substrate;

filling at least a portion of each of the recesses with a conductive material to form a plurality of electrodes;

placing a sensor circuit on a front surface of the elongated substrate, the front surface extending perpendicular to a longitudinal axis of the elongated substrate;

electrically coupling the plurality of electrode to terminals of the sensor circuit;

electrically coupling a plurality of conductors of a communication cable to the plurality of electrodes; and

securing the elongated substrate to a distal portion of a flexible elongate member.

22. The method of claim 21 wherein forming the elongated substrate comprises forming a substrate in a substantially cylindrical shape.

23. The method of claim 21 wherein forming the plurality of recesses in the outer surface of the elongated substrate comprises etching the substrate with a solvent.

24. The method of claim 21 wherein filling at least a portion of each of the recesses with a conductive material comprises sputtering the conductive material into the holes.

25. The method of claim 21 wherein filling at least a portion of each of the recesses with a conductive material comprises evaporating the conductive material into the holes.

26. The method of claim 21 further comprising forming the sensor circuit on a wafer substrate.

27. The method of claim 21 wherein placing the sensor circuit on a front surface of the elongated substrate comprises bonding the sensor circuit to the substrate with an adhesive.

28. The method of claim 21 wherein placing the sensor circuit on a front surface of the elongated substrate comprises bonding the sensor circuit using a flip chip procedure.

29. The method of claim 21 wherein electrically coupling the plurality of electrodes to terminals of the sensor circuit includes depositing a conductive material on a track coupling at least one electrode to at least one terminal.

30. The method of claim 21 wherein electrically coupling the plurality of electrodes to terminals of the sensor circuit includes:

depositing dopants into the semiconductor substrate material to form a conductive path within the substrate.

31. The method of claim 21 wherein securing the elongated substrate to the flexible elongate member comprises bonding a distal surface of a core member to a proximal surface in the elongated substrate using an adhesive.