SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EXPOSED ON THE OUTSIDE OF THE PACKAGE
First Claim
1. A packaged power device comprising:
- a semiconductor die having a frontside and a backside, wherein the semiconductor die comprises a plurality of sintered silver pads disposed on the frontside, and wherein the semiconductor die further comprises layer of silver that covers substantially all of the backside;
a first Direct Bonded Aluminum (DBA) substrate assembly comprising an aluminum island, wherein the first DBA substrate assembly further comprises a sintered silver pad disposed on the aluminum island, wherein the sintered silver pad of the first DBA substrate assembly is silver-to-silver bonded to the layer of silver on the backside of the semiconductor die;
a second DBA substrate assembly comprising a plurality of aluminum islands, wherein the second DBA substrate assembly further comprises a plurality of sintered silver pads disposed on the aluminum islands of the second DBA substrate assembly, wherein each sintered silver pad of the second DBA substrate assembly is silver-to-silver bonded to a corresponding one of the plurality of sintered silver pads on the frontside of the semiconductor die;
an amount of encapsulant that contacts both the first and the second DBA substrate assemblies so that the first and second DBA substrate assemblies and the amount of encapsulant together form a body portion of the packaged power device, wherein a surface of a ceramic substrate of the first DBA substrate assembly forms a first outside surface of the body portion, and wherein a surface of a ceramic substrate of the second DBA substrate assembly forms a second outside surface of the body portion;
a first plurality of stamped metal package terminals, wherein each of the first plurality of terminals is attached to the first DBA substrate assembly; and
a second plurality of stamped metal package terminals, wherein each of the second plurality of terminals is attached to the second DBA substrate assembly, wherein the first and second pluralities of stamped metal package terminals together form a single row of in-line stamped metal package terminals.
3 Assignments
0 Petitions
Accused Products
Abstract
A packaged power device involves no soft solder and no wire bonds. The direct-bonded metal layers of two direct metal bonded ceramic substrate assemblies, such as Direct Bonded Aluminum (DBA) substrates, are provided with sintered silver pads. Silver nanoparticle paste is applied to pads on the frontside of a die and the paste is sintered to form silver pads. Silver formed by an evaporative process covers the backside of the die. The die is pressed between the two DBAs such that direct silver-to-silver bonds are formed between sintered silver pads on the frontside of the die and corresponding sintered silver pads of one of the DBAs, and such that a direct silver-to-silver bond is formed between the backside silver of the die and a sintered silver pad of the other DBA. After leadforming, leadtrimming and encapsulation, the finished device has exposed ceramic of both DBAs on outside package surfaces.
17 Citations
20 Claims
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1. A packaged power device comprising:
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a semiconductor die having a frontside and a backside, wherein the semiconductor die comprises a plurality of sintered silver pads disposed on the frontside, and wherein the semiconductor die further comprises layer of silver that covers substantially all of the backside; a first Direct Bonded Aluminum (DBA) substrate assembly comprising an aluminum island, wherein the first DBA substrate assembly further comprises a sintered silver pad disposed on the aluminum island, wherein the sintered silver pad of the first DBA substrate assembly is silver-to-silver bonded to the layer of silver on the backside of the semiconductor die; a second DBA substrate assembly comprising a plurality of aluminum islands, wherein the second DBA substrate assembly further comprises a plurality of sintered silver pads disposed on the aluminum islands of the second DBA substrate assembly, wherein each sintered silver pad of the second DBA substrate assembly is silver-to-silver bonded to a corresponding one of the plurality of sintered silver pads on the frontside of the semiconductor die; an amount of encapsulant that contacts both the first and the second DBA substrate assemblies so that the first and second DBA substrate assemblies and the amount of encapsulant together form a body portion of the packaged power device, wherein a surface of a ceramic substrate of the first DBA substrate assembly forms a first outside surface of the body portion, and wherein a surface of a ceramic substrate of the second DBA substrate assembly forms a second outside surface of the body portion; a first plurality of stamped metal package terminals, wherein each of the first plurality of terminals is attached to the first DBA substrate assembly; and a second plurality of stamped metal package terminals, wherein each of the second plurality of terminals is attached to the second DBA substrate assembly, wherein the first and second pluralities of stamped metal package terminals together form a single row of in-line stamped metal package terminals. - View Dependent Claims (2, 3, 4, 5, 7, 8)
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6. A method, comprising:
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(a) attaching a sintered silver pad of a first Direct Metal Bonded (DMB) ceramic substrate assembly to a layer of silver that covers a backside of a semiconductor die such that a silver-to-silver bond is formed between the first DMB ceramic substrate and the die, wherein the die comprises the layer of silver on the backside of the die, and wherein the die further comprises a plurality of sintered silver pads on a frontside of the die; and (b) attaching a plurality of sintered silver pads of a second DMB ceramic substrate assembly to the plurality of sintered silver pads on the frontside of the semiconductor die such that a plurality of silver-to-silver bonds is formed between the second DMB ceramic substrate assembly and the die. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A packaged power device comprising:
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a semiconductor die having a frontside and a backside, wherein the semiconductor die comprises a plurality of sintered silver pads disposed on the frontside, and wherein the semiconductor die further comprises layer of silver that covers substantially all of the backside; a first direct metal bonded (DMB) substrate assembly comprising a metal island, wherein the first DMB substrate assembly further comprises a sintered silver pad disposed on the metal island, wherein the sintered silver pad of the first DMB substrate assembly is silver-to-silver bonded to the layer of silver on the backside of the semiconductor die; a second DMB substrate assembly comprising a plurality of metal islands, wherein the second DMB substrate assembly further comprises a plurality of sintered silver pads disposed on the metal islands of the second DMB substrate assembly, wherein each sintered silver pad of the second DMB substrate assembly is silver-to-silver bonded to a corresponding one of the plurality of sintered silver pads on the frontside of the semiconductor die; an amount of encapsulant that contacts both the first and the second DMB substrate assemblies so that the first and second DMB substrate assemblies and the amount of encapsulant together form a body portion of the packaged power device, wherein a surface of a ceramic substrate of the first DMBA substrate assembly forms a first outside surface of the body portion, and wherein a surface of a ceramic substrate of the second DMB substrate assembly forms a second outside surface of the body portion; and a plurality of metal package terminals, wherein each of the metal package terminals is attached to one of the first and second DMB substrate assemblies. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification