METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDUCTOR DEVICE USING THE SAME

• US 20140183733A1
• Filed: 11/18/2013
• Published: 07/03/2014
• Est. Priority Date: 01/03/2013
• Status: Active Grant

• Current Assignee: DUKSAN Hi-Metal Co., Ltd.
• Original Assignee: DUKSAN Hi-Metal Co., Ltd.
• Inventors: CHU, Yong Cheol, LEE, Hyun Kyu, KWAK, Jung Ug, LEE, Seung Jin, JEON, Sang Ho, CHOI, Yong Sik
• Granted Patent: US 10,661,394 B2
• Time in Patent Office: Days
• US Class Current: 257/738
• CPC Class Codes: B23K 2101/36 Electric or electronic devices
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/282 Zn as the principal constituent
• CPC Class Codes: B23K 35/286 Al as the principal constituent
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/3006 Ag as the principal constituent
• CPC Class Codes: B23K 35/3013 Au as the principal constituent
• CPC Class Codes: B23K 35/302 Cu as the principal constituent
• CPC Class Codes: B23K 35/3033 Ni as the principal constituent
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13561 On the entire surface of the core, i.e. integral coating
• CPC Class Codes: H01L 2224/13582 Two-layer coating
• CPC Class Codes: H01L 2224/13611 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/16 : of an individual bump connector
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/3656 : Formation of Kirkendall voids
• CPC Class Codes: H05K 2201/0218 : Composite particles, i.e. first metal coated with second metal
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 3/3478 : Applying solder preforms; Transferring prefabricated solder patterns

Abstract

Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Claims

1. A metal core solder ball, comprising:

a metal core having a diameter of 40˜

600 μ

m;

a first plating layer formed on an outer surface of the metal core; and

a second plating layer formed on an outer surface of the first plating layer, and

satisfying the following Relation 1;

⅙

a<

aA+bB+cC<

⅔

a 

 

[Relation 1]

wherein a is heat conductivity of the metal core, b is heat conductivity of the first plating layer, c is heat conductivity of the second plating layer, A, B and C are volume ratios of the metal core, the first plating layer and the second plating layer, respectively, in the solder ball, A+B+C=1, 0.0005<

B<

0.05, 0.7<

C<

0.94, and A, B and C each are a real number between 0 and 1 in the entire solder ball.

2. The metal core solder ball of claim 1, wherein the metal core comprises a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au) and aluminum (Al).

3. The metal core solder ball of claim 1, wherein the first plating layer is formed by subjecting nickel (Ni) or a Ni alloy to electroless plating.

4. The metal core solder ball of claim 1, wherein the second plating layer is formed by electroplating a tin (Sn) alloy.

5. A heat dissipation structure for a semiconductor device, comprising the metal core solder ball of claim 1.

6. The heat dissipation structure of claim 5, which is configured such that the metal core solder ball is provided to connect a connection terminal of the semiconductor device and an electrode of a substrate.

7. The heat dissipation structure of claim 6, wherein a bonding portion which connects the solder ball to the electrode contains brass powder or silver powder.

8. An electronic device, comprising:

a connection terminal of a semiconductor device;

an electrode of a substrate disposed to face the connection terminal; and

a solder ball which thermally and electrically connects the connection terminal and the electrode of the substrate and satisfies the following Relation 1;

⅙

a<

aA+bB+cC<

⅔

a 

 

[Relation 1]

wherein a is heat conductivity of a metal core, b is heat conductivity of a first plating layer, c is heat conductivity of a second plating layer, A, B and C are volume ratios of the metal core, the first plating layer and the second plating layer, respectively, in the solder ball, A+B+C=1, 0.0005<

B<

0.05, 0.7<

C<

0.94, and A, B and C each are a real number between 0 and 1 in the entire solder ball.

9. The electronic device of claim 8, comprising a bonding portion formed of brass powder or silver powder between the electrode of the substrate and the solder ball.