SENSOR PACKAGES HAVING SEMICONDUCTOR DIES OF DIFFERING SIZES

• US 20140183729A1
• Filed: 03/05/2014
• Published: 07/03/2014
• Est. Priority Date: 08/23/2012
• Status: Abandoned Application

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Bowles, Philip H.
• Application Number:
  US14/197,990
• Publication Number:
  US 20140183729A1
• Time in Patent Office: Days
• US Class Current: 257/737
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 2224/4824 Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/522 including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A sensor package comprises a composite structure in which the composite structure includes a first electronic component having first bond pads, the first electronic component exhibiting a first surface area. A mold material encapsulates the first electronic component to produce the composite structure, and the composite structure exhibits a second surface area that is greater than the first surface area. The sensor package further comprises a second electronic component having a top side and a bottom side opposing the top side. The top side includes second bond pads, and the bottom side is bonded to an outer surface of the composite structure to form a stacked structure. Electrical interconnects are attached between corresponding ones of the first bond pads and the second bond pads.

Claims

1. A package comprising:

a composite structure including;

a first electronic component having first bond pads, said first electronic component exhibiting a first surface area; and

a mold material encapsulating said first electronic component to produce said composite structure, said composite structure exhibiting a second surface area that is greater than said first surface area;

a second electronic component having a top side and a bottom side opposing said top side, said top side including second bond pads, said bottom side being bonded to an outer surface of said composite structure to form a stacked structure; and

electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads.

2. The package of claim 1 wherein said bottom side of said second electronic component exhibits a third surface area that is approximately equivalent to said second surface area of said composite structure.

3. The package of claim 1 wherein said first electronic component comprises a sensor structure having a sensor die and a cap, a first inner surface of said cap is coupled to a second inner surface of said sensor die, one of said cap and said sensor die includes a substrate portion with said first bond pads being located on a corresponding one of said first and second inner surfaces, a material section of the other one of said cap and sensor die being absent, and said electrical interconnects extend through a region where said material section is absent.

4. The package of claim 3 wherein said outer surface of said composite structure is an outer die surface of said sensor die, and said bottom side of said second electronic component is attached to said outer die surface to produce said stacked structure having said sensor die positioned between said cap and said second electronic component.

5. A The package of claim 4 wherein said cap includes said substrate portion with said first bond pads located on said first inner surface, and said first bond pads face in the same direction as said top side of said second electronic component.

6. The package of claim 3 wherein said outer surface of said composite structure is an outer cap surface of said cap, and said bottom side of said second electronic component is attached to said outer cap surface to produce said stacked structure having said cap positioned between said sensor die and said second electronic component.

7. The package of claim 6 wherein said sensor die includes said substrate portion with said first bond pads located on said second inner surface, and said first bond pads face in the same direction as said top side of said second electronic component.

8. The package of claim 1 further comprising a third electronic component located at said top side of said second electronic component.

9. The package of claim 1 wherein said second electronic component includes bump pads formed on said top side of said second electronic component, and said package further comprises conductive elements formed on and extending above said bump pads.

10. The package of claim 9 further comprising a packaging material located over said top side of said second electronic component wherein each of said conductive elements has a top surface that is exposed from said packaging material.

11. The package of claim 1 further comprising a packaging material located over said top side of said second electronic component and encapsulating said electrical interconnects.

12. A package comprising:

a composite structure including;

a first electronic component having first bond pads, said first electronic component exhibiting a first surface area, wherein said first electronic component comprises a sensor structure having a sensor die and a cap, a first inner surface of said cap is coupled to a second inner surface of said sensor die, one of said cap and said sensor die includes a substrate portion with said first bond pads being located on a corresponding one of said first and second inner surfaces, a material section of the other one of said cap and sensor die being absent; and

a mold material encapsulating said first electronic component to produce said composite structure, said composite structure exhibiting a second surface area that is greater than said first surface area;

a second electronic component having a top side and a bottom side opposing said top side, said top side including second bond pads, said bottom side being bonded to an outer surface of said composite structure to form a stacked structure, wherein said bottom side of said second electronic component exhibits a third surface area that is approximately equivalent to said second surface area of said composite structure; and

electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads, said electrical interconnects extending through a region where said material section is absent.

13. The package of claim 12 wherein said outer surface of said composite structure is an outer die surface of said sensor die, and said bottom side of said second electronic component is attached to said outer die surface to produce said stacked structure having said sensor die positioned between said cap and said second electronic component.

14. A The package of claim 13 wherein said cap includes said substrate portion with said first bond pads located on said first inner surface, and said first bond pads face in the same direction as said top side of said second electronic component.

15. The package of claim 12 wherein said outer surface of said composite structure is an outer cap surface of said cap, and said bottom side of said second electronic component is attached to said outer cap surface to produce said stacked structure having said cap positioned between said sensor die and said second electronic component.

16. The package of claim 15 wherein said sensor die includes said substrate portion with said first bond pads located on said second inner surface, and said first bond pads face in the same direction as said top side of said second electronic component.

17. A package comprising:

a composite structure including;

a first electronic component having first bond pads, said first electronic component exhibiting a first surface area; and

a mold material encapsulating said first electronic component to produce said composite structure, said composite structure exhibiting a second surface area that is greater than said first surface area;

a second electronic component having a top side and a bottom side opposing said top side, said top side including second bond pads, said bottom side being bonded to an outer surface of said composite structure to form a stacked structure, wherein said bottom side of said second electronic component exhibits a third surface area that is approximately equivalent to said second surface area of said composite structure;

electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads; and

a packaging material located over said top side of said second electronic component and encapsulating said electrical interconnects.

18. The package of claim 17 wherein said first electronic component comprises a sensor structure having a sensor die and a cap, a first inner surface of said cap is coupled to a second inner surface of said sensor die, one of said cap and said sensor die includes a substrate portion with said first bond pads being located on a corresponding one of said first and second inner surfaces, a material section of the other one of said cap and sensor die being absent, and said electrical interconnects extend through a region where said material section is absent.

19. The package of claim 17 wherein said second electronic component includes bump pads formed on said top side of said second electronic component, and said package further comprises conductive elements formed on and extending above said bump pads.

20. The package of claim 19 wherein each of said conductive elements has a top surface that is exposed from said packaging material.